CPU: Intel x7425E (Alder Lake-N, 12W TDP) or Intel x7433RE (Amston Lake, 9W TDP)
RAM: 1 × DDR5 4800MHz SO-DIMM slot supporting up to 32GB
Expansion: 1 × SATA III, 1 × M.2 M-key, 1 × M.2 B-key, 1 × M.2 E-key
Other Features: Dual 2.5GbE LAN, 6 × COM ports, 8 × USB ports, triple 4K display support (2 × HDMI, 1 × USB-C DP), wide 12–28V DC input with RVP, OCP, and OVP protection
This product has multiple variants. The options may be chosen on the product page
Expansion: 1x M.2 2280 M key with PCIe-Gen 4×4, 2x full-size mPCIe
Other Features: EN 50155 and EN 45545 compliance, NVIDIA RTX 2000 ADA, 43V-160V wide-range DC input via M12 K-Coded connector, 9x GbE ports via M12 X-Coded connectors, -40°C to 55°C fanless operation
This product has multiple variants. The options may be chosen on the product page
CPU: Intel 15th Gen Core Processors with R680E Chipset
RAM: 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
Expansion: 1 x PCIe x16 (Up to PCIe Gen5) or 2 x PCIe x8 (Up to PCIe Gen5), 2 x PCIe x 4 (PCIe Gen4), 2 x M.2 Key M, 2 x M.2 Key B, 1 x M.2 Key E
Other features: 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO; 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro); 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
This product has multiple variants. The options may be chosen on the product page
Other features: USB 3.2 Gen 2 x 3 (10Gbps), USB 2.0 x 1, 2.5GbE LAN x 1 (Intel I226-LM), GbE LAN x 1 (Intel I219-LM), Wide Operating Temperature, Onboard TPM 2.0
This product has multiple variants. The options may be chosen on the product page
Expansion: M.2 3052 B-Key for 5G Module, Quadruple LAN (GbE x 3, 2.5GbE x 1)
Other features: Four Independent Displays (A2 Model), SuperSpeed+ USB 3.2 Gen 2 (10Gbps) x 8, Onboard TPM 2.0, Hailo-8 M.2 2280 AI Accelerator Module Support (Optional)
This product has multiple variants. The options may be chosen on the product page
CPU: 13th/12th Generation Intel Core with Intel H610E/R680E Chipset
RAM: Supports DDR5 SODIMM up to 64GB
Expansion: 5 M.2 slots
Other Features: Rich I/O connectivity: 2 2.5GbE, 4 GbE (or 2 GbE, 2 PoE), 10 COM, 5 USB 3.2 (Gen2x1), 1 USB Type-C; Supports 5G Communication; Operating Temperature: -20 to 70°C; 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
Motherboard Form Factor: 3.5-inch Single Board Computer (SBC)
CPU: Intel Core Ultra Processors in FCBGA2049 package
RAM: Supports 2 x DDR5 SO-DIMM, up to 96 GB at 5600 MHz
Expansion: 1 x MiniPCIe with SIM slot, 2 x M.2 Key M 2280, 1 x M.2 Key E 2230
Other Features: Triple Gigabit LAN, integrated Intel Arc Graphics, onboard LVDS, HDMI, DP++, and Type-C (DP Alt Mode) for up to four displays, support for 2 x SATA3, 2 x RS232, 2 x RS232/422/485, and 3 x USB3.2 Gen2 ports, DC input 9–35V
This product has multiple variants. The options may be chosen on the product page
CPU: Intel Atom x7000E Series and Intel Processor N-Series
RAM: DDR5 4800MHz SODIMM, Max 16GB
Expansion: M.2 2280 M-Key x 1, M.2 2230 E-Key x 1, M.2 3042/52 B-Key x 1 with SIM socket
Other Features: HDMI 2.0 x 2, DP 1.2 x 1, LVDS/eDP x 1, USB 3.2 x 2, USB 2.0 x 6, GbE x 2, RS-232/422/485 Pin Header x 2, RS-232 Pin Header x 4, SATA III x 1, 12V DC input
This product has multiple variants. The options may be chosen on the product page
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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