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Industrial Motherboards and Embedded SBCs

  • LV 6713 2D8without Battery
    Commell LV-6713 Mini-ITX iCore / Celeron / Xeon Tiger Lake SBC
    • Product Name: Commell LV-6713
    • Motherboard Form Factor: Mini-ITX
    • CPU: iCore / Celeron / Xeon Tiger Lake
    • RAM: 2 x DDR4 SO-DIMM 3200 MHz up to 64GB, support Non-ECC, unbuffered memory
    • Expansion: 1 x PCIE X16 slot, 1 x MiniPCIe socket (supporting mSATA), 1 x M.2 (Key M 2280) and 1 x M.2 (Key E 2230)
    • Other features: 6 x USB3.2 Gen2, 3 x SATAIII, Dual Gigabit Ethernet, 4 x RS232 ports, 2 x RS232/422/485 ports, 2 x USB2.0 ports, Intel High Definition Audio, 1 x SIM slot.
  • CMS101 103 W480F210831 R1 w600
    DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX
    • Product Name: DFI CMS101/CMS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 10th Generation Intel Core Processors
    • RAM: 2 DDR4 2933MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 2 x DP++, 1 LVDS/eDP; Supports up to 4K/2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • GH171F070621 R1w600
    DFI GH171 AMD Ryzen V1000/R1000 Mini-ITX
    • Product Name: DFI GH171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V1000/R1000
    • RAM: 2 DDR4 3200MHz SODIMM up to 32GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 3 USB 3.0, 6 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
  • RNO171F210506 w600
    DFI RNO171 AMD Ryzen V2000 Mini-ITX
    • Product Name: DFI RNO171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V2000
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 2 USB 3.1 Gen2, 7 USB 2.0, SATA 3.0; 10-Year CPU Life Cycle Support Until Q4′ 30 (Based on AMD Roadmap)
  • MXM IPC Q470L1
    ASRock Industrial MXM IPC-Q470E Micro-STX Motherboard
    • Product Name: Asrock MXM IPC-Q470E
    • Motherboard Form Factor: Micro-STX
    • CPU: Intel 10th Gen (Comet lake-S) Core Processors with Q470E chipset
    • RAM: 2 x 260-pin SO-DIMM, Support Dual Channel DDR4 2933 (i9/i7 CPU) / 2666 (i5/i3 CPU) / 2400 (Pentium/ Celeron CPU), up to 64GB
    • Expansion: Supports MXM Graphics Card (Type-A or Type-B, Up to 150W); 1 x PCIe x4 Gen3, 1 x mini-PCIe
    • Other features: 4 x USB 3.2 Gen1, 1 x USB 3.2 Gen1 (Type-C), 4 x USB 2.0, 1 x M.2 Key E, 2 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 4 x SATA3; 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN; Support Hepta display, 1 x DP 1.2, 1 x VGA, 1 x eDP 1.4 / LVDS (from CPU) and 3 x DP 1.2, 1 x HDMI 2.0a (from MXM); TPM 2.0 on Board; Supports Intel vPro, AMT, RAID 0/1/5/10; 18~26V DC-In wide range DC input with lockable connector (Max power 300W)
  • MF05 Full
    Jetway MF05 Series Tiger Lake 3.5″ SBC
    • Product Name: Jetway MF05 Series
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake-UP3 SoC Processor (TDP 12~28W)
    • RAM: 2* DDR4-3200MHz SO-DIMM up to 64GB
    • Expansion: 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME; 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi
    • Other features: 1* Intel i219-LM 1.0GbE, 1* Intel i225-LM 2.5GbE; 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS; 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0; MF05-22: Onboard TPM 2.0 (option)
  • FS053
    DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC
    • Product Name: DFI FS053
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 2 GbE, 2 COM, 4 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • FS051
    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC
    • Product Name: DFI FS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • tKINO ULT6 1
    IEI tKINO-ULT6 Intel iCore Tiger Lake USB4 Mini-ITX SBC
    • Product Name: IEI tKINO-ULT6
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel iCore Tiger Lake
    • RAM: Supports DDR4-3200 memory
    • Expansion: PCIe x8 Gen 4.0 slot (x4 signal)
