DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

  • Product Name: DFI ECX700-AL
  • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
  • CPU: Intel Atom Processor E3900 Series
  • RAM: 4GB DDR3 onboard, 64G eMMC
  • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
  • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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Description

The DFI ECX700-AL challenges any outdoor operation – combatting and beating every environmental factor that can potentially impact performance around a PC solutions durability.

Climate change brings with it harsh conditions and the ability to withstand water and dust is often seen as a direct indicator of a rugged computer’s ability to operate outdoors. Operation within wide temperature range also plays a decisive factor in ensuring stable operation – with additional consideration to the following :-

  • Even with a waterproof enclosure, the system may still experience condensation internally because of diverse exterior temperatures (hot & cold) being prevalent
  • During operation under the sun, once the external temperature reaches 40° C, the system internally can quite easily experience temperatures over 60° C with the effect of both sun & internal components

Designed to counter these issues, the DFI ECX700-AL provides a smart vent to drain off water automatically. With a white resistive painted enclosure design and a system design to allow wide-temperature operation from -40 to 70° C, the DFI ECX700-AL reliably functions under the sun and resisting levels of heat.

Cellular connectivity is provided via an external SIM slot to facilitate easy load/unload of SIMs – and the high-gain antenna ensures quality of signal.

Amongst the versatile I/O that the DFI ECX700-AL possesses settings are  2 x CAN Bus and 2 x RS232 ports and selective display ports (HDMI/VGA) help integrators in meeting demand for flexibility around display output.

Key Features

  • Intel® Atom® Processor E3900 Series
  • Ruggedized IPC67 Grade Box PC
  • Outdoor IoT Gateway Application
  • 4GB DDR3 onboard, 64G eMMC
  • Operating temperature: -40° to 70° C
  • 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)

Specification

System
 
Processor
Intel® Atom® Processor E3900 Series, BGA 1296 Intel® Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W Intel® Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W Intel® Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6W
Memory
2GB/4GB/8GB memory onboard
BIOS
AMI SPI 128Mbit (supports UEFI/Legacy mode and Security Boot (optional)
Graphics
 
Controller
Intel® HD Graphics
Feature
OpenGL 4.2, Direct X 11.1, OpenCL 1.2, OGL ES 3.0 HW Decode: H.264, MPEG2, VC1, VP8, H.265, MPEG4, MVC, VP9, WMV9, JPEG/MJPEG HW Encode: H.264, MPEG4, VP8, H.265, MVC
Display
1 x HDMI or VGA VGA: resolution up to 1920 x 1200@60Hz HDMI: resolution up to 3840×2160@30Hz
Storage
 
Internal
Support EMMC up to 8G/16GB/32GB/64GB (optional)
Expansion
 
Interface
1 x Full-size Mini PCIe for 4G LTE module 1 x Full-size Mini PCIe for Canbus 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
Ethernet
 
Controller
2 x Intel® I210AT PCIe (10/100/1000Mbps)
LED
 
Indicators
1 x Power Status LED
Front I/O
 
Display
1 x HDMI or 1 x VGA (optional)
Antenna
2 x Antenna (WiFi)
SIM
1 x SIM card slot
Top I/O
 
Vent
1 x Vent
Antenna Hole
2 x Antenna (LTE)
Bottom I/O
 
Ethernet
2 x GbE
USB
2 x USB 3.0
Combo Port
2 x RS232 and 2 x Can bus protocol
Power
1 x 9~36V DC-IN
Watchdog Timer
 
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
 
TPM
TPM 1.2/ 2.0
Power
 
Type
DC-in 9~36V
Connector
M12 D-code
OS Support
 
OS Support
Windows 10 IoT Enterprise 64-bit Linux
Environment
 
Operating Temperature
-40 to 70°C (E3950,E3940, E3930 only)
Storage Temperature
-40 to 85°C
Relative Humidity
5 to 95% RH (non-condensing)
Mechanism
 
Mounting
Wall Mount
Dimensions (W x H x D)
217 x 188 x 87 mm ( with wall-mount bracket)
Weight
2.1 kg
Standards and Certifications
 
Shock
Operation shock test: Half Sine Wave 15G, 11ms, 3 Shock Per Axis
Vibration
Operation Vibration test: MIL-STD-810G 514.6C-2, Figure 514.6C-2
Certifications
CE, FCC class A
Construction
IP67 enclosure
Country of Origin
 
Country of Origin
Taiwan
 
Ordering Information    
Model Name Part Number Description
ECX700-AL TBD ECX700-AL-B00: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN
ECX700-AL TBD ECX700-AL-BW0: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, WiFi
ECX700-AL TBD ECX700-AL-PC0: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM
ECX700-AL TBD ECX700-AL-PC1: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM + 2 CAN
ECX700-AL TBD ECX700-AL-PC2: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM + 2 CAN, WiFi
ECX700-AL TBD ECX700-AL-PC3: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 1 HDMI or VGA, 2 COM + 2 CAN, WiFi, LTE
ECX700-AL TBD ECX700-AL-PC4: E3950, 4G memory down, 64G eMMC, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM + 2 Can, WiFi, LTE
ECX700-AL TBD ECX700-AL-I00: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, WiFi, LTE

  If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

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External Manufacturing

• Burn in Test
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• Conventional Through Hole Insertion & Assembly
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