Description
Introducing the POC-700 from Neousys, a cutting-edge ultra-compact embedded controller representing the next generation in technology. This remarkable device offers a choice between the latest Intel® Alder Lake processors, the i3-N305 or x7425E, providing a substantial boost in CPU performance, up to 1.3 times more compared to its predecessor, the POC-500 series.
The Neousys POC-700 is equipped with the Intel Alder Lake i3-N305, boasting an impressive 8-core/8-thread processor with 32EUs UHD Graphics, or the Atom® x7425E with a 4-core/4-thread configuration and 24EUs UHD Graphics, optimized for supporting Intel OpenVINO™ for AI inference capabilities. To enhance overall system performance, the POC-700 utilizes DDR5-4800 memory, offering an astonishing 1.8 times more memory bandwidth than DDR4.
This compact powerhouse features four USB3.2 Gen2 ports and four GigE PoE+ ports with secure screw lock mechanisms, facilitating the connection and protection of industrial cameras for machine vision applications. For high-definition display needs, HDMI and DP video outputs are available. In terms of connectivity and expansion options, the POC-700 is well-equipped with isolated DIO for device monitoring and control, an M.2 2280 M key slot for SATA SSD, and a mini-PCIe socket suitable for wireless WiFi, LTE/5G, or CAN bus devices.
Measuring a mere 64 x 116 x 176mm, the ultra-compact POC-700 effortlessly fits into confined spaces and seamlessly upgrades from the POC-500 series, maintaining an identical footprint. With the advantages of the latest Intel CPU performance, a fanless design capable of withstanding wide temperature ranges, and an abundance of interfaces tailored for industrial cameras and I/Os, the POC-700 is the ideal choice for machine vision and smart city applications.
Key Features
- Intel® Alder Lake Core™ i3-N305 processor 15W with 8 E-Cores or Atom® x7425E
- Up to 16GB DDR5-4800 SODIMM
- -25 °C to 70 °C rugged wide temperature operation
- 4x GbE ports PoE+ / 4x USB3.2 Gen 2 with screw-lock
- M.2 2280 M key SATA socket
- DP++ / HDMI 1.4b dual display outputs
- 4-CH isolated DI + 4-CH isolated DO
- Front I/O access DIN-mounting design
- MezIO® compatible
Specification
| System Core | ||
|---|---|---|
| POC-715 | POC-712 | |
| Processor | Intel® Alder Lake Core™ i3-N305 processor (8C/8T, 1.8/3.8 GHz, 15W TDP) | Intel® Alder Lake Atom® x7425E processor (4C/4T, 1.5 /3.4 GHz, 12W TDP) |
| Graphics | Integrated Intel® UHD Graphics with 32EUs | Integrated Intel® UHD Graphics with 24EUs |
| Memory | Up to 16 GB DDR5-4800 SDRAM (one SODIMM socket) | |
| TPM | Supports TPM 2.0 (fTPM/ dTPM) | |
| Panel I/O Interface | ||
| Ethernet | 4x Gb Ethernet ports by Intel® I350-AM4 | |
| PoE+ | IEEE 802.3at PoE+ on port #1~ 4 | – |
| Native Video Port | 1x DP++, Supporting 4096 x 2160 resolution 1x HDMI1.4b, Supporting 3840 x 2160 30Hz |
|
| Serial Port | 1x Software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2) |
|
| USB | 4x USB 3.2 Gen2 ports with screw-lock | |
| Isolated DIO | 4-CH isolated DI and 4-CH isolated DO | |
| Storage Interface | ||
| M.2 | 1x M.2 2280 M key socket (PCIe Gen3 x1) for NVMe SSD storage (supports SATA signal) | |
| Expansion Bus | ||
| Mini-PCIe | 1x full-size mini PCI Express socket with internal micro SIM socket | |
| Expandable I/O | 1x MezIO® expansion interface for Neousys MezIO® modules | |
| Power Supply | ||
|---|---|---|
| DC Input | 1x 3-pin pluggable terminal block for 8 to 35V DC input | |
| Remote Ctrl.& LED Output | 1x 3-pin pluggable terminal block for remote control and PWR LED output | |
| Mechanical | ||
| Dimension | 64 (W) x 116 (D) x 176 (H) mm | |
| Weight | 1.2kg | |
| Mounting | DIN-rail mount (standard) or wall-mount (optional) | |
| Fan | Optional external-accessible 80mm x 80mm fan for system heat dissipation | |
| Environmental | ||
| Operating Temperature | -25°C ~ 70°C* | |
| Storage Temperature | -40°C ~ 85°C | |
| Humidity | 10%~90% , non-condensing | |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 | |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II | |
| Safety | EN62368-1 | |
| EMC | CE/ FCC Class A, according to EN 55032 & EN 55024 | |
Power Backup Modules:
|
PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module |
PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module |
Ordering Information
POC-715
Intel® Core™ i3-N305 Ultra-Compact Embedded Computer with 4x PoE+, 4x USB 3.2 and MezIO® Interface
POC-712
Intel® Atom® x7425E Ultra-Compact Embedded Computer with 4x GbE, 4x USB3.2 and MezIO® Interface
POC-700-FT (flattop heatsink)
Intel® Alder Lake Ultra-Compact Embedded Computer with 4x PoE+, 4 USB 3.2, MezIO® Interface and flattop heatsink
Supported MezIO® Modules
Neousys MezIO® module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.
Optional Accessories
PA-60W-OW
60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 70°C
PA-120W-OW
120W AC/DC power adapter with 12V, 10A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60°C
Wmkit-V-POC500
Wall-mount assembly for POC-500 and POC-700 series, vertical type
Wmkit-H-POC500
Wall-mount assembly for POC-500 and POC-700 series, horizontal type
Cbl-DB9F-3DB9M-15CM
1x DB9 (Female) to 3x DB9 (Male), length: 15CM
AccsyBx-FAN-POC-700
Fan assembly for POC-700 series, 80x80x15 mm
