Description
The DFI IRN556 is a compact 3.5″ single board computer built for cost-efficient, low-power embedded and industrial applications. Powered by Intel® Atom® Processor X Series and N Series (Twin Lake / Amston Lake), it delivers reliable performance for control systems, automation, and edge devices where efficiency and long-term stability are essential. The board supports DDR5-4800 memory and dual independent displays via HDMI and LVDS, making it suitable for HMI and digital signage applications. With a flexible M.2 expansion layout, dual Intel® Gigabit Ethernet, and a rich selection of serial and USB interfaces, the DFI IRN556 provides versatile connectivity in a compact, industrial-ready form factor.
Key Features
- Intel® Atom® Processor X Series / N Series (Code Name : Amston Lake/Twin Lake)
- 1 DDR5 4800MHz SODIMM
- Dual Displays: HDMI + LVDS
- Multiple Expansion: 1 M.2 E Key, 1 M.2 B Key, 1 M.2 M Key
- Rich I/O: 2 Intel GbE, 4 COM, 4 USB 3.2, 2 USB 2.0
Specification
| Category | Specification |
| System / Processor | Intel® Atom® Processor X Series (Amston Lake) |
| x7211RE – 2 Cores, 1.0–3.2 GHz, 6W | |
| x7433RE – 4 Cores, 1.5–3.4 GHz, 9W | |
| x7835RE – 8 Cores, 1.3–3.6 GHz, 12W | |
| Intel® Processor N Series (Twin Lake) | |
| N150 – 4 Cores, 1.0–3.6 GHz, 6W | |
| Core™ 3 N355 – 8 Cores, 1.8–3.9 GHz, 15W | |
| Memory | 1 × 262-pin DDR5-4800 SODIMM, single channel, up to 16GB |
| BIOS | AMI SPI 256Mbit |
| Graphics | Intel® UHD Graphics |
| OpenGL 4.6, DirectX 12.1, OpenCL 3.0 | |
| HW Decode: HEVC, VP9, AV1, AVC | |
| HW Encode: HEVC, VP9, AVC | |
| Display | 1 × HDMI |
| 1 × LVDS | |
| HDMI: up to 4096×2160 @ 24Hz | |
| LVDS: up to 1920×1200 @ 60Hz | |
| Dual display: HDMI + LVDS | |
| Expansion | 1 × M.2 M-Key 2242 (PCIe Gen3 x2 / SATA3.0) |
| 1 × M.2 B-Key 3052 (PCIe x1 / USB3.0 / USB2.0) | |
| 1 × Nano SIM slot | |
| 1 × M.2 E-Key 2230 (USB2.0 / PCIe x1) | |
| Audio & I/O | Realtek ALC888S |
| 2 × GbE LAN | |
| 4 × USB 3.2 | |
| 2 × USB 2.0 | |
| 2 × RS-232/422/485, 2 × RS-232 | |
| 1 × Audio Line-out/Mic-in, 1 × Speaker out (5W/8Ω) | |
| 1 × LVDS LCD Panel Connector | |
| 1 × 8-bit DIO | |
| Watchdog Timer | System reset programmable via software (1–255 seconds) |
| Security | dTPM 2.0 |
| Power | 9–36V DC input, right-angle 4-pin connector |
| Typical: x7835RE 12.6W, i3-N355 12.6W, N150 12.24W | |
| Max: x7835RE 45W, i3-N355 38.88W, N150 19.8W | |
| RTC Battery | CR2032 coin cell |
| OS Support | Windows 11 & 10 IoT Enterprise (64-bit), Linux |
| Environment | Operating: -40°C ~ 85°C (15W CPU -5°C ~ 65°C) |
| Storage: -40°C ~ 85°C | |
| Humidity: 5–90% RH | |
| MTBF | 809,938 hrs @25°C; 458,347 hrs @45°C; 291,792 hrs @60°C; 215,309 hrs @70°C; 136,953 hrs @85°C |
| Mechanism | 3.5″ SBC, 146 × 102 mm (5.75″ × 4.02″), PCB height: 1.6mm |
| Certifications | CE, FCC, RoHS, UKCA |
| Packing List | 1 × IRN556 board, 1 × Heat sink (29mm, A71-008359-000G) |
| Country of Origin | Taiwan |
Ordering Information
| Model Name | Part Number | Description |
| IRN556-TN-x7835RE | 770-IRN5561-000G | Intel Atom® x7835RE, 8C, 12W, 1 DDR5 SODIMM, HDMI + LVDS, 2 GbE, 2 RS232/422/485, 2 RS232, 2 USB 3.2, 2 USB 2.0, 9–36 VDC, Fanless, Operating Temp: -40~85°C |
| IRN556-TN-x7433RE | 770-IRN5561-100G | Intel Atom® x7433RE, 4C, 9W, 1 DDR5 SODIMM, HDMI + LVDS, 2 GbE, 2 RS232/422/485, 2 RS232, 2 USB 3.2, 2 USB 2.0, 9–36 VDC, Fanless, Operating Temp: -40~85°C |
| IRN556-TN-x7211RE | 770-IRN5561-200G | Intel Atom® x7211RE, 2C, 6W, 1 DDR5 SODIMM, HDMI + LVDS, 2 GbE, 2 RS232/422/485, 2 RS232, 2 USB 3.2, 2 USB 2.0, 9–36 VDC, Fanless, Operating Temp: -40~85°C |
| IRN556-BN-N355 | 770-IRN5561-300G | Intel® Core™ 3 N355, 8C, 15W, 1 DDR5 SODIMM, HDMI + LVDS, 2 GbE, 2 RS232/422/485, 2 RS232, 2 USB 3.2, 2 USB 2.0, 9–36 VDC, Fanless, Operating Temp: -5~65°C |
| IRN556-BN-N150 | 770-IRN5561-400G | Intel® N150, 4C, 6W, 1 DDR5 SODIMM, HDMI + LVDS, 2 GbE, 2 RS232/422/485, 2 RS232, 2 USB 3.2, 2 USB 2.0, 9–36 VDC, Fanless, Operating Temp: -5~65°C |
