DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

  • Product Name: DFI EC90A-GH
  • System Type: Ultra Small Mini PC Fanless Embedded System
  • CPU: AMD Ryzen Embedded R1000 Series
  • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
  • Expansion: 1 x Mini-PCIe (PCIe signal)
  • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)

Description

  • AMD Ryzen™ Embedded R1000 Series
  • Ultra Small Size: 110 x 80mm x 60mm (W x H x D)
  • Expansion Options of 2 serial ports or LTE or WiFi
  • User friendly of installing SIM card design
  • I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI
  • 10-Year CPU Life Cycle Support Until Q1′ 30 (Based on AMD Roadmap)

EC90A-GH Specification

System
 
Processor
AMD Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12W
AMD Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12W
AMD Ryzen™ Embedded R1305G, Dual Core, 3 CU, 1.5GHz (2.8GHz), 8-10W
AMD Ryzen™ Embedded R1102G, Dual Core, 3 CU, 1.2GHz (2.6GHz), 6W
Memory
One DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
BIOS
AMI SPI 64bit
Graphics
 
Controller
AMD Vega GPU with up to 3 computing units.
Feature
H.265 decode/encode support, VP9 decode.
Display
2 x Micro HDMI (HDMI 1.4)
Storage
 
Internal
eMMC up to 16/32/64/ 128GB
Expansion
 
Interface
1 x Mini-PCIe (PCIe signal)
Ethernet
 
Controller
1 x I211AT PCIe or 1 x Intel I210IT (optional)
LED
 
Indicators
Power status
Front I/O
 
Ethernet
1 x GbE
USB
1 x USB 3.1 Gen2 type C
Display
2 x Micro HDMI (HDMI 1.4)
Rear I/O
 
Antenna
2 x Antenna (LTE or WiFi, via module) (optional)
Not available if selecting 2 x RS-232
Combo Port
(option 1) 1 x 8-bit DIO + 1 x SMBus
(option 2) 2 x RS-232
(two optional sku)
Watchdog Timer
 
Output & Interval
System reset, programmable via software from 1 to 255 seconds
Security
 
TPM
fTPM 2.0
Power
 
Type
12V DC-in
Connector
DC Jack with lock
OS Support
 
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Linux
Environment
 
Operating Temperature
0~45°C
Storage Temperature
-40~85°C
Relative Humidity
5 to 90% RH (non-condensing)
Mechanism
 
Construction
Metal + Aluminium
Mounting
Wall mount /VESA mount
Dimensions (W x H x D)
110mm x 80mm x 60mm
Weight
700g
Standards and Certifications
 
Shock
Non-Operational Half-sine waveform: 5G
Vibration
Non-Operational Vibration 1.5 G
Certifications
CE, FCC
Country of Origin
 
Country of Origin
Taiwan
 
 
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.