CPU: Powerful 8th/9th Gen. Intel Core i7/i5, 35W Max.
RAM: Supports Dual Channel DDR4 SODIMM up to 32GB
Expansion: 1 X PCIex16 (25W), 1 X PCIex4, 1 X Mini-PCIe
Other features: Medical Grade 4th UL/EN 60601-1 Certified, Fanless w/Hospital White Housing, Support RAID 0,1 w/Doorway 2nd Storage, HDD Anti-vibration mechanism, Rich I.O., Up to 6 USB, 1 X VGA/DVI-D/DP, 2 LAN & 2 COM.
CPU: Powerful 8th/9th Gen. Intel Core i7/i5, 35W Max.
RAM: Supports Dual Channel DDR4 SODIMM up to 32GB
Expansion: 1 X PCIex16 (25W), 1 X PCIex4, 1 X Mini-PCIe
Other features: Medical Grade 4th UL/EN 60601-1 Certified, Smart Fan w/Hospital White Housing, Support RAID 0,1 w/Doorway 2nd Storage, HDD Anti-vibration mechanism, Rich I.O., Up to 6 X USB, 1 X VGA/DVI-D/DP, 2 LAN & 2 COM.
Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
System Type: Ultra Small Mini PC Fanless Embedded System
CPU: AMD Ryzen Embedded R1000 Series
RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
Expansion: 1 x Mini-PCIe (PCIe signal)
Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
This product has multiple variants. The options may be chosen on the product page
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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