DFI GH551 AMD Ryzen V1000/R1000 Series 3.5" SBC

DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

Product Name: DFI GH551
Motherboard Form Factor: 3.5″ SBC
CPU: AMD Ryzen V1000/R1000 Series
RAM: 1 DDR4 2400MHz SODIMM up to 16GB
Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)

SKU: GH551 Category: 3.5" Single Board Computers Tags: GPIO / DIO, IoT, Multi Display - Quad, Powered by AMD, Rugged, Ryzen Embedded, TPM 2.0, Wide Temp Brand: DFI

Description

Unleash the power of advanced processing with the DFI GH551 3.5″ SBC, featuring the AMD Ryzen V1000/R1000 Series CPU. This compact yet powerful single board computer supports up to 16GB DDR4 2400MHz SODIMM, ensuring high performance for demanding applications.

Key Features

AMD® Ryzen™ V1000/R1000 Series
1 DDR4 2400MHz SODIMM up to 16GB
Multiple displays: max. 4 DP++/3 DP++ + LVDS
Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0
10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)

Specification

System

Processor

AMD® Ryzen™ Embedded V1605B, 4C/8T, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 15W
AMD® Ryzen™ Embedded V1202B, 2C/4T, 1MB Cache, 3 CU, 2.3 GHz (3.2GHz), 15W
AMD® Ryzen™ Embedded V1404I, 4C/8T, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 15W (Coming soon)
AMD® Ryzen™ Embedded R1606G, 2C/4T, 3 CU, 2.6GHz (3.5GHz), 15W
AMD® Ryzen™ Embedded R1505G, 2C/4T, 3 CU, 2.4GHz(3.3GHz),15W

Memory

1 x 260-pin SODIMM up to 16GB
Single Channel DDR4 up to 2400MHz

BIOS

AMI SPI 64Mbit

Graphics

Controller

AMD® Radeon™ Vega Graphics

Feature

OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9

Display

V1000: 4 x DP++ (1 x LVDS opt.)
R1000: 3 x DP++(1 x LVDS opt.)
DP++: resolution up to 4096×2160 @ 120Hz
LVDS: resolution up to 1920×1200 @ 60Hz

Quad Displays

V1000: 4 x DP++ (1 x LVDS opt.)
R1000: 3 x DP++(1 x LVDS opt.)

Expansion

Interface

1 x Full-size mini-PCIe (PCIe/USB 2.0, opt.: USB 3.1 Gen 1)
1 x M.2 2280/2242 M key (Support SATA/PCIe SSD)
1 x Nano SIM slot (opt.)

Audio

Audio Codec

Realtek ALC262

Ethernet

Controller

3 x Realtek® RTL8111HN/RTL8119I (10/100/1000Mbps)

Rear I/O

Ethernet

3 x GbE (RJ-45)

USB

2 x USB 3.1 Gen2
1 x USB 2.0

Display

V1000: 4 x DP++
R1000: 3 x DP++

Internal I/O

Serial

1 x RS-232/422/485 (2.0mm pitch)
RS485 support auto flow control

USB

1 x USB 2.0 (2.0mm pitch)

Display

1 x LVDS LCD Panel Connector
1 x Backlight Power

Audio

1 x Mic-in
1 x Line-out
1 x Speaker-out (2 x 3W, 8ohm)

SATA

1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power

DIO

1 x 8-bit DIO

SMBus

1 x SMBus

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM

fTPM2.0 (default)
dTPM2.0 (opt.)

Power

Type

Single 12V DC

Connector

4-pin Right Angle Type Connector (default)
DC Jack (available upon request)
4-pin Vertical Type Connector (available upon request)

Consumption

Typical: V1605B:12V @ 1.35A (16.2Watt)
Max.: V1605B:12V @ 2.37A (28.44Watt)

RTC Battery

CR2032 coin cell

Environment

Temperature

Operating: -5 to 65°C, -30 to 80°C
Storage: -40 to 85°C

Humidity

Operating: 10 to 90% RH
Storage: 10 to 90% RH

MTBF

TBD

Mechanism

Dimensions

3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)

Height

PCB: 1.6mm
Top Side: 15.5mm, Bottom Side: 4.0mm

Packing List

1 GH551 board
1 COM cable (2P ports, Length: 250mm) 332-753040-000G
SATA cable (Length: 500mm) 332-553001-005G
SATA power cable (Length: 250mm) A81-004041-016G
Heatsink (Height: 35.00mm) V series: A71-008136-010G/R series: A71-008136-000G
Note: The items are subject to change before mass production.

Country of Origin

Taiwan

Ordering Information

Model Name	Part Number	Description
GH551-BCI-V1605B	770-GH5511-000G	AMD® Ryzen™ Embedded V1605B, 1 DDR4, 3 LAN, 4 DP++, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-V1202B	770-GH5511-100G	AMD® Ryzen™ Embedded V1202B, 1 DDR4, 3 LAN, 3 DP++, 1 LVDS, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-R1606G	770-GH5511-300G	AMD® Ryzen™ Embedded R1606G, 1 DDR4, 3 LAN, 3 DP++, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-R1505G	770-GH5511-400G	AMD® Ryzen™ Embedded R1505G, 1 DDR4, 3 LAN, 2 DP++, 1 LVDS, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C

Datasheet

Download(766 KB)

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
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Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test