COM Express Basic
COM Express Basic modules provide high-level processing performance and high-speed interfaces for a wide range of demanding computing applications such as medical and industrial automation. Our Basic modules are compatible with COM Express pin-out Type 2, Type 6, and Type 7 – selectable in wide range of Intel Core Series and AMD Ryzen solutions. We also can provide standard operational temperature modules (0°C to +60°C) and wide temperature (-40°C to +85°C).
Showing all 20 results
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Intel 8th Generation COM Express Basic Modules (7)
Intel 8th Generation COM Express Modules and Carriers – Modules for COM Express are available in Mini (55mm × 84mm), Compact (95mm × 95mm) & Basic (95mm × 125mm). -
AMD Ryzen COM Express Basic Modules (6)
AMD Ryzen embedded COM Express Modules and Carriers – Modules for COM Express are available in Mini (55mm × 84mm), Compact (95mm × 95mm) & Basic (95mm × 125mm). -
DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module
• DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module
• 11th Generation Intel® Processor COM Express® Basic
• DDR4 3200MHz SODIMM up to 128GB
• VGA + LVDS*/eDP + 3 DDI
• DP++ supports 4K resolution
• Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
• Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap) -
DFI CH961 8th/9th Gen Intel iCore Xeon Celeron COM Express Basic
• DFI CH961 8th/9th Gen Intel iCore Xeon Celeron COM Express Basic
• Dual channel DDR4 2666MHz SODIMM up to 96GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0 -
ASRock Industrial COM-653-E-2176M 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-E-2176M
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-R1505G Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-R1505G
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
ASRock Industrial COM-653-i3-8100H 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-i3-8100H
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-R1606G Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-R1606G
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
ASRock Industrial COM-653-i5-8400H 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-i5-8400H
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-V1202 Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-V1202
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
ASRock Industrial COM-653-i7-8850H 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-i7-8850H
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-V1605 Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-V1605
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
DFI GH960-V1756 Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-V1756
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
DFI GH960-V1807B Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-V1807
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
DFI HM370 i3-8100H 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – HM370 – i3-8100H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI QM370 Xeon E-2176M 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – QM370 – Xeon E-2176M
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI HM370 i5-8400H 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – HM370 – i5-8400H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI QM370 i3-8100H 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – QM370 – i3-8100H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI QM370 i5-8400H 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – QM370 – i5-8400H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI QM370 i7-8850H 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – QM370 – i7-8850H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI QM370 i7-8850H 8th Gen Com Express Basic Module – Wide Temp
• DFI 8th Gen Com Express Module Wide Temp – QM370 – i7-8850H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
Axiomtek CEM510 COM Express Basic – Xeon & 7th Generation i7/i5/i3
• Axiomtek – CEM510 – COM Express Basic – Intel Xeon & 7th Generation i7/i5/i3
• Intel Xeon E3 and 7th gen Intel Core i7/i5/i3 processors (Kaby Lake-H)
• Intel CM238/QM175/HM175 chipset
• 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC
• 1 PCIe x16 and 8 PCIe x1 Gen. 3
• 4 SATA-600 with RAID 0/1/5/10
• 4 USB 3.0 and 8 USB 2.0
• Intel AMT 11.0 and TPM 1.2 function supported
• AXView 2.0 intelligent remote management software for industrial IoT applications
