Description
The DFI ADN9A2 is a compact COM Express Mini module powered by Intel Atom Alder Lake-N Series processors. It supports up to 16GB of LPDDR5 4800MHz RAM for efficient multitasking. Designed for versatility, it offers multiple expansion options, including 4 PCIe x1, SMBus, I2C, and eMMC. With dual display support (DDI + LVDS/eDP), high-speed 2.5GbE Ethernet, and a rich set of USB interfaces, this module is ideal for industrial and embedded applications requiring reliability and performance in a small form factor.
Key Features
- Intel Atom Processor Alder Lake-N Series
- Dual Channel LPDDR5 4800MHz up to 16GB
- 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP
- Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
- Rich I/O: 2 USB 3.2, 8 USB 2.0
- High Speed Ethernet: Supports 100M/1000M/2.5Gbps
Specification
| System | Specifications |
| Processor | Intel® Atom x7000E / Core-i / Pentium / Celeron series (Alder Lake-N) |
| Intel® Atom x7425E, 4 Cores, 1.5~3.4GHz, 12W | |
| Intel® Atom x7213E, 2 Cores, 1.7~3.2GHz, 10W | |
| Intel® Atom x7211E, 2 Cores, 1.0~3.2GHz, 6W | |
| Intel® Core i3-N305, 8 Cores, 1.0/1.8~3.8GHz, 9/15W | |
| Intel® Processor N200, 4 Cores, 1.0~3.7GHz, 6W | |
| Intel® Processor N97, 4 Cores, 2.0~3.6GHz, 12W | |
| Intel® Processor N50, 2 Cores, 1.0~3.4GHz, 6W | |
| Memory | LPDDR5 up to 16GB, Dual Channel LPDDR5 4800MHz |
| 8GB/16GB supported by project basis | |
| In-band ECC (IBECC) supported by all CPU SKUs | |
| BIOS | AMI SPI 256Mbit |
| Graphics | Controller: Intel® UHD |
| Features: Open GL 4.6, DirectX 12.1, Vulkan 1.2 (Windows) | |
| Mesa 3D, Open GL 4.6, Vulkan 1.2 (Linux) | |
| Hardware Decode: 4K60 10b 4:2:0, HEVC/VP9/SCC, 4K60 10b 4:2:0 AV1 | |
| Hardware Encode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC | |
| Display | 1 x DDI, 1 x LVDS/eDP |
| LVDS: Single Channel 24-bit, up to 1920×1200 @ 60Hz | |
| eDP: Up to 4096×2160 @ 60Hz | |
| HDMI: Up to 4096×2160 @ 30Hz | |
| DP++: Up to 4096×2160 @ 60Hz, 3840×2160 @ 60Hz | |
| Dual Display Support: DDI + LVDS/eDP | |
| Expansion | 4 x PCIe x1 (Gen 3), 1 x I2C, 1 x SMBus, 1 x LPC |
| 1 x SNDW (available upon request), 1 x GSPI, 2 x UART (TX/RX) | |
| Audio | HD Audio |
| Ethernet | 1 x Intel® I226-IT / I226-LM (10/100/1000Mbps/2.5Gbps) |
| I/O | USB: 2 x USB 3.2 Gen2, 8 x USB 2.0 |
| SATA: 2 x SATA 3.0 (up to 6Gb/s) | |
| eMMC: 1 x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request) | |
| DIO: 1 x 8-bit DIO | |
| Watchdog Timer | System Reset, Programmable via Software (1 to 255 sec) |
| Security | TPM (dTPM or fTPM, optional) |
| Power | Type: 4.75V20V, 5VSB, VCC_RTC (ATX mode) / 4.75V20V, VCC_RTC (AT mode) |
| Consumption: TBD | |
| OS Support | Windows 11/10 IoT Enterprise 64-bit, Linux |
| Environment | Operating Temp: -5 to 65°C |
| Storage Temp: -40 to 85°C | |
| Humidity: Operating: 5 to 90% RH, Storage: 5 to 90% RH | |
| MTBF | TBD |
| Mechanism | Form Factor: COM Express® Mini (84mm x 55mm) |
| Compliance: PICMG COM Express® R3.1, Type 10 | |
| Certifications | CE, FCC |
| Packing List | Heat Sink, A71-008356-000G |
| Country of Origin | Taiwan |
Ordering Information
| Model Name | Part Number | Description |
| ADN9A2-BC16-7425E | 770-ADN9A21-100G | Intel® Atom Processor x7425E, 4 Cores, 12W, 16GB LPDDR5, 64GB eMMC, LVDS, Thermal Heat Sink, 0 to 60°C |
| ADN9A2-BC86-N305 | 770-ADN9A21-300G | Intel® Core i3 Processor N305, 8 Cores, 9/15W, 8GB LPDDR5, 64GB eMMC, LVDS, Thermal Heat Sink, 0 to 60°C |
| ADN9A2-BC86-N50 | 770-ADN9A21-600G | Intel® Processor N200, 2 Cores, 6W, 8GB LPDDR5, 64GB eMMC, eDP, Thermal Heat Sink, 0 to 60°C |
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