AAEON BOXER-8742AI AI System with NVIDIA Jetson T4000 64Gb

  • Product Name: AAEON BOXER-8742AI
  • System Type: AI Edge Computing System with NVIDIA Jetson Thor
  • CPU: NVIDIA Jetson T4000
  • RAM: Not specified (depends on Jetson module configuration)
  • Expansion: M.2 slots for 5G, Wi-Fi, and NVMe SSD
  • Other Features: 5GbE LAN x1, 1GbE LAN x4 with PoE/PSE 802.3af (Max. 60W), RS-232/422/485, CAN FD, DIO/GPIO, wide operating temperature -25°C to 60°C

Description

The AAEON BOXER-8742AI is a high-performance AI edge computing system powered by the NVIDIA® Jetson Thor platform, designed for demanding industrial and AI applications. It delivers advanced processing capabilities for AI inference, machine learning, and computer vision tasks in edge environments.

The system features multiple connectivity options including 5GbE LAN, four 1GbE LAN ports with PoE/PSE 802.3af support (up to 60W), and versatile serial and digital I/O interfaces such as RS-232/422/485, CAN FD, and DIO/GPIO. Expansion flexibility is provided through M.2 slots for 5G, Wi-Fi, and NVMe SSDs, enabling scalable storage and wireless connectivity. With a wide operating temperature range of -25°C to 60°C, the BOXER-8742AI is built for reliable, always-on operation in harsh industrial and edge computing environments.

Key Features

  • NVIDIA® Jetson T4000™
  • 5GbE LAN x 1
  • 1GbE LAN x 4 with PoE/PSE 802.3af (Max. 60W)
  • RS-232/422/485, CAN FD, DIO/GPIO
  • M.2 expansion for 5G, Wi-Fi, and NVMe SSD
  • -25°C – 60°C Operating Temperature

Specification

Specification Details
AI Accelerator NVIDIA® Jetson T4000™
CPU 12-core Arm® Neoverse®-V3AE 64-bit
GPU 1536-core NVIDIA Blackwell architecture GPU with 64 fifth-gen Tensor Cores
System Memory 64 GB 256-bit LPDDR5X
Storage Device M.2 2280 M-Key x1 for NVMe
Display Interface HDMI 2.0 x1
Ethernet 5GbE LAN x1 (RJ-45), 1GbE LAN x4 with PoE 802.3af/at, Max 60W
I/O Ports USB 3.2 Gen 2 Type-A x4
DB-15 x1 for RS-232/422/485 & DIO x8
DB-9 x1 for RS-232 & CAN FD x2
Mini USB x1 for OS Flash
Recovery Button x1, Reset Button x1, Power Button x1
External SMA Antenna x6, SIM Slot x2
Expansion M.2 2280 M-Key x1 for NVMe
M.2 3042/3052 B-Key x1 for 4G/5G (USB 3.0 + PCIe)
M.2 2230 E-Key x1 for WiFi/BT/NVMe
Indicators Power LED x1
OS Support NVIDIA Jetpack™ 7.0 and up
Power Supply 2-pin 12V–24V DC Input Phoenix Connector
Mounting / Mechanical TBD
Dimensions (W x D x H) 8.26” x 6.46” x 2.91” (210mm x 164.2mm x 74mm)
Weight Gross: TBD, Net: TBD
Operating Temperature -25°C ~ 60°C (13°F ~ 140°F), with 0.7 m/s airflow, per IEC60068-2
Storage Temperature -40°C ~ 85°C (-40°F ~ 185°F)
Storage Humidity 5% ~ 95% @ 40°C, non-condensing
Anti-Vibration 3.5G, 5–500Hz (operating)
Anti-Shock 50G peak acceleration, 11ms
Certification CE / FCC Class A

Side-by-side comparison for the AAEON BOXER-8742AI, AAEON BOXER-8741AI and BOXER-8740AI

Specification BOXER-8742AI BOXER-8741AI BOXER-8740AI
AI Accelerator NVIDIA® Jetson T4000™ NVIDIA® Jetson T5000™ NVIDIA® Jetson T5000™
CPU 12-core Arm® Neoverse®-V3AE 64-bit 14-core Arm® Neoverse®-V3AE 64-bit 14-core Arm® Neoverse®-V3AE 64-bit
GPU 1536-core NVIDIA Blackwell GPU, 64 fifth-gen Tensor Cores Higher-performance GPU integrated in T5000™ 2560-core NVIDIA Blackwell GPU with fifth-gen Tensor Cores
System Memory 64GB 256-bit LPDDR5X 128GB onboard LPDDR5X 128GB 256-bit LPDDR5X
Ethernet / Networking 5GbE LAN ×1, 1GbE LAN ×4 with PoE 802.3af (Max 60W) QSFP28 ×1 for 4×25GbE, 5GbE LAN ×4, PoE 802.3af/at (Max 60W) QSFP28 ×1 for 4×25GbE, 5GbE LAN ×1
Expansion M.2 for 5G, Wi-Fi, NVMe SSD M.2 for 5G, Wi-Fi 6, NVMe SSD M.2 for 5G, Wi-Fi / Wi-Fi 7, NVMe SSD
I/O RS-232/422/485, CAN FD, DIO/GPIO RS-232, RS-485 ×2, CAN FD ×2, DIO/GPIO, advanced MIPI CSI-2, I²C, SPI, UART, fan, audio, SMA antenna, SIM slots USB 3.2 Gen 2 ×2, USB 2.0 ×2, Micro USB (OS flash), control buttons
Operating Temperature -25°C ~ 60°C -20°C ~ 60°C 0°C ~ 40°C
Industrial Rating Rugged edge AI MIL-STD-810H vibration/shock, industrial-grade Industrial-grade (TBD)
Use Case Mid-range AI inference, edge AI tasks High-performance AI workloads, multi-camera and high-bandwidth industrial applications High-speed edge AI, networking-intensive AI inference, data-driven industrial applications

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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