LEX 2I640CW Elkhart Lake Atom X6413E 2.5″ Embedded SBC

  • Product Name: Lex 2I640CW
  • Motherboard Form Factor: 2.5″ Embedded
  • CPU: Intel Elkhart Lake ATOM x6413E / J6412
  • RAM: On Board LPDDR4 up to 8GB
  • Expansion: 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM
  • Other features: Independent display: 2 x HDMI (DP), 1 x eDP, 2 x Intel 2.5 GbE LAN, 2 x USB 3.0, 5 x USB 2.0, 4 x COM, Touch Screen, 4DI / 4DO, TPM 2.0
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Description

  • Intel® Elkhart Lake ATOM® x6413E / J6412 CPU
  • On Board LPDDR4 up to 8GB
  • Independent display: 2 x HDMI (DP), 1 x eDP
  • 2 x Intel 2.5 GbE LAN, 2 x USB 3.0, 5 x USB 2.0
  • 4 x COM, 1 x Mini PCIe, 1 x M.2, 1 x Nano SIM
  • Touch Screen, 4DI / 4DO
  • TPM 2.0

2I640CW Specification

CPU Intel® Elkhart Lake ATOM® x6413E / J6412 CPU
MB Chipset Intel® Elkhart Lake SoC
Graphics Intel® HD Graphics, Support DirectX 12.1 & OpenGL 4.5
System Memory On Board LPDDR4 4 / 8GB
Storage 1 x mSATA (Mini Card)
1 x M.2 B Key Type 3042 PCIe-SSD
1 x SATA
BIOS Insyde UEFI BIOS
Display 2 x HDMI (or DP), 1 x eDP
Touch USB interface Touch Screen controller
TPM TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM
LAN 2 x Intel 2.5 GbE I225 / I226 (external)
Audio (Option)e High Definition Audio Specification, Support Line-out / Mic-in / Line-in Two channel Class D Audio Amplifier (OEM)
Expansion Interface 1 x M.2 B Key Type3042 ( USB 2.0 / PCIe / USB 3.0-optional to PCIe x2)
1 x Mini PCIe (USB 2.0 / mSATA-optional to PCIe)
1 x Nano SIM
Expansion Module Mini Card : GPS, 3G / 4G, WI-FI, 2 / 4 x LAN, 4 x COM, CANBus, SDI / AHD Video
M.2 Module : 4G / 5G, SATA, PCIe
By Cable : Bluetooth, Digital I/O, 2 / 4 PoE, 4 x USB mini card
USB 2 x USB 3.0 (external) ; 2 x USB 2.0 (external) ; 3 x USB 2.0 (internal)
Serial IO 1 x RS232 / 422 / 485 (internal)
3 x RS232 (internal)
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~255 sec programmable
SMBus 1 x SMBus
Power Input Wide Range +9~24V
Dimension 2.5″ (102 x 88 mm)
Operation Temperature -20°C~70°C (100 % CPU Usage)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Box PC: TERA ; SKY 2 ; TEGA
OS Support Windows® 10 IOT (64bit), Ubuntu 16.04.3 above, Fedora 26 above, CentOS 7.4 above

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.