LEX SKY 3 – 3I130DW 13th Gen Raptor Lake Embedded PC
- Product Name: Lex SKY 3 – 3I130DW
- System Type: 13th Gen Raptor Lake Embedded PC
- CPU: Intel 13th Gen Raptor Lake-P/ Raptor Lake-U, i7 / i5 / i3, Celeron CPU
- RAM: 2 x DDR5 SODIMM (Max. 64GB)
- Expansion: 1 x Mini PCIe, 1 x M.2 M Key, 1 x M.2 B Key, 1 x Nano SIM
- Other features: Multiple Independent display: 2 x HDMI, 5 x Intel 2.5 GbE LAN, 3 x USB 3.0, 1 x USB 2.0, 2 x COM, 4DI / 4DO
Description
Introducing the SKY 3 3I130DW from LEX Systems, a compact fanless DIN-Rail computer measuring just 183W x 142.2D x 83.9H mm. Designed to deliver high-performance Edge AI solutions, it is powered by the 13th Gen Intel® Raptor Lake-P/U and 12th Gen Intel® Alder Lake-P/U processors, including i7/i5/i3/Celeron options.
The SKY 3 3I130DW is equipped with a range of I/O options, including two HDMI ports, five 2.5 Gb Ethernet ports, three USB 3.0 ports, one USB 2.0 port, and two COM ports. It also offers optional isolated digital I/Os for industrial communication and control requirements. Additionally, the M.2 slots enable the utilization of WiFi 6, 4G/5G wireless communications, providing wide-area coverage and real-time data transmission for AIoT and edge gateway applications.
With its combination of high performance and rugged mechanical design, the SKY 3 3I130DW is an ideal Edge AI solution for various projects. It excels in visual inspection, video analysis, smart traffic systems, smart factories, and intelligent medical applications that demand advanced computing capabilities even in harsh environments.
In summary, the SKY 3 3I130DW offers compact dimensions, powerful processing, and a robust mechanical design. Its diverse I/O options and support for wireless communication technologies make it an exceptional choice for Edge AI solutions in challenging environments.
Key Features
- Intel® 13th Gen Raptor Lake-P/ Raptor Lake-U, i7 / i5 / i3, Celeron CPU
- Intel® 12th Gen Alder Lake-P / Alder Lake-U, i7 / i5 / i3, Celeron CPU
- 2 x DDR5 SODIMM (Max. 64GB)
- Multiple Independent display: 2 x HDMI
- 5 x Intel 2.5 GbE LAN, 3 x USB 3.0, 1 x USB 2.0
- 1 x Mini PCIe, 1 x M.2 M Key, 1 x M.2 B Key, 1 x Nano SIM
- 2 x COM, 4DI / 4DO
Specification
| MODEL | SKY 3 3I130DW | |
|---|---|---|
| System Dimension(WxDxH) | 183W x 142.2D x 83.9H mm | |
| Weight(Incl.M/B) | 2.8 kg | |
| Mounting | DIN-Rail Mount*, System Mount* | |
| CPU | 13th Gen Raptor Lake-P/ Raptor Lake-U, i7 / i5 / i3, Celeron CPU 12th Gen Alder Lake-P / Alder Lake-U, i7 / i5 / i3, Celeron CPU |
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| Chipset | Intel Raptor Lake-P/U ; Alder Lake-P/U SoC | |
| Memory | 2 x DDR5 SODIMM socket, Max. 64GB | |
| Storage | mSATA, M.2, HDD / SSD* | |
| Expansion slots | 1 x Full Size Mini PCIe (PCIe / USB 2.0) 1 x M.2 M key Type 2280 (PCIe x 4), Support NVMe 1 x M.2 B key Type 3042 / 3052 (mSATA / USB 3.2 / USB 2.0) 1 x Nano SIM |
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| I/O ports | Network | 5 x Intel 2.5GbE |
| USB | 3 x USB 3.0, 1 x USB 2.0 | |
| Serial ports | 2 x RS232 / 422 / 485 | |
| Display | 2 x HDMI | |
| GPIO | 4 x DI / 4 x DO (option) | |
| Optional Modules & Accessory |
*SATA Kit *VESA Mounting Kit *System Mounting Kit *4G / 5G, WiFi , BT, Module, Digital I/O, 2 / 4 PoE |
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| Power | DC input : 9~36V | |
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD | |
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
| Certification | CE / FCC class A | |
| OS Support | Windows® 10 IOT ; Windows® 11 IOT Ubuntu 22.04 above, Fedora 36 above |
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BVM Customisation Service
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing & associated services: –
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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