Industrial and Embedded Products

Showing 1–48 of 140 results

  • MTH968 1

    DFI MTH968 Intel Meteor Lake U/H COM Express Compact

    • DFI MTH968 Intel Meteor Lake U/H COM Express Compact
    • Intel Core Ultra Processor (Meteor Lake: U/H-series)
    • Dual Channel DDR5 5600MHz SODIMM up to 64GB
    • Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI
    • Supports 4K / 2K resolution
    • Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, 1 SMBus
    • Rich I/O: 1 Intel 2.5GbE, 2 USB 4.0, 4 USB 3.2, 8 USB 2.0, 2 SATA 3.0

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  • RBT970 1

    DFI RBT970 AMD Ryzen Embedded V3000 COM Express Basic

    • DFI RBT970 AMD Ryzen Embedded V3000 COM Express Basic
    • AMD Ryzen Embedded V3000 Series processors
    • Dual DDR5 SODIMM 4800MHz up to 64GB
    • Support extended operating temperature: -40 to 85°C
    • Support 2 x 10G Ethernet and 1 x 2.5G Ethernet
    • Multiple Expansion: 1 PCIe x14 (Gen 4), 1 SMBus, 1 I2C, 1 LPC, UART
    • Rich I/O: 4 USB 3.2, 4 USB 2.0, 2 SATA 3.0

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  • RPP968 1

    DFI RPP968 Intel Raptor Lake COM Express Compact

    • DFI RPP968 Intel Raptor Lake COM Express Compact
    • Intel Core Processor Raptor Lake Series
    • DDR5 4800MHz SODIMM up to 64GB
    • 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++)
    • Multiple expansions: 2 PCIe x4 (Gen4 PCH), 5 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 38 (Based on Intel IOTG Roadmap)

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  • RPS9HC 1

    DFI RPS9HC Intel Raptor Lake S COM-HPC

    • DFI RPS9HC Intel Raptor Lake S COM-HPC
    • 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
    • 4 DDR5 SODIMM 3600MHz up to 128GB
    • Quad Displays: eDP + 3 DDI
    • DDI supports up to 8K
    • Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
    • Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0
    • Typically supports 10-Year CPU Life Cycle Until Q1’ 38

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  • RPP051 1

    DFI RPP051 13th Gen Raptor Lake 2.5″ Pico-ITX SBC

    • DFI RPP051 13th Gen 2.5″ Pico-ITX SBC
    • Small form factor 2.5″ Pico-ITX for space-limited applications
    • 13th Generation Intel Core Processors
    • 1 DDR5 4800MHz SODIMM up to 32GB
    • Supports 4K/2K resolution
    • Dual Independent Displays: DP++ + eDP
    • Multiple Expansion: 1 M.2 E key, 2 M.2 B key
    • Rich I/O: 1 Intel 2.5G LAN, 1 COM, 2 USB 3.1 Gen 2, 2 USB 2.0

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  • KS AL

    DFI KSM-KH Series 15″ – 22″ Modular Rugged Industrial Panel PC Series

    • DFI KSM-KH Series 15″ – 22″ Modular Rugged Industrial Panel PC Series
    • Support Adaptive Display Platform
    • Supports 9~36V Power Input
    • Intel® Core™ Processor with Fanless Design
    • Multiple Panel Sizes with Resistive/P-Capacitive Touch Screen
    • IP65 Front Panel Protection
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • PCSF51 1

    DFI PCSF51-R2312 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • DFI PCSF51-R2312 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit
    • AMD Ryzen™ Embedded R2000 Series – Picasso
    • Small form factor 1.8″ SBC for space-limited applications
    • Single Channel DDR4 Memory Down up to 4GB/8GB
    • HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz
    • Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB
    • 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)

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  • PCSF51 1

    DFI PCSF51-R2314 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • DFI PCSF51-R2314 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit
    • AMD Ryzen™ Embedded R2000 Series – Picasso
    • Small form factor 1.8″ SBC for space-limited applications
    • Single Channel DDR4 Memory Down up to 4GB/8GB
    • HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz
    • Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB
    • 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)

