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Embedded Systems | Industrial Computing

BVM supply a diverse range of industrial and embedded systems. From industrial motherboards, SBCs and Box PCs, to Rack Mount Computers and Industrial Panel PCs . If you can’t find an off the shelf system that meets your requirements, our engineering team can design a bespoke system from ground through to our production team taking care of its manufacture.

If your application lies within the Industrial Automation, Military, Medical, Transportation – or a host of any other market verticals, we’re sure that we can provide the system that fits your needs.

• What are the Advantages of an Industrial PC?
• What are the Advantages of a Rugged Computer?
• New Products

Showing 1–20 of 32 results

  • VC900 M8M 1 1

    DFI VC900-M8M NXP i.MX 8M In-Vehicle PC

    • Product Name: DFI VC900-M8M
    • System Type: In-Vehicle PC
    • CPU: NXP i.MX8 series
    • RAM: 16GB/64GB eMMC and micro SD card slot
    • Expansion: Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
    • Other features: Wide voltage: 936V vehicle power input with ACC/IGN function, Wide temperature: -20°C65°C operation without active fan
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  • EC500 ADS 1

    DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System

    • Product Name: DFI EC500-ADS
    • System Type: Fanless Embedded System
    • CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: Three M.2 slots
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
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  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
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  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
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  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • MD711 SU

    DFI MD711 i7 Medical Embedded System

    • Product Name: DFI MD711-SU2061-100G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
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  • MD711 SU

    DFI MD711 i5 Medical Embedded System

    • Product Name: DFI MD711-SU2061-000G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
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  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • Product Name: DFI EC102-XNX
    • System Type: NVIDIA Jetson Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: 91.4mm (W) x 70mm (H) x 76.6mm (D), Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
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  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen™ Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
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  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel® Atom® Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • EC100 XNX side w600

    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System

    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
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  • RC300 CS SideIO200729R2 w600

    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC

    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel® Core™ Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
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  • RC300 CS Front200721 w600

    DFI RC-300-CS AI-Enabled 5G MXM Railway System

    • Product Name: DFI RC-300-CS
    • System Type: Railway System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • VC230 ALSide190313 w600

    DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC

    • Product Name: DFI VC230-AL
    • System Type: Anti-vibration In-Vehicle PC
    • CPU: Intel Atom E3900 Series
    • RAM: 1 SODIMM Memory Support up to 8GB Single Channel DDR3L 1600/1866MHz
    • Expansion: 1 mSATA, eMMC (optional), 1 x Full-size Mini PCIe (PCIe/USB/Daul micro SIM), 1 x Full-size Mini PCIe (PCIe/USB/micro SIM), 1 x Half-size mSATA
    • Other features: Supports ignition delay on/off function, GPS Onboard, 3 SIM Slots Onboard, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
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  • RC300 CS SideIO200729R2 w600

    DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System

    • Product Name: DFI EC300-CS
    • System Type: AI-Enabled 5G MXM PoE High Performance System
    • CPU: 8th/9th Generation Intel® Core™ Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
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  • EC700 AL 1

    DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC

    • Product Name: DFI EC700-AL
    • System Type: Fanless Wide Temp Embedded Ultra Compact PC
    • CPU: Intel Atom® Processor E3900 Series, BGA 1296
    • RAM: DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
    • Expansion: Supports 2 Mini PCIe and 1 M.2 slots
    • Other features: Displays: 1 DP/HDMI combo + 1 DP/VGA, Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB, Extended operating temperature: -40 to 70°C, 15-Year CPU Life Cycle Support Until Q1’31 (Based on Intel IOTG Roadmap)
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