Home » Industrial Computers | Embedded Systems | Boards & Modules » Computer-On-Modules and Carrier Boards » Page 4

Computer-On-Modules and Carrier Boards

  • COM 653L1
    ASRock Industrial COM-653-E-2176M 8th Gen Com Express Basic
    • Product Name: Asrock COM-653-E-2176M
    • Module Form Factor: COM Express
    • CPU: Intel 8th Generation Intel Core Processor BGA 1440 / Intel Xeon Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel LAN; 1 x TPM2.0 on board IC (optional)
  • COM 653L1
    ASRock Industrial COM-653-i3-8100H 8th Gen Com Express Basic
    • Product Name: Asrock COM-653-i3-8100H
    • Module Form Factor: COM Express
    • CPU: Intel 8th Generation Intel Core Processor BGA 1440 / Intel Xeon Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel LAN; 1 x TPM2.0 on board IC (optional)
  • COM 653L1
    ASRock Industrial COM-653-i5-8400H 8th Gen Com Express Basic
    • Product Name: Asrock COM-653-i5-8400H
    • Module Form Factor: COM Express
    • CPU: Intel 8th Generation Intel Core Processor BGA 1440 / Intel Xeon Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel LAN; 1 x TPM2.0 on board IC (optional)
  • COM 653L1
    ASRock Industrial COM-653-i7-8850H 8th Gen Com Express Basic
    • Product Name: Asrock COM-653-i7-8850H
    • Module Form Factor: COM Express
    • CPU: Intel 8th Generation Intel Core Processor BGA 1440 / Intel Xeon Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel LAN; 1 x TPM2.0 on board IC (optional)
  • CH960 w600
    DFI HM370 8th Gen Com Express Basic Module
    • Product Name: DFI HM370
    • Module Form Factor: Com Express Module
    • CPU: 8th Generation Intel Core
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays; eDP resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
  • CAB 601(L1)
    ASRock Industrial CAB-601 COM Express – ATX Carrier Board
    • Product Name: Asrock CAB-601
    • Motherboard Form Factor: ATX Carrier Board
    • CPU: Not specified
    • RAM: Not specified
    • Expansion: Supports COM Express Basic/Compact/Mini Module, 1 x PCIe x16, 1 x PCIe x4, 2 x PCIe x1, 2 x M.2 Key E
    • Other features: COM Express Type 6 Pin Out, Supports 3 Digital Display Interfaces (DDI) with HDMI/DisplayPort output, 4 x USB3.2 (Gen2), 2 x USB 2.0, 4 x COM, 4 x SATA3, 1 x Intel 2.5 Gigabit LAN, ATX PWR (24+4-pin) and 9~24V DC-in (4-pin) co-design
  • CAB 201L1 1
    ASRock Industrial CAB-201 Pico-ITX Carrier Board
    • Product Name: Asrock CAB-201
    • Motherboard Form Factor: Pico-ITX Module Micro-ATX Carrier Board
    • CPU: Not specified
    • RAM: Not specified
    • Expansion: 1 x PCIe, 1 x mini-PCIe, 1 x M.2 (Key E), 1 x MIOe
    • Other features: Supports PICO-ITX module, 1 x DisplayPort, 1 x USB 3.0, 1 x USB 2.0, 2 x SATA3, DC 12V DC-in
  • CAB 701(L1)
    ASRock Industrial CAB-701 Qseven – Micro-ATX Carrier Board
    • Product Name: Asrock CAB-701
    • Motherboard Form Factor: Micro-ATX Carrier Board
    • CPU: Supports Qseven modules
    • RAM: Supports Qseven modules
    • Expansion: 3 x PCIe x1 slot, 1 x Mini-PCIe, 1 x mSATA
    • Other features: Supports Qseven Module, Multiple display support (1 x HDMI, 1 x DisplayPort, 1 x LVDS), Rich I/O (1 x USB 3.0, 5 x USB 2.0, 2 x SATA3, 2 x Intel LAN), 12~24V DC-in
  • QE E70 2D(L)
    Commell QE-E70 Qseven – J1900/N2930/E3845 CPU Module
    • Product Name: Commell QE-E70
    • Module Form Factor: Qseven
    • CPU: Intel J1900/N2930/E3845 CPU Module
    • RAM: Supports DDR3L 1600 MHz 2.0 GB or 4GB on board memory
    • Expansion: Two Serial ATAII, one USB3.0, four USB 2.0, four PCIe x1
    • Other features: Supports two eDP, VGA, CRT interface, two DDI port interface for DisplayPort, DVI, or LVDS 24-bit up to 1920×1080, HD Audio interface