    Compare
  • PCSF51 1

    DFI PCSF51-R2514 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • DFI PCSF51-R2514 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit
    • AMD Ryzen™ Embedded R2000 Series – Picasso
    • Small form factor 1.8″ SBC for space-limited applications
    • Single Channel DDR4 Memory Down up to 4GB/8GB
    • HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz
    • Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB
    • 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)

    Compare
  • ADP253 1

    DFI ADP253 12th Gen Alder Lake-P 4″ SBC

    • DFI ADP253 12th Gen Alder Lake-P 4″ SBC
    • 12th Gen Intel Core Processors
    • On board memory and 1 DDR4 SO-DIMM
    • Multiple Displays: 1 HDMI, 1 VGA/DP, 2 Type-C Alt. Mode
    • Supports 4K/2K resolution
    • Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 6 COM, 4 USB 3.2, 2 USB 2.0, 1 SATA 3.0

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  • IDP070 MS

    DFI IDP070-MS 7″ Long Distance HDBaseT Industrial Touch Monitor

    • DFI IDP070-MS 7″ Industrial Touch Monitor
    • Projected Capacitive Multi-touch or Resistive Touch
    • IP Rating: IP65 Front Panel
    • Support 3 Signal Interfaces: VGA/DVI/HDMI
    • Support Modular Extended Display: 1 x HDBaseT / 2 x HDBaseT / Wifi Display
    • Various Mounting Type: VESA Mount 75 / Panel Mount
    • Advanced Voltage: Support USB Type C (Optional)

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  • IDP156 MS

    DFI IDP156-MS 15.6″ Long Distance HDBaseT Industrial Touch Monitor

    • DFI IDP156-MS 15.6″ Industrial Touch Monitor
    • Projected Capacitive Multi-touch or Resistive Touch
    • IP Rating: IP65 Front Panel
    • Support 3 Signal Interfaces: VGA/DVI/HDMI
    • Support Modular Extended Display: 1 x HDBaseT / 2 x HDBaseT / Wifi Display
    • Various Mounting Type: VESA Mount 75 / Panel Mount
    • Advanced Voltage: Support USB Type C

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  • M8MP553 1

    DFI M8MP553 NXP i.MX 8M 3.5″ SBC

    • DFI M8MP553 NXP i.MX 8M 3.5″ SBC
    • NXP i.MX8M plus Processors: 30% performance enhancement
    • Wide Voltage Support 9~36VDC
    • 2 GbE LAN for automation application
    • CANbus for automation equipment integration
    • M.2 2230/3052: 1 M.2 B key for PCIe
    • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)

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  • VC900 M8M 1 1

    DFI VC900-M8M NXP i.MX 8M In-Vehicle PC

    • DFI VC900-M8M NXP i.MX 8M In-Vehicle PC
    • ARM-Based In-vehicle system
    • NXP i.MX8 series
    • 16GB/64GB eMMC and micro SD card slot
    • Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
    • Wide voltage: 9~36V vehicle power input with ACC/IGN function
    • Wide temperature: -20°C~65°C operation without active fan

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  • EC500 ADS 1

    DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System

    • DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System
    • 12th Generation Intel Core with Intel H610E/Q670E/R680E
    • Supports DDR4 SODIMM up to 64GB
    • Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
    • Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0
    • Multiple Expansion: 3 M.2 slots
    • Support 5G Communication
    • Operating Temperature: -20 to 70°C
    • 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)

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  • VP070 M8M 1

    DFI VP070-M8M NXP i.MX 8M In-Vehicle Panel PC

    • DFI VP070-M8M NXP i.MX 8M In-Vehicle Panel PC
    • ARM-Based In-vehicle System
    • NXP i.MX 8M Dual/Quad Cortex
    • IP65 Front Panel Protection
    • Rich I/O: 1 GbE, 2 COM, 1 CAN Bus, 2 USB 3.1 Gen1, 1 HDMI
    • Application Focus: In-Vehicle Driver HMI
    • Smart Power Ignition Control: Power delay and protection time setting

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  • EHL700

    DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven

    • DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven
    • 4GB/8GB LPDDR4 Single Channel Memory Down
    • 1 DDI*, 1 LVDS*/eDP
    • DP++ resolution supports up to 4096×2160 @ 60Hz
    • Multiple expansions: 4 PCIe x1
    • Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)

