Embedded Systems | Industrial Computing

BVM supply a diverse range of industrial and embedded systems. From industrial motherboards, SBCs and Box PCs, to Rack Mount Computers and Industrial Panel PCs . If you can’t find an off the shelf system that meets your specific requirements, our engineering team can design a bespoke system from ground through to our production team taking care of its manufacture.

If your application lies within the Industrial Automation, Military, Medical, Transportation and Smart City – or a host of any other market verticals, we’re sure that we can provide the system that fits your needs.

What are the Advantages of an Industrial PC?
What are the Advantages of a Rugged Computer?
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Showing 1–20 of 123 results

  • MTH968 1

    DFI MTH968 Intel Meteor Lake U/H COM Express Compact

    • Product Name: DFI MTH968
    • Motherboard Form Factor: COM Express Compact
    • CPU: Intel Core Ultra Processor (Meteor Lake: U/H-series)
    • RAM: Dual Channel DDR5 5600MHz SODIMM up to 64GB
    • Expansion: Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, 1 SMBus
    • Other features: Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI; Supports 4K / 2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 USB 4.0, 4 USB 3.2, 8 USB 2.0, 2 SATA 3.0
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  • RBT970 1

    DFI RBT970 AMD Ryzen Embedded V3000 COM Express Basic

    • Product Name: DFI RBT970
    • Motherboard Form Factor: COM Express Basic
    • CPU: AMD Ryzen Embedded V3000 Series processors
    • RAM: Dual DDR5 SODIMM 4800MHz up to 64GB
    • Expansion: 1 PCIe x14 (Gen 4), 1 SMBus, 1 I2C, 1 LPC, UART
    • Other features: Support extended operating temperature: -40 to 85°C; Support 2 x 10G Ethernet and 1 x 2.5G Ethernet; Rich I/O: 4 USB 3.2, 4 USB 2.0, 2 SATA 3.0
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  • RPP968 1

    DFI RPP968 Intel Raptor Lake COM Express Compact

    • Product Name: DFI RPP968
    • Motherboard Form Factor: COM Express Compact
    • CPU: Intel Core Processor Raptor Lake Series
    • RAM: DDR5 4800MHz SODIMM up to 64GB
    • Expansion: Multiple expansions: 2 PCIe x4 (Gen4 PCH), 5 PCIe x1
    • Other features: 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++); Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 38 (Based on Intel IOTG Roadmap)
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  • RPS9HC 1

    DFI RPS9HC Intel Raptor Lake S COM-HPC

    • Product Name: DFI RPS9HC
    • Motherboard Form Factor: COM-HPC
    • CPU: 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
    • RAM: 4 DDR5 SODIMM 3600MHz up to 128GB
    • Expansion: Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
    • Other features: Quad Displays: eDP + 3 DDI; DDI supports up to 8K; Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0; Typically supports 10-Year CPU Life Cycle Until Q1’ 38
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  • RPP051 1

    DFI RPP051 13th Gen Raptor Lake 2.5″ Pico-ITX SBC

    • Product Name: DFI RPP051
    • Motherboard Form Factor: 2.5″ Pico-ITX SBC
    • CPU: 13th Generation Intel Core Processors
    • RAM: 1 DDR5 4800MHz SODIMM up to 32GB
    • Expansion: Multiple Expansion: 1 M.2 E key, 2 M.2 B key
    • Other features: Small form factor for space-limited applications; Supports 4K/2K resolution; Dual Independent Displays: DP++ + eDP; Rich I/O: 1 Intel 2.5G LAN, 1 COM, 2 USB 3.1 Gen 2, 2 USB 2.0
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  • KS AL

    DFI KSM-KH Series 15″ – 22″ Modular Rugged Industrial Panel PC Series

    • Product Name: DFI KSM-KH Series
    • Screen Size: 15″ – 22″
    • CPU: Intel® Core™ Processor with Fanless Design
    • RAM: Two 260-pin SODIMM up to 32GB (CM238 supports ECC) Dual Channel DDR4 2400MHz
    • Expansion: Not specified
    • Other features: Support Adaptive Display Platform, Supports 9~36V Power Input, Multiple Panel Sizes with Resistive/P-Capacitive Touch Screen, IP65 Front Panel Protection, 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
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  • PCSF51 1

    DFI PCSF51-R2312 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI PCSF51-R2312
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen™ Embedded R2000 Series – Picasso
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Small form factor 1.8″ SBC for space-limited applications
    • Other features: HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz, Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB, 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)
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  • PCSF51 1

    DFI PCSF51-R2314 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI PCSF51-R2314
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen™ Embedded R2000 Series – Picasso
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Small form factor 1.8″ SBC for space-limited applications
    • Other features: HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz, Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB, 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)
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  • PCSF51 1

    DFI PCSF51-R2514 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI PCSF51-R2514
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen™ Embedded R2000 Series – Picasso
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Small form factor 1.8″ SBC for space-limited applications
    • Other features: HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz, Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB, 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)
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  • ADP253 1

