Military and Defence Computing Solutions - MIL-STD-810H
Showing 81–95 of 95 results
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IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System
- Product Name: IEI DRPC-240-TGL-U
- System Type: Fanless DIN-Rail Embedded System
- CPU: Supported CPUs: Intel Celeron 6305/6305E, i5-1145G7E, i7-1185G7E
- RAM: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB)
- Expansion: 4 x 2.5GbE ports, supporting PoE (optional), 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
- Other features: CE/FCC compliant
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IEI TANK-XM811 12th Gen Alder Lake-S “Expansion eChassis” AIoT Industrial Computer
- Product Name: IEI TANK-XM811
- System Type: AIoT Dev Kit
- CPU: , 35W TDP Intel Core i5-12500TE 1.9 GHz (4.3 GHz, 6-core), Intel Core i7-12700TE 1.4 GHz (4.6 GHz, 12-core), Intel Core i9-12900TE 1.1 GHz (4.8 GHz, 16-core)
- RAM: 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
- Expansion: Multiple internal expansion boards for flexible selection
- Other features: 2 x 2.5G Ethernet ports, Multiple USB ports and serial ports, Various optional backplanes and chassis
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IEI TANK-XM811AI-RPL 13th Gen Raptor Lake-S AIoT Industrial Computer
- Product Name: IEI TANK-XM811AI-RPL
- System Type: 13th Gen Raptor Lake-S AIoT Developer Kit
- CPU: Intel Core i9-13900TE (up to 5.0GHz, 24-Core (8P+16E), TDP 35W) or Intel Core i7-13700TE (up to 4.8GHz, 16-Core (8P+8E), TDP 35W)
- RAM: 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
- Expansion: Multiple internal expansion boards for flexible selection
- Other features: 2 x 2.5G Ethernet ports, Multiple USB ports and serial ports
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MACTRON MAV0703 Android 7″ In-Vehicle Rugged Mobile Tablet PC
- Product Name: MACTRON MAV0703
- Screen Size: 7″
- CPU: Qualcomm MSM8953 Processor
- RAM: 4GB LPDDR3
- Expansion: Not specified
- Other features: Android 9.0 System, 5000mAh Capacity Battery, IP67 Certified & 1.5m Drop Test, High Brightness 800 nits, Support Versatile Mounting Holder, All-In-One Cable
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MACTRON MAV1013 Android 10.1″ In-Vehicle Rugged Mobile Tablet PC
- Product Name: MACTRON MAV1013
- Screen Size: 10.1″
- CPU: Qualcomm MSM8953 Processor
- RAM: 4GB LPDDR3
- Expansion: Not specified
- Other features: Android 9.0 System, 8000mAh Capacity Removable Battery, IP67 Certified & 1.2m Drop Test, Support Fingerprint Module, Barcode Scanner, Support Versatile Mounting Holder, All-In-One Cable
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Winmate R12ITWS-MHM2-EX 12.1″ M Series i5 C1D2 HMI Panel PC
- Product Name: Winmate R12ITWS-MHM2-EX
- Screen Size: 12.1″
- CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
- RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
- Expansion: Support PCIe x4 Card
- Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
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Winmate R15ITWS-MHB1-EX 15″ M Series i5 C1D2 HMI Panel PC
- Product Name: Winmate R15ITWS-MHB1-EX
- Screen Size: 15″
- CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
- RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
- Expansion: Support PCIe x4 Card
- Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
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Winmate R17ITWS-MHA1-EX 17″ M Series i5 C1D2 HMI Panel PC
- Product Name: Winmate R17ITWS-MHA1-EX
- Screen Size: 17″
- CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
- RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
- Expansion: Support PCIe x4 Card
- Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
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Winmate R19ITWS-MHA3-EX 19″ M Series i5 C1D2 HMI Panel PC
- Product Name: Winmate R19ITWS-MHA3-EX
- Screen Size: 19″
- CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
- RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
- Expansion: Support PCIe x4 Card
- Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
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Winmate W24ITWS-MHA2-EX 23.8″ M Series i5 C1D2 HMI Panel PC
- Product Name: Winmate W24ITWS-MHA2-EX
- Screen Size: 23.8″
- CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
- RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
- Expansion: Support PCIe x4 Card
- Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
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Winmate W22ITWS-MHB1-EX 21.5″ M Series i5 C1D2 HMI Panel PC
- Product Name: Winmate W22ITWS-MHB1-EX
- Screen Size: 21.5″
- CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
- RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
- Expansion: Support PCIe x4 Card
- Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
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IEI ITG-100AI Fanless Ultra Compact Size AI Embedded System
- Product Name: IEI ITG-100AI
- System Type: Fanless Ultra Compact Size AI Embedded System
- CPU: Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
- RAM: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory
- Expansion: M.2 A-key slot for WiFi Module
- Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
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IEI IDS-310AI Fanless Ultra Compact AI System
- Product Name: IEI IDS-310AI
- System Type: Fanless Ultra Compact Size AI System
- CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
- RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
- Expansion: M.2 A-key slot for expansion
- Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
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DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC
- Product Name: DFI ECX700-ADP
- System Type: Outdoor Ruggedized IPC67 Box PC
- CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
- RAM: Supports DDR4 memory
- Expansion: Multiple I/O interfaces for versatile connectivity
- Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
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DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
- Product Name: DFI ECX700-AL
- System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
- CPU: Intel Atom Processor E3900 Series
- RAM: 4GB DDR3 onboard, 64G eMMC
- Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
- Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