    Compare
  • TGH960

    DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

    • DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module
    • 11th Generation Intel® Processor COM Express® Basic
    • DDR4 3200MHz SODIMM up to 128GB
    • VGA + LVDS*/eDP + 3 DDI
    • DP++ supports 4K resolution
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)

    Compare
  • ADS101 ADS103 1

    DFI ADS101/ADS103 12th Gen Alder Lake-S Mini-ITX Motherboard

    • DFI ADS101/ADS103 12th Gen Alder Lake-S Mini-ITX Motherboard
    • 12th Generation Intel® Core™ Processors
    • 2 DDR4 3200MHz SODIMM up to 64GB
    • Quad Displays: 1 DP++, 1 DP++/HDMI, 1 LVDS/eDP, 1 DFI display extension port (DP/HDMI/VGA available)
    • Supports up to 4K/2K resolution
    • Multiple expansion: 1 PCIe x16 gen 5, 1 M.2 E Key (USB/PCIe), 1 M.2 M Key (PCIe/SATA), 1 M.2 B Key (PCIe/SATA/USB)
    • Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 2 COM, up to 6 USB 3.2 Gen2, 2 USB 3.2 Gen1, 4 USB 2.0, 2 SATA 3.0
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

    Compare
  • ADS310 R680E Q670E Micro ATX 1

    DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard

    • DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard
    • 12th Gen Intel® Core™ with Intel® R680E/Q670E chipset
    • 4 DDR4 UDIMM up to 128GB
    • Supports 4 independent displays: VGA, 2 DP++, HDMI 2.0a
    • Supports 8K/4K resolution
    • Multiple expansion: 1 PCIe x16 gen 5, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
    • Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

    Compare
  • ADS630 R680E Q670E ATX 1

    DFI ADS630-R680E/Q670E 12th Gen Alder Lake-S ATX Motherboard

    • DFI ADS630-R680E/Q670E 12th Gen Alder Lake-S ATX Motherboard
    • 12th Gen Intel® Core Processors
    • 4 DDR4 UDIMM up to 128GB
    • Quad Displays: VGA + 2 x DP++ + HDMI
    • Supports 4K resolution
    • Multiple Expansion: 1 PCIe x16(Gen 5), 4 PCIe x4(Gen 4), 2 PCI, 2 M.2 M key, 1 M.2 E Key
    • Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 4 USB 3.2 Gen1, 3 USB 2.0

    Compare
  • KS070 M8M 1

    DFI KS070-M8M NXP i.MX 8M 7″ IP65 Panel PC

    • DFI KS070-M8M NXP i.MX 8M 7″ IP65 Panel PC
    • NXP i.MX8M Platform
    • 2GB/4GB SDRAM Memory
    • 7″ 1024×600 TFT LCD Panel with capacitive touch screen
    • Multiple Expansion: M.2 2230/3042 support
    IP65 front panel protection

    Compare
  • M8M KIT Series 1

    DFI M8M_KIT_Series NXP i.MX 8M Panel PC Kit

    • DFI M8M_KIT_Series NXP i.MX 8M Panel PC Kit
    • NXP i.MX 8M Processor
    • Open Frame Designed Panel PC
    • Touch Screen: P-Capacitive Touch supports 10 points
    • LPDDR4-3200 2GB plus 16GB eMMC on board
    • Multiple Expansion: M.2 2230 E Key and 3042/2242 B Key
    • Easy Integration: Easy installation and maintenance
    • ARM-Based System: Support Android 9.0 and Linux

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  • EHL556 1

    DFI EHL556 Elkhart Lake Atom X Series 3.5″ SBC

    • DFI EHL556 Elkhart Lake Atom X Series 3.5″ SBC
    • Intel Atom X Series Processor 3.5″ SBC
    • 1 DDR4-3200 SODIMM up to 32GB
    • 4K High Resolution: Supports 4K/ 2K resolution
    • Triple Independent Displays: 1 VGA, 1 DP++, 1 LVDS/eDP
    • Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
    • Rich I/O: 2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0
    • 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)

