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AAEON MIX-MTLD1 14th Gen Core Ultra (Meteor Lake) Mini-ITX SBC

  • Product Name: AAEON MIX-MTLD1
  • Motherboard Form Factor: Mini-ITX
  • CPU: Supports Intel Core Ultra processors (H-series & U-series)
  • RAM: Dual Channel DDR5, up to 5600MHz, Max 96GB
  • Expansion: PCIe [x8] (SKU dependent), M.2 B-Key (3042/52), E-Key (2230), M-Key (2280)
  • Other features: HDMI 2.0 x 4, USB 3.2 Gen 1 Type-C x1, USB 3.2 x3, USB 2.0 x5, SATA 6Gb/s x2, Intel I210-AT & I226-V LAN, 12V DC-in, OOB module support via i210-AT
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Description

The AAEON MIX-MTLD1 is a high-performance Mini-ITX motherboard supporting Intel Core Ultra processors. Designed for demanding embedded applications, it offers DDR5 memory support, versatile expansion options, dual LAN, and multiple display outputs.

Key Features

  • Intel Core Ultra processors (H-series & U-series support)
  • Dual Channel DDR5 Support, 5600MHz, Max 96GB
  • HDMI 2.0 x 4
  • M.2 3042/52 B-Key x 1, M.2 2230 E-Key x 1, M.2 2280 M-Key x 1
  • USB 2.0 x 5, USB 3.2 x 3
  • USB 3.2 Gen 1 (Type-C) x 1
  • Intel® Ethernet Controller I210-AT x 1, Intel® Ethernet Controller I226-V x 1
  • SATA 6Gb/s x 2
  • 12V DC-in power
  • PCIe [x8] x 1 (SKU dependent)
  • OOB Module Support: MOD-RMB (via i210-AT)

Specification

Category Specification
Processor Intel® Core™ Ultra processors (H-series & U-series), TDP: 15W (U-series) / 28W (H-series)
Chipset —
Memory Dual Channel DDR5 5600MHz SODIMM x2, Max 96GB
I/O Chipset Nuvoton NCT6126D
Ethernet Intel® I210-AT x1, Intel® I226-V x1
Audio Realtek® ALC897
TPM Onboard TPM 2.0
Expansion Slots M.2 2230 E-Key x1, M.2 3042/52 B-Key x1 with Nano SIM, M.2 2280 M-Key x1, PCIe Gen 5 [x8] (H-series)
BIOS 256Mbit Flash ROM, AMI BIOS
H/W Monitor CPU/System temp, Vcore/5V/3.3V/12V, Fan monitor
Watchdog Timer 1–255 steps via software
Smart Fan Control CPU Fan
Wake On LAN / PXE Yes
Power State S4, S5
Graphics Chipset Intel® Arc™ Graphics
Display Support Quad Display
HDMI HDMI 2.0 x4 (up to 4096×2160 @60Hz, with audio)
LVDS Dual-channel 18/24-bit (1920×1080 @60Hz, co-layout with eDP)
eDP Up to 4096×2160 @60Hz (4ch, co-layout with LVDS)
Battery Lithium battery
Power Requirement DC 12V ±5%, Peak power 150W
Operating Temp 0 ~ 60°C (32°F ~ 140°F), 90% RH Non-Condensing
Storage Temp -40°C ~ 85°C (-40°F ~ 185°F)
Certification CE & FCC (Class A)
Form Factor Mini-ITX (6.7” x 6.7” / 170mm x 170mm)
Weight 1.1 lb (0.5 kg)
USB (Rear I/O) USB 3.2 Gen 2 (Type-A) x1, USB 3.2 Gen 1 (Type-C) x1, USB 2.0 x3
Display I/O (Rear) HDMI 2.0 x4
Audio I/O (Rear) Line-out x1, MIC-in x1
LAN I/O (Rear) RJ-45 x2
Internal Storage I/O SATA 6Gb/s x2 (RAID 0,1), M.2 2280 M-Key (PCIe Gen 4 [x4], NVMe)
Internal USB USB 3.2 Gen 1 Header x1 (2 ports), USB 2.0 Header x1 (2 ports)
Internal Display I/O LVDS/eDP Header x1
Internal Audio I/O 1×4-pin Header, 2W/4ohm x1
Serial Ports RS-232/422/485 x1, RS-232 x3 (Box Headers)
DIO 8-bit programmable (4-in/4-out) x1
Fan Connector 4-pin CPU Fan x1
Power Connector 2×4-pin 12V DC-in x1
Other Internal I/O Clear CMOS, Front Panel, Buzzer, ATX/AT Mode Select, ME Disable, Voltage Selectors, NCSI Header
OS Support Windows® 10/11 64-bit, Ubuntu 24.04 (Kernel 6.8)

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Datasheet

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BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing
Lifecycle

Materials Management
Logistics

Logistics and Tracking
Manufacturing

External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test		 • Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System		 • Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels		 • Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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