ASRock Industrial NUC BOX-1115G4 Intel Tiger Lake i3 Edge AI BOX PC

  • Product Name: Asrock NUC BOX-1115G4
  • System Type: Edge AI Fanned BOX PC
  • CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processor – i3-1115G4
  • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
  • Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6 AX200), 1 x SATA3
  • Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type C), TPM onboard, 12V~19V DC-In, 110.0 x 117.5 x 47.85mm dimensions

Description

Asrock AI Dev Kit

 

Do you know about ASRock Industrial’s AI developer kits?

Featuring high AI capability and ease of deployment – ASRock Industrial’s latest developer kits are powered by
11th Gen Intel Core Processors and Intel Iris Xe Graphics, with up to 96 execution units to boost AI performance at 4.15 TFLOPS and 8.29 TOPS.
You can simply download the BSP and start developing your AI solution with Intel’s OpenVINO software running on Linux/ Yocto.

 

High AI Capability

ASRock Industrial’s AI Box Computers and SBCs feature high AI capability with multi-channel camera support working in conjunction with Intel’s OpenVINO software for AI inference and vision technology to bring real-time Edge AI computing. Across both platforms, the series are ideal for embedded applications in areas such as Smart Retail, Smart City and Smart Factory deployment.

Easy Deployment

Commence and develop your AI Solution with OpenVINO running on
Linux/ Yocto via ASRock Industrial AI Platforms

Asrock AI Dev Kit 2

Download how to use

Features

  • Intel® 11th Gen (Tiger Lake-UP3) Core™ Processors
  • 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
  • 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6 AX200), 1 x SATA3
  • 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN
  • Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type C)
  • TPM onboard
  • 12V~19V DC-In
  • 110.0 x 117.5 x 47.85mm, Fanned Barebone

Specification

Form Factor
Dimensions 110.0 x 117.5 x 47.85mm
Processor System
CPU I3-1115G4, DC, Max Speed up to 4.1GHz
Chipset MCP
BIOS AMI SPI 256 Mbit
Memory
Technology Dual Channel DDR4 3200 MHz
Capacity 64GB (32 GB per DIMM)
Socket 2 x 260-pin SO-DIMM
Graphics
Controller Intel® Iris® Xe Graphics
HDMI HDMI 2.0a
Max resolution up to 4096×2160@60Hz
DisplayPort DisplayPort 1.4, DP++
Max resolution up to 4096×2160@60Hz
MultiDisplay Quad-Display (Included 2 outputs from Type-C)
Expansion Slot
M.2 1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 for Wireless
WLAN 1 x Intel® Wi-Fi 6 AX200 module
Audio
Interface Realtek ALC233, High Definition Audio.
Ethernet
Controller/ Speed LAN1: Intel® I219V with 10/100/1000 Mbps
LAN2: Intel® I225LM with 10/100/1000/2500 Mbps
Connector 2 x RJ-45
Front I/O
USB 1 x USB 3.2 Gen2 (Type A)
2 x USB 3.2 Gen2 (Type-C, Supports DP 1.4 display output)
* USB4™ Compliance Test is pending for certification
Audio 1 (headphone & microphone jack)
Rear I/O
HDMI 1 x HDMI 2.0a
DisplayPort 1 x DP 1.4
Ethernet 1 x 1 Gigabit LAN, 1 x 2.5 Gigabit LAN
USB 2 x USB 3.2 Gen2 (Type-A)
DC Jack 1
Storage
M.2 1 x M.2 (KEY M, 2242/2260/2280) with PCIe x4 and SATA3 for SSD
*M.2 Key M 2280(Supported by bracket)
SATA 1 x SATA3.0 (6.0 Gb/s)
Watchdog Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements
Input PWR 12V~19V DC-In Jack
Power On AT/ATX Supported
– AT : Directly PWR on as power input ready
– ATX : Press button to PWR on after power input ready
Environment
Operating Temp 0ºC ~ 40ºC
Storage Temp -40° C – 85° C
Operating Humidity 5% ~ 90%
Storage Humidity 5% ~ 90%
Mechanical
Construction Plastic
Mounting VESA mounting
Dimensions (W x H x D) 110.0 x 117.5 x 47.85mm
Weight Net Weight:1.0Kg
Others

 

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

Datasheet

Download

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

Manufacturer : Asrock

CPU

  • Powered By : Intel
  • CPU Family : iCore
  • CPU Generation : Tiger Lake
  • CPU Model : i3-1115G4

Memory

  • Memory Installed :
  • Memory Slots : 2
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2, SATA
  • LAN Ports : 2
  • Serial Ports :
  • USB 2 Ports :
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 :
  • Video Output : DisplayPort, HDMI
  • Multi Display : Quad Display

Operating System

  • OS : Windows

Certifications

  • Certifications :

Features

  • 5G-4G-GPS :
  • Artificial Intelligence Use :
  • IP Rating :
  • Rugged :
  • System Type : Box PC
  • Wide Temp :

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