    Compare
  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System
    • Intel Atom Processors X Series Fanless Embedded System
    • Support 5G Sub-6 module
    • Support WiFi 6 module
    • 4 LAN: Support 1 x 2.5GbE TSN , 3 x GbE LAN
    • Wide Operating Temperature: Support up to -40 ~ 70°C
    • Support Isolated COM & DIO
    • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)

    Compare
  • EHL173F201125 R1 w600

    DFI EHL171/EHL173 Intel Elkhart Lake Wide Temp Mini-ITX

    • DFI EHL171/EHL173 Intel Elkhart Lake Wide Temp Mini-ITX – Elkhart Lake Motherboard
    • Intel Atom® Processor x6000 Series
    • 2 DDR4 SODIMM up to 32GB
    • 3 Independent Displays: 1 DP++/VGA, 1 HDMI/ DP++, 1 eDP/LVDS
    • Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key, 1 PCIe x4 (x2 signal)
    • Rich I/O: 2 x 2.5GbE, 2 USB 3.1 Gen2, 2 USB 3.1 Gen1, 6 COM, up to 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)

    Compare
  • EHL9A2 Top w600

    DFI EHL9A2 Intel Elkhart Lake COM Express Mini

    • DFI EHL9A2 Intel Elkhart Lake COM Express Mini – COM Express Type 10
    • Intel® Atom® Processor Elkhart Lake Series
    • Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
    • 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP
    • Multiple expansions: 4 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)

    Compare
  • CMS101 103 W480F210831 R1 w600

    DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX

    • DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX
    • 10th Generation Intel® Core™ Processors
    • 2 DDR4 2933MHz SODIMM up to 64GB
    • Multiple Displays: 2 x DP++, 1 LVDS/eDP
    • Supports up to 4K/2K resolution
    • Multiple Expansions: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

    Compare
  • CS100 Q370M190702RAw600

    DFI CS100 9th/8th Gen Intel iCore Mini-ITX

    • DFI CS100 9th/8th Gen Intel iCore Mini-ITX
    • 9th/8th Gen Intel® Core™ with Intel® Q370/C246/H310
    • 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Three independent display: LVDS+VGA+DP++, LVDS+DP++ +DP++, VGA+ DP++ +DP++
    • Multiple Expansions: 1 PCIe x16 (Gen 3), 1 Full-size Mini PCIe (Q370/C246); 1 PCIe x16 (Gen 3), 1 mSATA (H310)
    • Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.1 Gen 2, 2 USB 3.1 Gen 1, 4 USB 2.0 (Q370/C246); 2 Intel GbE, 2 COM, 4 USB 3.1 Gen 1, 4 USB 2.0 (H310)
    • 15-Year CPU Life Cycle Support Until Q2′ 33 (Based on Intel IOTG Roadmap)

    Compare
  • CS170 H310 Front200421 R1 w600

    DFI CS170-H310 9th/8th Gen Intel iCore Wide Temp Mini-ITX

    • DFI CS170-H310 9th/8th Gen Intel iCore Wide Temp Mini-ITX
    • 8th/9th Generation Intel® Core™ Processors
    • 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Dual independent display: LVDS + VGA, LVDS + DP++, VGA + DP++, DP++ + DP++
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple Expansions: 1 PCIe x16 Gen 3, 1 M.2 2230 E Key, 1 M.2 2280 M Key
    • Storage: 2 SATA 3.0
    • Rich I/O: 2 Intel GbE, 2 COM, 4 USB 3.1 Gen 1, 2 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap)

    Compare
  • CS170 H310 Front200421 R1 w600

    DFI CS170-Q370/C246 9th/8th Gen Intel iCore Wide Temp Mini-ITX

    • DFI CS170-Q370/C246 9th/8th Gen Intel iCore Wide Temp Mini-ITX
    • 8th/9th Generation Intel® Core™ Processors
    • 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Three independent display: LVDS + VGA + DP++, LVDS + DP++ + DP++, VGA + DP++ + DP++
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple Expansions: 1 PCIe x16 Gen 3, 1 M.2 2230 E Key, 1 M.2 2280 M Key
    • Storage: 2 SATA 3.0
    • Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.1 Gen 2, 4 USB 3.1 Gen 1
    • 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap)

