In This Article
The Role of COM Express and COM-HPC Modules in Next-Generation Defence Systems
Modern defence platforms demand compact, scalable and mission-ready computing power capable of handling AI workloads, sensor fusion, real-time analytics and next-generation communication systems. As military operations depend more heavily on autonomous vehicles, advanced avionics, radar processing and digital command infrastructure, COM Express (COMe) and COM-HPC modules have become essential building blocks in today’s defence technology ecosystem.
These modular compute solutions offer long lifecycle availability, rugged reliability, and exceptional performance density—making them ideal for land, sea and air defence applications. When paired with custom carrier boards, specialised enclosures and advanced cooling, they enable high-performance embedded systems tailored for harsh military environments.
Why COM Modules Are Critical for Defence Technology
Scalable Computing for Diverse Mission Profiles
COM Express and COM-HPC modules support a wide range of CPU architectures – from low-power Atom and ARM processors to high-performance Intel Core, Xeon and AMD Ryzen Embedded. This scalable performance supports many mission-critical workloads, including AI inference, radar signal processing, secure communication links, electronic warfare and onboard mission computers.
Because the compute module is separate from the carrier board, upgrades can be performed without redesigning the entire system—ideal for long-term defence programs that must stay technologically relevant for 10–20 years.
Built for Harsh Military Environments
COM modules are rugged by design. Their compact footprints and robust construction allow deployment in environments with extreme temperatures, shock, vibration and electromagnetic interference. They can be found in:
- Armoured vehicle computers
- UAV/UGV/USV mission systems
- Naval communication and control systems
- Rugged soldier-borne and handheld electronics
- Ground stations and mobile command units
When integrated with rugged carrier boards, sealed chassis and military-grade cooling systems, they form the backbone of reliable embedded computing in the field.
High-Bandwidth and Future-Ready Interfaces
COM-HPC raises performance to an entirely new level with high-speed capabilities such as PCIe Gen4/5, high-bandwidth memory support, multiple 10 to 100GbE ports and advanced peripheral connectivity. These features enable:
- AI acceleration and GPU attachment
- Wideband signal processing for EW/SIGINT
- High-resolution sensor and radar streaming
- Low-latency battlefield networking
- Real-time situational awareness systems
Overview of COM Module Form Factors
COM modules come in a range of standardised sizes and interface types, each suited to different performance levels and military deployment scenarios. From ultra-compact, low-power modules ideal for handheld soldier systems to high-performance COM-HPC designs for AI workloads and mission computers, choosing the right form factor is essential for system integration, lifecycle management and environmental resilience.
Below is a quick reference table outlining the most widely used COM standards and their physical sizes:
Common COM Module Types and Sizes
| Module Type | Form Factor / Variant | Dimensions (mm) | Typical Use Cases |
|---|---|---|---|
| COM Express Mini | Type 10 | 84 × 55 | Ultra-compact devices, handheld military systems, mobile controllers |
| COM Express Compact | Type 6 | 95 × 95 | Mid-range defence computers, small UAV/UGV systems, portable equipment |
| COM Express Basic | Type 6 / Type 7 | 125 × 95 | Vehicle computers, radar processing, command-and-control systems |
| COM Express Extended | Type 6 | 155 × 110 | Harsh environments, extended-temp systems, rugged mission computers |
| COM-HPC Size A | Client | 95 × 120 | Advanced portable systems, edge AI, ruggedised field units |
| COM-HPC Size B | Client | 120 × 120 | High-performance edge compute, multi-sensor fusion, situational awareness |
| COM-HPC Size C | Server | 160 × 160 | Server-class performance, EW/SIGINT, AI acceleration, tactical data centres |
Key Defence Applications of COM Express and COM-HPC
Autonomous and Unmanned Platforms
UAVs, autonomous ground vehicles and uncrewed surface vessels rely on COM modules for tasks such as navigation, sensor fusion, obstacle avoidance and AI-driven decision-making. The modular design enables lightweight, power-efficient and rugged implementations.
C4ISR and Tactical Communications
COMe and COM-HPC modules deliver the processing power needed for secure radio systems, encrypted data links, real-time intelligence gathering and battlefield networking. Their long lifecycle support is vital for C4ISR deployments.
Signal Intelligence and Electronic Warfare
Electronic warfare platforms depend on extremely high-speed data movement. COM-HPC’s PCIe lanes and bandwidth make it ideal for EW systems involving signal capture, jamming, decryption and rapid threat analysis.
Military Avionics and Naval Systems
From mission computers and flight displays to sonar processing and guided navigation, COM modules provide the high-performance, compact and reliable computing needed for air and naval platforms.
How BVM Supports Defence Manufacturers with COMe and COM-HPC
Please note: images are for illustration purposes only and are representative of the types of computing systems BVM develops for defence applications. All our defence projects are protected under strict non-disclosure agreements meaning we cannot disclose specific details, applications, or deployment information.
Custom Carrier Board Design
BVM designs and manufactures bespoke carrier boards supporting high-speed interfaces, GPU or FPGA integration, RF connectivity and MIL-compliant power delivery. These boards are engineered specifically for defence-grade environments.
Custom Enclosures and Mechanical Design
We develop rugged chassis and housings built for harsh land, sea and air environments. Options include EMC shielding, conduction-cooled designs, environmental sealing and MIL-STD mounting.
Advanced Cooling Solutions
Military-grade embedded systems often generate significant heat. BVM provides engineered thermal solutions such as conduction plates, heat-pipes, vapour chamber cooling and ruggedised high-airflow chassis.
Over 35 Years of Embedded Expertise
With decades of experience delivering industrial and defence-grade systems, BVM offers reliable, long-life supply and complete engineering support across the entire product lifecycle.
Contact BVM for Next-Generation Defence Computing Solutions
Contact us (BVM) for all your Industrial and Embedded Computing needs. You can contact our sales team on 01489 780144 or email sales@bvmltd.co.uk. We have over 35 years’ experience supplying, designing and manufacturing Industrial and Embedded Computer hardware.
“Partner with BVM for secure, scalable and future-ready embedded defence solutions.”
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BVM supply a wide and diverse range of Industrial and Embedded Systems. From Industrial Motherboards, SBCs and Box PCs, to Rack Mount computers and Industrial Panel PCs. If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
You can call us on +(0) 1489 780 144, E-mail us at sales@bvmltd.co.uk or Use our contact form here