AAEON BOXER-8649AI AI System Powered by NVIDIA Jetson AGX Orin

  • Product Name: AAEON BOXER-8649AI
  • System Type: Rugged AI system designed for edge computing and mobile applications
  • CPU: NVIDIA Jetson AGX Orin
  • RAM: 32GB or 64GB LPDDR5
  • Expansion: M.2 slots, NVMe storage, 5G, Wi-Fi/Bluetooth, dual SIM, and OOB modules
  • Other Features: 8× GMSL2 with FAKRA connectors, M12 X-code 10GbE/GbE/USB, M12 A-code RS-232/422/485, CAN FD, DIO, wide 9–48V power input with ignition control, and MIL-STD-810H shock/vibration support with -25°C to 60°C operating range

Description

The AAEON BOXER-8649AI is a rugged embedded AI system built around the NVIDIA® Jetson AGX Orin™ platform, delivering exceptional AI and GPU performance for demanding edge computing applications. Designed for use in harsh and mobile environments, it supports advanced vision processing, real-time analytics, and autonomous workloads across industrial, transportation, and smart infrastructure deployments. Featuring up to 64GB of LPDDR5 memory and extensive high-speed I/O, the system supports multiple GMSL2 cameras via FAKRA connectors, high-bandwidth M12 X-code 10GbE/GbE networking, and a wide range of industrial interfaces including serial, CAN FD, and digital I/O. Flexible M.2 expansion enables NVMe storage, 5G connectivity, and Wi-Fi/Bluetooth, ensuring scalability for evolving edge AI requirements.

With a wide 9–48V DC input, built-in ignition power control, and compliance with MIL-STD-810H shock and vibration standards, the AAEON BOXER-8649AI is engineered for reliable operation in extreme conditions, making it ideal for autonomous vehicles, intelligent transportation systems, robotics, and smart city applications.

Key Features

  • NVIDIA® Jetson AGX Orin™
  • GMSL2 with FAKRA Connectors x 8
  • M12 X-code 10GbE / GbE / USB
  • M12 A-code RS-232/422/485 / CAN FD / DIO
  • M.2 Expension for NVMe, 5G, Wi-Fi/BT, dual SIM, OOB
  • 9V- 48V, built-in ignition power control
  • MIL-STD-810H vibration/shock, –25°C to 60°C

Specification

Specification Details
System AI Accelerator
AI Accelerator NVIDIA® Jetson AGX Orin™
CPU AGX Orin 32GB: 8-core Arm® Cortex®-A78AE CPU
AGX Orin 64GB: 12-core Arm® Cortex®-A78AE CPU
System Memory 32GB LPDDR5
64GB LPDDR5
Storage Device M.2 2280 M-Key x 1 for NVMe
M.2 2230 E-Key x 1 for WiFi/BT/NVMe
Display Interface Mini HDMI 2.0 output (inside waterproof cover)
Ethernet M12 X-code 8-pin x 1 for 10Gbps LAN
M12 X-code 8-pin x 1 for Gigabit LAN
I/O Mini FAKRA B-type x 1 for GMSL2 x 4 (2 sets)
M12 A-code 8-pin x 1 for USB 2.0 x 2
M12 A-code 12-pin x 1 for RS-232 (Rx/Tx/CTS/RTS) / RS-485 x 1 & CAN FD x 2
M12 A-code 12-pin x 1 for RS-232 (Rx/Tx/CTS/RTS) / RS-485 x 1, DIO x 3
External IP67 SMA antenna x 7
Micro USB for image flash x 1 (inside waterproof cover)
Recovery button x 1 (inside waterproof cover)
Expansion M.2 2280 M-Key x 1 for NVMe
M.2 3042/3052 B-Key x 1 for 4G/5G (USB 3.0 + PCIe)
M.2 2230 E-Key x 1 for WiFi/BT/NVMe
SIM slot x 2
Indicator Power LED x 1
System LED x 1
OS Support NVIDIA JetPack 7.x and later
Power Requirement 9V to 48V DC input with ignition power control via M12 A-code
OVP, UVP, OCP, short-circuit, reverse, and surge protection
Mounting TBD
Dimensions (W x D x H) 7.48″ x 5.35″ x 4.30″ (190mm x 136mm x 109.3mm)
Gross Weight TBD
Net Weight TBD
Operating Temperature -13°F to 140°F (-25°C to 60°C), IEC 60068-2 with 0.7 m/s airflow
Storage Temperature 104°F to 185°F (40°C to 85°C), non-operating
Storage Humidity 5% to 95% @ 40°C, non-condensing
Anti-Vibration MIL-STD-810H
Anti-Shock MIL-STD-810H
Certification CE / FCC Class A

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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