    Compare
  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • DFI EC70A-TGU Tiger Lake Fanless Embedded System
    • 11th Gen Intel Core i7/i5/i3 Processors
    • On board memory 8GB and 1 SO-DIMM DDR4
    • Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
    • Support M.2 B key 3042/3052 5G-NR module
    • Up to 4 LAN or 6 USB
    • 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)

    Compare
  • GH171F070621 R1w600

    DFI GH171 AMD Ryzen V1000/R1000 Mini-ITX

    • DFI GH171 AMD Ryzen V1000/R1000 Mini-ITX
    • 2 DDR4 3200MHz SODIMM up to 32GB
    • Four independent displays: DP++ + DP++ + DP++ + DP++
    • Multiple expansion: 1 PCIe x16, 1 M.2 M Key
    • Rich I/O: 2 GbE, 6 COM, 3 USB 3.0, 6 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)

    Compare
  • RNO171F210506 w600

    DFI RNO171 AMD Ryzen V2000 Mini-ITX

    • DFI RNO171 AMD Ryzen V2000 Mini-ITX – AMD Ryzen V2000 Mini-ITX
    • AMD® Ryzen™ V2000 Mini-ITX
    • 2 DDR4 3200MHz SODIMM up to 64GB
    • Four independent displays: DP++ + DP++ + DP++ + DP++
    • Multiple expansion: 1 PCIe x16, 1 M.2 M Key
    • Rich I/O: 2 GbE, 6 COM, 2 USB 3.1 Gen2, 7 USB 2.0, SATA 3.0
    • 10-Year CPU Life Cycle Support Until Q4′ 30 (Based on AMD Roadmap)

    Compare
  • TGU173F210805R2 w600

    DFI TGU171/TGU173 Intel Tiger Lake iCore Wide Temp Mini-ITX SBC

    • DFI TGU171/TGU173 Intel Tiger Lake iCore Wide Temp Mini-ITX SBC
    • 11th Gen Intel® Core™ Processors
    • DDR4 3200MHz SODIMM up to 64GB
    • Quad independent displays: 1 LVDS, 1 eDP, 1 DP++/HDMI (Auto-detecting), 1 USB Type C
    • Supports up to 4K/2K resolution
    • Multiple expansion: 1 PCIe x4, 1 M.2 M Key, 1 M.2 B key (SATA/PCIe), 1 M.2 E key (PCIe/USB), 1 Nano-SIM Socket
    • Storage: 2 SATA 3.0
    • Rich I/O: 1 Intel 2.5GLAN, 2 Intel GbE, 4 COM, 4 USB 3.1 Gen2, 1 USB Type-C, 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)

    Compare
  • WL171 WL173 F201006 RA w600

    DFI WL171/WL173 8th Gen Intel iCore Wide Temp Mini-ITX

    • DFI WL171/WL173 8th Gen Intel iCore Wide Temp Mini-ITX
    • 8th Generation Intel® Core™ Processor Mini-ITX
    • DDR4 2400MHz SODIMM up to 64GB
    • Three independent displays: LVDS/eDP + DP/HDMI + DP/HDMI (Auto-detecting)
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x4, 1 M.2 M Key (SATA/PCIe), 1 M.2 E key (PCIe/USB)
    • Storage: 2 SATA 3.0
    • Rich I/O: 2 Intel GbE, 4 USB 3.1, 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)

    Compare
  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • DFI DT200-CS High Performance MXM Embedded System
    • 8th/9th Generation Intel Core Processors
    • Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection)
    • AI accelerated: up to 110W GPU MXM module supported
    • Support M.2 B key 3052 5G cellar module
    • Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

