DFI EC70A-ADN Intel Alder Lake-N Ultra Compact PC
- Product Name: DFI EC70A-ADN
- System Type: Ultra Compact PC
- CPU: Intel Atom Alder Lake-N Processors
- RAM: 1 DDR5 4800 MT SO-DIMM up to 32GB
- Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
- Other Features: Dual displays: 1 HDMI, 1 Type-C DP; Rich I/O: 3 2.5GbE LAN, 4 USB 3.2, 2 USB 2.0, 1 COM, 1 Line-out, 1 Mic-in
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Description
The DFI EC70A-ADN is an ultra-compact PC powered by Intel Atom Alder Lake-N processors, delivering efficient performance for a variety of computing tasks. With support for up to 32GB of DDR5 4800 MT SO-DIMM memory, it ensures smooth multitasking and responsiveness. This compact unit features dual displays with HDMI and Type-C DP ports, providing versatile connectivity options. Additionally, it offers extensive expansion capabilities with 1 M.2 M Key, 1 M.2 B Key, and 1 M.2 E Key slots. Its rich I/O interface includes 3 2.5GbE LAN ports, 4 USB 3.2 ports, 2 USB 2.0 ports, along with 1 COM, 1 Line-out, and 1 Mic-in port, making it suitable for a wide range of applications in various industries.
Key Features
- Intel Atom Alder Lake-N Processors
- 1 DDR5 4800 MT SO-DIMM up to 32GB
- Dual Displays: 1 HDMI, 1 Type-C DP
- Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
- Rich I/O: 3 2.5GbE LAN, 4 USB 3.2, 2 USB 2.0, 1 COM, 1 Line-out, 1 Mic-in
Specification
| System |
| Chipset |
| Intel® Atom® Alder Lake-N Processors, TDP up to 15W |
| Intel® Core™ i3-N305, 8 cores, 6M Cache, up to 3.80 GHz, 15W |
| Memory |
| 1 x DDR5 4800 MT SO-DIMM up to 32GB |
| BIOS |
| AMI SPI 256Mbit |
| Graphics |
| Controller |
| Intel® UHD Graphics |
| Feature |
| OpenGL 4.6, Direct X 12.1, OpenCL 3.0 |
| HW Decode: HEVC, VP9, AV1, AVC |
| HW Encode: HEVC, VP9, AVC |
| Display |
| 1 x HDMI |
| 1 x Type-C DP Alt. Mode |
| HDMI: resolution up to 4096×2160 @24Hz |
| DP: resolution up to 3840×2160 @60Hz |
| Dual Displays |
| HDMI + Type-C DP Alt. Mode |
| Storage |
| Internal |
| 1 x M.2 M key 2280/2242 (PCIe Gen3 x1/SATA3.0) |
| Expansion |
| Interface |
| 1 x M.2 M key 2280/2242 (PCIe Gen3 x1/SATA 3.0) |
| 1 x M.2 B key 3052/3042 (USB 3.0/USB 2.0, optional PCIe x1), 1 x SIM slot for 4G/5G |
| 1 x M.2 E key 2230 (USB/PCIe x1, support CNVi) |
| Audio |
| Audio Codec |
| Realtek ALC888S |
| Ethernet |
| Controller |
| 3 x Intel® I226V/IT(10/100/1000/2500Mbps). LAN3 option with M.2 3052 PCIe x1. |
| LED |
| Indicators |
| 1 x Power LED |
| 1 x HDD LED |
| Front I/O |
| Serial |
| 1 x COM RS-232/422/485 |
| Audio |
| 1 x Mic-in |
| 1 x Line-out |
| Rear I/O |
| Ethernet |
| 3 x 2.5GbE (RJ-45) |
| USB |
| 4 x USB 3.2 |
| 2 x USB 2.0 |
| Display |
| 1 x HDMI |
| 1 x Type-C DP Alt. Mode |
| Watchdog Timer |
| Output & Interval |
| System Reset, Programmable via Software from 1 to 255 Seconds |
| Security |
| TPM |
| TPM 2.0 |
| Power |
| Type |
| Wide range 9~36V |
| Connector |
| DC Jack |
| OS Support |
| OS Support (UEFI Only) |
| Windows 10 IoT Enterprise (64-bit) |
| Linux |
| Environment |
| Operating Temperature |
| -5 to 60°C |
| Storage Temperature |
| -20 to 85°C |
| Relative Humidity |
| 5 to 95% RH (non-condensing) |
| Mechanism |
| Construction |
| Aluminium + Metal Aluminium |
| Mounting |
| Wall/VESA/DIN rail mount |
| Dimensions (W x H x D) |
| 181.6mm x 52mm x 118.4mm |
| Weight |
| TBD |
| Standards and Certifications |
| Shock |
| · Operating: |
| IEC 60068-2-27 Test Ea: Shock Test |
| Half-Sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) |
| Vibration |
| · Operating: |
| IEC 60068-2-64 Test Fh: Vibration Board-Band Random Test |
| Random, 1Grms @ 5~500 Hz, 30min |
| · Non-Operating: |
| IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test |
| Sweep Sine, 3Grms @ 10~500Hz, 30min |
| Certifications |
| CE, FCC Class A, RoHS |
| Packing List |
| Packing List |
| · 1 EC70A-ADN system unit |
| Country of Origin |
| Country of Origin |
| Taiwan |
BVM Customisation Service
Design | Develop | Test | Manufacture
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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