    • Other features: Thin Mini-ITX form factor with 11th Gen. Intel Tiger Lake-UP3 Processor support, Wide range 9~36V DC Input, Support quadruple independent displays (HDMI, DP, eDP/LVDS, USB4), Dual Intel 2.5GbE LAN, M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)
  • M8M051
    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC
    • Product Name: DFI M8M051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX 8M Processors
    • RAM: Single Channel LPDDR4 up to 3200 MHz
    • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
  • 3I110HW 1
    Lex 3I110HW Embedded 11th Gen Tiger Lake 3.5″ SBC
    • Product Name: Lex 3I110HW
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3 – i7 / i5 / i3 / Celeron
    • RAM: 2 x DDR4 SODIMM (Max. 64GB)
    • Expansion: Multiple Independent display: VGA, HDMI, DP, DP (Type C), eDP or LVDS; 3 x Intel GbE LAN, 1 x USB 3.0 (type C), 6 x USB 2.0; 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM; 1 x M.2 B Key, 1 x M.2 M Key
    • Other features: TPM 2.0 (Optional), Battery Charger Function (3I110BW)
  • LP 179 2D8 NEW 1
    Commell LP-179 Pico-ITX i7 Tiger Lake SBC
    • Product Name: Commell LP-179
    • System Type: Pico-ITX SBC
    • CPU: Onboard Intel Tiger Lake UP3 Processor
    • RAM: 1 x DDR4 SO-DIMM 3200 MHz up to 32GB
    • Expansion: 1 x M.2 2230 Key E, 1 x M.2 2280 Key M support PCIe Gen4, 1 x SATA3
    • Other features: Integrated DisplayPort, HDMI, 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x USB2.0, 2 x USB3.2 Gen2, 2 x RS232, Support Watchdog Timer, Support 4K resolution, DC input 12V ±5%
  • LV 6712 2D8 NEW 2
    Commell LV-6712 Mini-ITX Celeron Tiger Lake SBC
    • Product Name: Commell LV-6712
    • Motherboard Form Factor: Mini-ITX
    • CPU: Onboard Intel Tiger Lake UP3 Processor
    • RAM: 2 x DDR4 SO-DIMM 3200 MHz up to 64GB
    • Expansion: 2 x MiniPCIe (one supports mSATA), 1 x M.2 2280 KEY M support PCIe Gen4, 1 x PCIe x1 Slot
    • Other features: Integrated DisplayPort, HDMI, LVDS for four display support, 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x SATA3, 2 x USB2.0, 4 x USB3.2 Gen2, 6 x COM, 1 x GPIO, 1 x PS/2, Support Watchdog Timer
  • LV 6712 2D8 NEW 2
    Commell LV-6712 Mini-ITX i7 Tiger Lake SBC
    • Product Name: Commell LV-6712
    • Motherboard Form Factor: Mini-ITX
    • CPU: Onboard Intel Tiger Lake UP3 Processor
    • RAM: 2 x DDR4 SO-DIMM 3200 MHz up to 64GB
    • Expansion: 2 x MiniPCIe (one supports mSATA), 1 x M.2 2280 KEY M support PCIe Gen4, 1 x PCIe x1 Slot
    • Other features: Integrated DisplayPort, HDMI, LVDS for four display support, 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x SATA3, 2 x USB2.0, 4 x USB3.2 Gen2, 6 x COM, 1 x GPIO, 1 x PS/2, Support Watchdog Timer
  • CS181 Front062420 R1 w600
    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard
    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • CS181 Front062420 R1 w600
    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard
    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • GHF51B190606w600
    DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit
    • Product Name: DFI GHF51-R1102G
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
    • Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
  • AL553F190326 RAw600
    DFI AL553 Intel Atom E3900 3.5″ SBC
    • Product Name: DFI AL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • NUC 1185G7EL1
    ASRock Industrial NUC-1185G7E 11th Gen Tiger Lake Edge AI NUC SBC
    • Product Name: ASRock Industrial NUC-1185G7E Edge AI NUC SBC
    • Motherboard Form Factor: NUC
    • CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processors
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64GB
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type-C), TPM onboard, 12V~19V DC-In
  • LE 37O 2D8 1
    Commell LE-37O Tiger Lake Celeron 3.5″ SBC
    • Product Name: Commell LE-37O
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
    • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
    • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
    • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)