Neousys POC-400 x6425E Ultra-compact Computer

  • Product Name: Neousys POC-400
  • System Type: Ultra-compact Fanless Embedded Computer
  • CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
  • RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
  • Expansion: M.2 2280 M key SATA interface, MezIO compatible
  • Other features: Rugged -25 °C to 70 °C fanless operation, 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock, 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock, Dual DP display outputs supporting 4096 x 2160 resolution, Front I/O access DIN-mounting design

Description

The POC-400 from Neousys Technology is an ultra-compact fanless embedded computer for industrial applications. It utilises the latest Intel® Elkhart Lake platform Atom® x6425E 4-core CPU, delivering up to 1.8x CPU and 2x GPU performance improvements compared to previous generations of Atom solutions.

In addition to the performance boost, the POC-400 features an ultra-compact design with an external footprint of just 56 x 108 x 153 mm, making it a solution that can easily fit into the most restricted of spaces.

The system comes with a DIN-rail mounting chassis and an abundance of front-access I/O interfaces. Featuring three 2.5GBASE-T Ethernet ports with IEEE 802.3 PoE+ capability, the POC-400 provides higher data bandwidth for devices such as NBASE-T cameras and is backward-compatible with 1000/100/10 Mbps Ethernet. The PC also has 2 x 4K Display Ports, 2x USB3.1 Gen1, 2x USB 2.0 and COM ports to meet general industrial applications.

Supporting Neousys’ proprietary MezIO® interface for function expansion, a user can add functionality such as isolated DIO, RS-232/422/485, ignition control and 4G/ 5G by installing a MezIO® module. Additionally, the POC-400 comes with an internal M.2 E key socket for a Google TPU or an Intel® Movidius VPU module to transform it into a lightweight AI inference platform at the Edge.

Combining the new 10nm Atom® CPU, 2.5G Ethernet ports, PoE+ and ultra-compact enclosure with functional expansion capabilities, the Neousys’ POC-400 is a compact and  versatile embedded controller that can fuel a variety of industrial applications.

Key Features

  • Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
  • Rugged -25 °C to 70 °C fanless operation
  • 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
  • 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
  • M.2 2280 M key SATA interface
  • Dual DP display outputs supporting 4096 x 2160 resolution
  • Front I/O access DIN-mounting design
  • MezIO® compatible

Specification

System Core
Processor Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor
Graphics Integrated Intel® UHD Graphics
Memory Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
TPM Supports fTPM 2.0
Panel I/O Interface
Ethernet 3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers
POE Optional IEEE 802.3at PoE+ on port #2 and #3
Video Port 2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz
USB 2x USB 3.1 Gen1 (5 Gbps) ports
2x USB 2.0 ports
Serial Port 1x software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Audio Optional 1x 3.5 mm jack for mic-in and speaker-out
Internal Expansion Bus
M.2 E key 1x M.2 2230 E key socket for WiFi, Google TPU or Movidius VPU module
Expandable I/O 1x MezIO® expansion port for Neousys MezIO® modules
Storage Interface
M.2 M key 1x M.2 2280 SATA interface
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8-35V DC input
Mechanical
Dimension 56 mm (W) x 108 mm (D) x 153 mm (H)
Weight 0.96kg
Mounting DIN-rail mount (standard) or Wall-mount (optional)
Environmental
Operating Temperature -25°C ~ 70°C*/**
Storage Temperature -40°C ~85°C
Humidity 10%~90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.7, Category 4
Shock Operating, MIL-STD-810G, Method 516.7, Procedure I
EMC CE/FCC Class A, according to EN 55032 & EN 55035
 
* The 100% CPU/GPU loading for high temperature test is applied using Passmark® BurnInTest™ v8.0. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required.

 

Power Backup Modules:

Power Backup Modules

PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module

Power Backup Modules

PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module

Power Backup Modules2 2

PB-2580J-SA – 2580 w.s Standalone Intelligent SuperCAP Power Backup Module

Ordering Information

POC-400

Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 1x 2.5GbE, 2x 2.5G PoE+ and 2x USB 3.1 Gen1

POC-410

Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 3x 2.5GbE and 2x USB 3.1 Gen1

Optional 1x 3.5 mm jack for mic-in and speaker-out

Supported MezIO® Modules

Neousys MezIO® module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.

Optional Accessories

PA-60W-OW

60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60 °C

Wmkit-V-POC400

Wall-mount assembly for POC-400 series, vertical type

Wmkit-H-POC400

Wall-mount assembly for POC-400 series, horizontal type

Cbl-DB9F-3DB9M-15CM

1x DB9 (Female) to 3x DB9 (Male), length: 15CM

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.