System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
CPU: Intel Atom Processor E3900 Series
RAM: 4GB DDR3 onboard, 64G eMMC
Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
RAM: 1 SODIMM Memory Support up to 8GB Single Channel DDR3L 1600/1866MHz
Expansion: 1 mSATA, eMMC (optional), 1 x Full-size Mini PCIe (PCIe/USB/Daul micro SIM), 1 x Full-size Mini PCIe (PCIe/USB/micro SIM), 1 x Half-size mSATA
Other features: Supports ignition delay on/off function, GPS Onboard, 3 SIM Slots Onboard, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
System Type: AI-Enabled 5G MXM PoE High Performance System
CPU: 8th/9th Generation Intel Core Processors
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
Other features: Mini size, Multi-interface, Fanless Housing Design & Compact Mini Size & Rich IO Ports, 2 x RTL8111E 1000M LAN Card, Support Wake On LAN, Support dual system (Windows7/8.1/10 + Linux)
CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processor – i3-1115G4
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6 AX200), 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type C), TPM onboard, 12V~19V DC-In, 110.0 x 117.5 x 47.85mm dimensions
Expansion: Support 1 x SATSIII (6.0Gb/s) Connector, Support 1 x mSATA Slot, Support 4 x COM (2 x RS232/485 Optional)
Other features: Fanless Housing Design & Compact Mini Size & Rich IO Ports, 2 x RTL8111E 1000M LAN Card, Support DIN Rail, VESA Mount, Support Windows 7 / 8 / 10, Linux OS
CPU: Intel 12th Gen (Alder Lake-P) Core Processors
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processor – i7-1165G7
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6 AX200), 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type C), TPM onboard, 12V~19V DC-In, 110.0 x 117.5 x 47.85mm dimensions, Fanned Barebone
CPU: Intel 12th Gen (Alder Lake-P) Core Processors
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
CPU: Intel 12th Gen (Alder Lake-P) Core Processors
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
System Type: Fanless Wide Temp Embedded Ultra Compact PC
CPU: Intel Atom Processor E3900 Series, BGA 1296
RAM: DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
Expansion: Supports 2 Mini PCIe and 1 M.2 slots
Other features: Displays: 1 DP/HDMI combo + 1 DP/VGA, Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB, Extended operating temperature: -40 to 70°C, 15-Year CPU Life Cycle Support Until Q1’31 (Based on Intel IOTG Roadmap)
RAM: 2 x 260-pin non-ECC/ECC SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 109.45 x 50.05mm, Fanless Barebone
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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