RAM: Onboard LPDDR5 4800, Single Channel (Max. 16GB)
Expansion: Full-Size mSATA/mPCIe x 1, M.2 2230 E-key x1
Other features: HDMI1.4, eDP1.4/LVDS, Dual Ethernet (2.5GbE & 1GbE), USB 3.2 Gen2 x 2, RS-232/422/485 x 2, TPM 2.0, SATA 6Gbps, DC 9~36V input (Optional)
Module Form Factor: COM Express Mini Module Type 10
CPU: Intel Tiger Lake UP3 processors
RAM: 16GB LPDDR4X 4266MT/s, IBECC support
Expansion: USB4 compliance supported by carrier board design, NVMe SSD
Other Features: Operating temperatures: Standard 0 ~ 60 °C (32 ~ 140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F), Supports SUSI, DeviceOn, and Edge AI Suite
Module Form Factor: SMARC 2.0/2.1 Computer-on-Module
CPU: NXP Arm Cortex-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz, 1 x Arm Cortex-M7 core
RAM: Onboard LPDDR4 6 GB, 4000MT/s memory
Expansion: 4 x USB 2.0, 1 x USB 2.0 OTG, 4 x UART, 5 x I2C, 14 x GPIO, 1 x PCIe 3.0, 2 x Gigabit LAN, 2 x CAN-FD
Other Features: 1 x 4 lane MIPI-CSI, 1 x Dual channel LVDS or 1 x Display Port, neural network accelerator up to 2.3 TOPS, supports Windows 10 IoT Enterprise on Arm, Yocto Linux BSP
CPU: Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz
RAM: Onboard 2GB LPDDR4 memory
Expansion: 2 x USB 3.0, 3 x USB 2.0, 1 x USB 2.0 OTG, 3 x UART, 12 x GPIO, 1 x PCIe 2.0, 1 x SATA, 1 x 4-lane MIPI CSI, Gigabit LAN
Other Features: Support HDMI 2.0 4K 60fps, 1 x DP, 1 x eDP, 1 x LVDS, 4K H.264/H.265 video decoder, support for Debian Linux and Android
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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