Neousys POC-700-FT i3-N305 / Atom x7425E Ultra-compact Computer

  • Product Name: Neousys POC-700-FT
  • System Type: Ultra-compact Computer with 4x PoE+
  • CPU: Intel Alder Lake Core i3-N305 processor 15W with 8 E-Cores or Atom x7425E
  • RAM: Up to 16GB DDR5-4800 SODIMM
  • Expansion: M.2 2280 M key SATA socket
  • Other features: -25 °C to 70 °C rugged wide temperature operation, 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock, DP++ / HDMI 1.4b dual display outputs, 4-CH isolated DI + 4-CH isolated DO, Front I/O access DIN-mounting design, MezIO compatible

Description

The POC-700-FT is a standout model in Neousys‘ popular POC-700 series, designed with a distinctive flat-top heatsink that expands its application range. The heatsink’s large thermal conduction surface effectively dissipates heat to the outer shell, making the POC-700-FT ideal for use in sealed enclosures with limited airflow.

Powered by either an Intel® Core™ i3-N305 8-core/8-thread processor with 32EUs UHD Graphics, or an Atom® x7425E 4-core/4-thread processor with 24EUs UHD Graphics, this system is optimized for AI inference tasks using Intel OpenVINOTM. It supports DDR5-4800 memory and features an M.2 2280 M key NVMe slot for high-speed storage. The system includes four USB 3.2 Gen2 ports and four GigE PoE+ ports with screw-locks for secure connections to Ethernet and USB cameras. Additional connectivity includes COM ports, isolated DIO for device control, and a mini-PCIe slot for wireless modules like WiFi, LTE/5G, or CAN bus devices.

The flat-top heatsink not only enhances in-cabinet thermal management but also reduces the system’s size by 20%, making it perfect for tight spaces. It provides a fanless, efficient cooling solution for cabinets, and with its multiple Ethernet and I/O capabilities, the POC-700-FT is well-suited for demanding environments such as oil and gas, mining, or areas requiring dust and water resistance.

Key Features

  • Intel® Alder Lake Core™ i3-N305 processor 15W with 8 E-Cores or Atom® x7425E
  • Up to 16GB DDR5-4800 SODIMM
  • Flattop heatsink design
  • -25 °C to 60 °C rugged wide temperature fanless operation
  • 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
  • 4-CH isolated DI + 4-CH isolated DO
  • DP++ / HDMI 1.4b dual display outputs
  • MezIO® compatible

Specification

System Core
  POC-715 POC-712
Processor Intel® Alder Lake Core™ i3-N305 processor (8C/8T, 1.8/3.8 GHz, 15W TDP) Intel® Alder Lake Atom® x7425E processor (4C/4T, 1.5 /3.4 GHz, 12W TDP)
Graphics Integrated Intel® UHD Graphics with 32EUs Integrated Intel® UHD Graphics with 24EUs
Memory Up to 16 GB DDR5-4800 SDRAM (one SODIMM socket)
TPM Supports TPM 2.0 (fTPM/ dTPM)
Panel I/O Interface
Ethernet 4x Gb Ethernet ports by Intel® I350-AM4
PoE+ IEEE 802.3at PoE+ on port #1~ 4
Native Video Port 1x DP++, Supporting 4096 x 2160 resolution
1x HDMI1.4b, Supporting 3840 x 2160 30Hz
Serial Port 1x Software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
USB 4x USB 3.2 Gen2 ports with screw-lock
Isolated DIO 4-CH isolated DI and 4-CH isolated DO
Storage Interface
M.2 1x M.2 2280 M key socket (PCIe Gen3 x1) for NVMe SSD storage (supports SATA signal)
Expansion Bus
Mini-PCIe 1x full-size mini PCI Express socket with internal micro SIM socket
Expandable I/O 1x MezIO® expansion interface for Neousys MezIO® modules
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8 to 35V DC input
Remote Ctrl.& LED Output 1x 3-pin pluggable terminal block for remote control and PWR LED output
Mechanical
Dimension 64 (W) x 116 (D) x 176 (H) mm
Weight 1.2kg
Mounting DIN-rail mount (standard) or wall-mount (optional)
Fan Optional external-accessible 80mm x 80mm fan for system heat dissipation
Environmental
Operating Temperature -25°C ~ 70°C*
Storage Temperature -40°C ~ 85°C
Humidity 10%~90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
Safety EN62368-1
EMC CE/ FCC Class A, according to EN 55032 & EN 55024
 
[1] For sub-zero operating temperature, a wide temperature storage is required.
[2] The system was tested while mounted on an aluminum panel measuring 60(W) x 60(D) x 0.3(H) cm in a high temperature environment to simulate in-cabinet conditions. For more information, please refer to the user man
 

 

Power Backup Modules:

Power Backup Modules

PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module

Power Backup Modules

PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module

Ordering Information

POC-715-FT

Intel® Core™ i3-N305 Ultra-Compact Fanless Embedded Computer with 4x PoE+, 4x USB 3.2, MezIO® Interface and flattop heatsink

POC-712-FT

Intel® Atom® x7425E Ultra-Compact Fanless Embedded Computer with 4x GbE, 4x USB3.2, MezIO® Interface and flattop heatsink

POC-715-FT (UL Certified)

Intel® Alder Lake Ultra-Compact Embedded Computer with 4x PoE+, 4 USB 3.2, MezIO® Interface and Ul certified

Supported MezIO® Modules

Neousys MezIO® module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.

Optional Accessories

PA-60W-OW

60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 70°C

PA-120W-OW

120W AC/DC power adapter with 20V, 6A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60°C

PA-160W-OW

160W AC/DC power adapter 20V/ 8A; 18AWGx4C/ 120cm, cord end terminals for terminal block, operating temperature : -30°C to 70°C

Cbl-DB9F-3DB9M-15CM

1x DB9 (Female) to 3x DB9 (Male), length: 15CM

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.