    Compare
  • CS103F200131 R2 w600

    DFI CS103-H310 8th Gen Intel iCore Wide Temp Mini-ITX

    • DFI CS103-H310 8th Gen Intel iCore Wide Temp Mini-ITX
    • 15-Year CPU Life Cycle Support Until Q2′ 33 (Based on Intel IOTG Roadmap)
    • Multiple Expansions: 1 PCIe x4 Gen 3, 1 M.2 2280 M Key, 1 M.2 2230 E Key
    • Rich I/O: 2 Intel GbE, 4 COM, 4 USB 3.1 Gen 1, 4 USB 2.0
    • Dual independent displays: LVDS + DP++, DP++ + DP++
    • 2 DDR4 SODIMM up to 32GB
    • 8th Gen Intel® Core™ with Intel® H310

    Compare
  • CS103F200131 R2 w600

    DFI CS103-Q370/C246 8th Gen Intel Core Wide Temp Mini-ITX

    • DFI CS103-Q370/C246 8th Gen Intel Core Wide Temp Mini-ITX
    • 8th Gen Intel® Core™ with Intel® Q370/C246
    • 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Three independent displays: LVDS + DP++ + DP++
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple Expansions: 1 PCIe x4 Gen 3, 1 M.2 2280 M Key, 1 M.2 2230 E Key
    • Storage: 2 SATA 3.0
    • Rich I/O: 2 Intel GbE, 4 COM, 4 USB 3.1 Gen 2, 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q2′ 33 (Based on Intel IOTG Roadmap)

    Compare
  • MD711 SU

    DFI MD711 i7 Medical Embedded System

    • DFI MD711-SU2061-100G – Medical Embedded System
    • 6th Generation Intel Core Medical Computing System
    • 2 DDR4 SODIMM up to 32GB
    • 2 x 2.5″ SATA 3.0 drive bay
    • Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0
    • 15-Year CPU Life Cycle Support

    Compare
  • MD711 SU

    DFI MD711 i5 Medical Embedded System

    • DFI MD711-SU2061-000G – Medical Embedded System
    • 6th Generation Intel Core Medical Computing System
    • 2 DDR4 SODIMM up to 32GB
    • 2 x 2.5″ SATA 3.0 drive bay
    • Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0
    • 15-Year CPU Life Cycle Support

    Compare
  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System
    • 8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
    • 2 DDR4 SODIMM up to 64GB
    • Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM
    • 2 HDMI 2.0 Support resolution 4K@60Hz
    • Acoustic level support full load 36dB @operating temperature 45° C
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • FS053

    DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC – 2.5″ Pico-ITX
    • NXP i.MX6 Processor 2.5″ Pico-ITX
    • Expansion: 1 Mini PCIe, 1 SD
    • DDR3L SDRAM memory down , up to 4GB.
    • Dual independent displays: HDMI + LVDS
    • Rich I/O: 2 GbE, 2 COM, 4 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)

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  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • DFI’s EC102-XNX NVIDIA Jetson Industrial PC – AI Embedded System powered by NVIDIA Jetson Xavier NX
    • Fully support NVIDIA® Jetson Xavier™ NX
    • 91.4mm (W) x 70mm (H) x 76.6mm (D)
    • Fanless chassis technology
    • 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • 1 x HDMI 2.0a/b Type-A supports 4K@60Hz

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  • FS051

    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC – 2.5″ Pico-ITX
    • NXP i.MX6 Processor 2.5″ Pico-ITX
    • DDR3L SDRAM memory down , up to 4GB.
    • Dual independent displays: HDMI + LVDS
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus
    • 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)

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  • M8M051

    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC

    • DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC – 2.5″ Pico-ITX
    • NXP i.MX 8M Processors
    • Single Channel LPDDR4 up to 3200 MHz
    • Single Display: HDMI/LVDS
    • HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz
    • Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)

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  • CH961 front

    DFI CH961 8th/9th Gen Intel iCore Xeon Celeron COM Express Basic

    • DFI CH961 8th/9th Gen Intel iCore Xeon Celeron COM Express Basic
    • Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0

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  • photo front GH9A3 R011 web

    DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini

    • DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini
    • AMD® Ryzen™ R1000 Series Processor
    • Single Channel LPDDR4 2400MHz;Memory Down up to 8GB
    • 1 LVDS/eDP, 1 DDI (HDMI/DP);Supports dual displays: DDI + LVDS/eDP
    • Multiple expansions: 3 PCIe x1
    • Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)

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