IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System

IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System

Product Name: IEI DRPC-240-TGL-U
System Type: Fanless DIN-Rail Embedded System
CPU: Supported CPUs: Intel Celeron 6305/6305E, i5-1145G7E, i7-1185G7E
RAM: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB)
Expansion: 4 x 2.5GbE ports, supporting PoE (optional), 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
Other features: CE/FCC compliant

Description

IEI’s DRPC-240 is a modular embedded computer for flexible configuration according to specific usage requirements and designed for performance-intensive and space-critical applications. Moreover, the fanless DIN-rail PC mounted 11th Gen Intel® Core mobile processor with 8GB of pre-installed memory and Intel iRIS® Xe graphics delivers great performance.

Key Features

Supported CPUs:
- Intel® Celeron® 6305/6305E 1.8 GHz (dual-core, 15W TDP)
- Intel® Core™ i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, 15W TDP)
- Intel® Core™ i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, 15W TDP)
» 4 x 2.5GbE ports, supporting PoE (optional)
» 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
» CE/FCC compliant

Specification

Form factor
SBC Form Factor	CPU: Intel® Celeron® 6305 1.8 GHz (dual-core, TDP 15W) Intel® Core™ i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, TDP 15W) Intel® Core™ i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, TDP 15W) Chipset: SoC System Memory: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB) Power: Input: Terminal block: 12 ~ 28V DC Consumption: 12V @ 6.98A (Intel® Core™ i5-1145G7E with 8GB memory)
I/O Interface
I/O Ports	USB: 2 x USB 3.2 Gen 2 2 x USB 2.0 Ethernet: 4 x RJ-45 (* Support optional PoE af module) 1 x 2.5 GbE by Intel® I225LM 3 x 2.5 GbE by Intel® I225V (colay I225LM) COM Port: 2 x RS-422/485 with AFC (DB-9, with 2.5kV isolation) 2 x RS-232 (DB-9, with 2.5kV isolation) Digital I/O: 12-bit Digital I/O (6-in/ 6-out) Display: 1 x HDMI (up to 3840 x 2160@30Hz) 1 x DP++ (up to 4096 x 2304@60Hz) TPM: Support Intel PTT Watchdog Timer: Programmable 1 ~ 255 sec/min
Expansion Slots
Expansion Slots	M.2: 1 x 2230 A-key (PCIe x1/USB 2.0) 1 x 3042/52/80 B-key (PCIe x2/USB 3.0/USB 2.0) Backplane: 1 x PCIe x4 (Expansion SKU only)
System
Cooling method / System Fan	Fanless / 4-pin external system fan connector
Drive Bays	1 x 2.5” SATA 6Gb/s HDD/SSD bay
Indicator & Buttons
Buttons	1 x Power button 1 x Reset button 1 x AT/ATX switch
Indicators	1 x Power LED (green) 1 x HDD LED (yellow)
Physical Characteristics
Construction	Extruded aluminium alloy
Colour
Colour	Black
Dimensions
Dimensions	81 x 150 x 190
Weight
Weight	2.15/ 2.5 kg
Environment
Operating Temperature	-20°C ~ 60°C with air flow (SSD)
Humidity	10% ~ 95% non-condensing
Operating Vibration	Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
Operating Shock	MIL-STD-810G 514.6C-1 (SSD)
Safety & EMC	CE/FCC compliant
OS Support
OS Support	Microsoft Windows 10 / Windows 11, Linux

Ordering Information

DRPC-240-TGL-U-i7CS-R10	Fanless embedded system, Intel®Tiger Lake-U i7-1185G7E 1.8GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP++, 4 x 2.5GbE LAN, 4 x COM, DIO, 12~28V DC and RoHS
DRPC-240-TGL-U-i5CS-R10	Fanless embedded system, Intel®Tiger Lake-U i5-1145G7E 1.5GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP++, 4 x 2.5GbE LAN, 4 x COM, DIO, 12~24V DC and RoHS
DRPC-240-TGL-U-CCS-R10	Fanless embedded system, Intel®Tiger Lake-U Celeron™6305 1.8GHz (dual core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP++, 4 x 2.5GbE LAN,4 x COM, DIO, 12~24V DC and RoHS

Datasheet

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BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
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Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
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  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
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Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test