    DFI ADP253 12th Gen Alder Lake-P 4″ SBC

    • Product Name: DFI ADP253
    • Motherboard Form Factor: 4″ SBC
    • CPU: 12th Gen Intel Core Processors
    • RAM: On board memory and 1 DDR4 SO-DIMM
    • Expansion: Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 1 HDMI, 1 VGA/DP, 2 Type-C Alt. Mode, Supports 4K/2K resolution, Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 6 COM, 4 USB 3.2, 2 USB 2.0, 1 SATA 3
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  • M8MP553 1

    DFI M8MP553 NXP i.MX 8M 3.5″ SBC

    • Product Name: DFI M8MP553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: NXP i.MX8M plus Processors
    • RAM: 2GB/4GB LPDDR4
    • Expansion: M.2 2230/3052: 1 M.2 B key for PCIe
    • Other features: 2 GbE LAN for automation application, CANbus for automation equipment integration, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
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  • VC900 M8M 1 1

    DFI VC900-M8M NXP i.MX 8M In-Vehicle PC

    • Product Name: DFI VC900-M8M
    • System Type: In-Vehicle PC
    • CPU: NXP i.MX8 series
    • RAM: 16GB/64GB eMMC and micro SD card slot
    • Expansion: Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
    • Other features: Wide voltage: 936V vehicle power input with ACC/IGN function, Wide temperature: -20°C65°C operation without active fan
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  • EC500 ADS 1

    DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System

    • Product Name: DFI EC500-ADS
    • System Type: Fanless Embedded System
    • CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: Three M.2 slots
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
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  • VP070 M8M 1

    DFI VP070-M8M NXP i.MX 8M In-Vehicle Panel PC

    • Product Name: DFI VP070-M8M
    • Screen Size: In-Vehicle Panel PC
    • CPU: NXP i.MX 8M Dual/Quad Cortex
    • RAM: On board Memory 2GB/4GB (Default 2GB)
    • Expansion: Not specified
    • Other features: IP65 Front Panel Protection, Rich I/O: 1 GbE, 2 COM, 1 CAN Bus, 2 USB 3.1 Gen1, 1 HDMI, Application Focus: In-Vehicle Driver HMI, Smart Power Ignition Control: Power delay and protection time setting
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  • EHL700

    DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven

    • Product Name: DFI EHL700
    • Motherboard Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
    • CPU: Intel Elkhart Lake Celeron / Atom
    • RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
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  • TGH960

    DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

    • Product Name: DFI TGH960
    • Motherboard Form Factor: Intel Tiger Lake iCore / Xeon Com Express Basic Module
    • CPU: 11th Generation Intel® Processor COM Express® Basic
    • RAM: DDR4 3200MHz SODIMM up to 128GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: VGA + LVDS*/eDP + 3 DDI, DP++ supports 4K resolution, Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)
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  • ADS101 ADS103 1

    DFI ADS101/ADS103 12th Gen Alder Lake-S Mini-ITX Motherboard

    • Product Name: DFI ADS101/ADS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 12th Generation Intel® Core™ Processors
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 1 PCIe x16 gen 5, 1 M.2 E Key (USB/PCIe), 1 M.2 M Key (PCIe/SATA), 1 M.2 B Key (PCIe/SATA/USB)
    • Other features: Quad Displays: 1 DP++, 1 DP++/HDMI, 1 LVDS/eDP, 1 DFI display extension port (DP/HDMI/VGA available), Supports up to 4K/2K resolution, Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 2 COM, up to 6 USB 3.2 Gen2, 2 USB 3.2 Gen1, 4 USB 2.0, 2 SATA 3.0, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • ADS310 R680E Q670E Micro ATX 1

    DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard

    • Product Name: DFI ADS310-R680E/Q670E
    • Motherboard Form Factor: Micro-ATX
    • CPU: 12th Gen Intel® Core™ with Intel® R680E/Q670E chipset
    • RAM: 4 DDR4 UDIMM up to 128GB
    • Expansion: Multiple expansion: 1 PCIe x16 gen 5, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
    • Other features: Supports 4 independent displays: VGA, 2 DP++, HDMI 2.0a, Supports 8K/4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
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  • ADS630 R680E Q670E ATX 1

    DFI ADS630-R680E/Q670E 12th Gen Alder Lake-S ATX Motherboard

    • Product Name: DFI ADS630-R680E/Q670E
    • Motherboard Form Factor: ATX
    • CPU: 12th Gen Intel® Core Processors
    • RAM: 4 DDR4 UDIMM up to 128GB
    • Expansion: Multiple Expansion: 1 PCIe x16(Gen 5), 4 PCIe x4(Gen 4), 2 PCI, 2 M.2 M key, 1 M.2 E Key
    • Other features: Quad Displays: VGA + 2 x DP++ + HDMI, Supports 4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 4 USB 3.2 Gen1, 3 USB 2.0
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  • KS070 M8M 1

    DFI KS070-M8M NXP i.MX 8M 7″ IP65 Panel PC

    • Product Name: DFI KS070-M8M
    • Screen Size: 7″ IP65 Panel PC
    • CPU: NXP i.MX8M Platform
    • RAM: 2GB/4GB SDRAM Memory
    • Expansion: Multiple Expansion: M.2 2230/3042 support
    • Other features: 7″ 1024×600 TFT LCD Panel with capacitive touch screen, IP65 front panel protection
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