DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System

  • Product Name: DFI EC500-ADS
  • System Type: Fanless Embedded System
  • CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
  • RAM: Supports DDR4 SODIMM up to 64GB
  • Expansion: Three M.2 slots
  • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)

Description

DFI has once again demonstrated its expertise with the EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System. Boasting an impressive range of features and capabilities, this cutting-edge device is set to revolutionize the way we approach industrial computing.

Key Features

  • 12th Generation Intel Core with Intel H610E/Q670E/R680E
  • Supports DDR4 SODIMM up to 64GB
  • Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
  • Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0
  • Multiple Expansion: 3 M.2 slots
  • Support 5G Communication
  • Operating Temperature: -20 to 70°C
  • 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)

Specification

System

Processor
12th Generation Intel® CoreTM Processors, LGA 1700
Intel® Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8GHz); 35W
Intel® Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6GHz); 35W
Intel® Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3GHz); 35W
Intel® Core™ i3-12100TE (4 Cores, 12M Cache, to 4GHz); 35W
Intel® Pentium® G7400TE (2 Cores, 6M Cache, 3GHz); 35W
Intel® Celeron® G6900TE (2 Cores, 4M Cache, 2.4GHz); 35W
Chipset
Intel® H610E/Q670E/R680E Chipset
Memory
Two 260-pin DDR4 3200MHz SODIMM up to 64GB
BIOS
AMI SPI 128Mbit

Graphics

Controller
Intel® HD Graphics
Feature
OpenGL up to 5.0, DirectX 11, OpenCL 2.1
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit)
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8
Display
1 x VGA
2 x HDMI/DP++ (auto detection)
VGA: resolution up to 1920×1200 @ 60Hz
HDMI: resolution up to 4096×2160 @ 30Hz
DP++: resolution up to 4096×2304 @ 60Hz

Storage

Internal
2 x 2.5″ SATA 3.0 Drive Bay
support RAID 0/1 (Q670E/R680E)

Expansion

Interface
Q670E/R680E:
1 x M.2 2230 E key (PCIe/USB 2.0)
1 x M.2 2280 M key (PCIe x4 NVMe/SATA)
1 x M.2 3042/3052 B key (PCIe/USB3.0)
H610E:
1 x M.2 2230 E key (PCIe/USB 2.0)
1 x M.2 3042/3052 B key (PCIe)

Audio

Audio Codec
Realtek ALC888

Ethernet

Controller
Q670E/R680E:
1 x Intel® I225LM PCIe (10/100/1000Mbps)
1 x Intel® I219LM with iAMT11.0 PCIe (10/100/1000Mbps) (only Core i9/i7/i5 supports iAMT)
H610E:
1 x Intel® I225V PCIe (10/100/1000Mbps)
1 x Intel® I219V PCIe (10/100/1000Mbps)

LED

Indicators
1 x Status LED
1 x HDD LED

Front I/O

Serial
4 x RS-232/422/485 (DB-9)
USB
2 x USB 2.0 (type A)
DIO
8 bit (DB-9)
Buttons
1 x Power button
1 x Reset button
Wi-Fi Antenna
4 x Antenna hole

Rear I/O

Ethernet
2 x GbE (RJ-45)
Serial
2 x RS-232 (DB-9)
USB
4 x USB 3.1 (type A)
Display
VGA + 2 x HDMI/DP++ (auto detection)
Audio
1 x Line-out
1 x Mic-in

Watchdog Timer

Output & Interval
System reset, programmable via software from 1 to 255 seconds

Security

TPM
TPM 2.0

Power

Type
Wide range 9~36V
Connector
3-pole terminal nlock
3-pin power extension switch connector

OS Support

Microsoft
Windows 10 IoT Enterprise 2021 LTSC
Linux
Linux (available upon request)

Environment

Operating Temperature
-20 to 70°C (SSD or M.2 storage)
Storage Temperature
-20 to 85°C
Relative Humidity
5 to 95% RH (non-condensing)

Mechanism

Construction
Metal + Aluminium
Mounting
Wall Mount
Dimensions (W x H x D)
255.3 x 85 x 224mm
Weight
4.15 kg

Standards and Certifications

Shock
Half sine wave 3G, 11ms, 3 shock per axis
Vibration
IEC68-2-64
Certifications
CE, FCC Class A

Packing List

Packing List
1 EC500-ADS system unit
1 M.2 slot screws
1 Terminal block 3 pole for DC input
1 Cable with 2 wire stripped and tinned to DC jack

Country of Origin

Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
EC500-ADS6861-H 750-EC5005-000G EC500-ADS6861-H, Fanless, ADS263, H610E, 6 COM, 8 DIO, 6 USB, 1 VGA, 2 HDMI/DP, 2 LAN, 1 Line-out, 1 Mic-in, DC9~36V, TPM2.0, F/G SYSTEM RoHS
EC500-ADS6861-Q 750-EC5005-100G EC500-ADS6861-Q, Fanless, ADS263, Q670E, 6 COM, 8 DIO, 6 USB, 1 VGA, 2 HDMI/DP, 2 LAN, 1 Line-out, 1 Mic-in, DC9~36V, TPM2.0, F/G SYSTEM RoHS
EC500-ADS6861-R 750-EC5005-200G EC500-ADS6861-R, Fanless, ADS263, R680E, 6 COM, 8 DIO, 6 USB, 1 VGA, 2 HDMI/DP, 2 LAN, 1 Line-out, 1 Mic-in, DC9~36V, TPM2.0, F/G SYSTEM RoHS

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.