Industrial and Embedded Products

Showing 97–144 of 228 results

  • 4x4 BOX 4000L1

    ASRock Industrial 4X4 BOX-7535U/DDR5 AMD Ryzen 7000 BOX PC

    • Product Name: Asrock 4X4 BOX-7535U/D5
    • System Type: Mini PC
    • CPU: AMD Ryzen™ 7000U-Series 7535U
    • RAM: 2 x 262-pin SO-DIMM up to 64GB DDR5 4800 MHz
    • Expansion: 2 x USB4, 1 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E Module), 1 x SATA3
    • Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.1, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Barebone
    Compare
  • 4x4 BOX 4000L1

    ASRock Industrial 4X4 BOX-7735U/DDR5 AMD Ryzen 7000 BOX PC

    • Product Name: Asrock 4X4 BOX-7735U/D5
    • System Type: Mini PC
    • CPU: AMD Ryzen™ 7000U-Series 7735U
    • RAM: 2 x 262-pin SO-DIMM up to 64GB DDR5 4800 MHz
    • Expansion: 2 x USB4, 1 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E Module), 1 x SATA3
    • Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.1, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
    Compare
  • FB0103 1

    Kingdy 11th Gen Full IP65 Stainless Steel PC

    • Product Name: Kingdy 11th Gen Full IP65 Stainless Steel PC
    • System Type: Full IP65 Stainless Steel PC
    • CPU: 11th Gen Intel Core Celeron 6305E i3-1115G4E / i5-1145G7E / i7-1185G7E
    • RAM: 1 x 260-pin DDR4 3200MHz SODIMM up to 64 GB
    • Expansion: 1 x M.2 M key, 1 x M.2 B Key, 1 x M.2 E Key
    • Other features: Full IP65 304 stainless steel enclosure, All M12 waterproof connectors with cables, 1 x LAN, 2 x RS232, 2 x USB, 1 x HDMI, Wall mount, IIoT gateway, Wide Temperature (optional)
    Compare
  • CB103 1

    Kingdy Intel 11th Gen Rugged Fanless Box PC

    • Product Name: Kingdy Intel 11th Gen Rugged Fanless Box PC
    • System Type: Fanless Box PC
    • CPU: 11th Gen Intel Core Celeron 6305E i3 1115G4E / i5 1145G7E / i7 1185G7E
    • RAM: 2 x 260-pin DDR4 3200MHz SODIMM up to 64 GB
    • Expansion: 1 x M.2 M Key, 1 x M.2 B Key, 1 x M.2 E key
    • Other features: 4 x USB 3.2, 2 x USB 2.0, 4 x RS232 / RS422 / RS485, 2 x GLAN, 1 x HDMI, 1 x DP, GPIO 16 bits, Wall Mount / DIN Rail installation, IIoT gateway, Wide Temperature (optional)
    Compare
  • DRPC 240 TGL U 1

    IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System

    • Product Name: IEI DRPC-240-TGL-U
    • System Type: Fanless DIN-Rail Embedded System
    • CPU: Supported CPUs: Intel® Celeron® 6305/6305E, i5-1145G7E, i7-1185G7E
    • RAM: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB)
    • Expansion: 4 x 2.5GbE ports, supporting PoE (optional), 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
    • Other features: CE/FCC compliant
    Compare
  • HBJC38AZ02 Front

    Jetway HBJC38AZ02 Tiger Lake Rugged Expandable Box PC

    • Product Name: Jetway HBJC38AZ02
    • System Type: Rugged Expandable Box PC
    • CPU: Intel Tiger lake-UP3 11th Gen Processor
    • RAM: 3,200 MHz DDR4
    • Expansion: Supports up to 10 x COM, 10 x LAN, 12 x USB or 32bit GPIO
    • Other features: Fanless, Rugged and Cable-less Design, Triple Independent Display Support, Operating Temperature: -20 ~ 50°C, 12-24V DC-in power supply
    Compare
  • TANK XM811

    IEI TANK-XM811 12th Gen Alder Lake-S “Flexible Expansion eChassis” AIoT Developer Kit

    • Product Name: IEI TANK-XM811
    • System Type: AIoT Dev Kit
    • CPU: , 35W TDP Intel Core i5-12500TE 1.9 GHz (4.3 GHz, 6-core), Intel Core i7-12700TE 1.4 GHz (4.6 GHz, 12-core), Intel Core i9-12900TE 1.1 GHz (4.8 GHz, 16-core)
    • RAM: 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
    • Expansion: Multiple internal expansion boards for flexible selection
    • Other features: 2 x 2.5G Ethernet ports, Multiple USB ports and serial ports, Various optional backplanes and chassis
    Compare
  • TANK XM811

    IEI TANK-XM811AI-RPL 13th Gen Raptor Lake-S AIoT Developer Kit

    • Product Name: IEI TANK-XM811AI-RPL
    • System Type: 13th Gen Raptor Lake-S AIoT Developer Kit
    • CPU: Intel Core i9-13900TE (up to 5.0GHz, 24-Core (8P+16E), TDP 35W) or Intel Core i7-13700TE (up to 4.8GHz, 16-Core (8P+8E), TDP 35W)
    • RAM: 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
    • Expansion: Multiple internal expansion boards for flexible selection
    • Other features: 2 x 2.5G Ethernet ports, Multiple USB ports and serial ports
    Compare
  • NUC 1200 BOX Series 45

    ASRock Industrial NUC BOX-1220P 12th Gen i3 NUC 1200 BOX PC

    • Product Name: Asrock NUC BOX-1220P
    • System Type: NUC 1200 BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
    Compare
  • NUC 1200 BOX Series 45

    ASRock Industrial NUC BOX-1240P 12th Gen i5 NUC 1200 BOX PC

    • Product Name: Asrock NUC BOX-1240P
    • System Type: NUC 1200 BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
    Compare
  • NUC 1200 BOX Series 45

    ASRock Industrial NUC BOX-1260P 12th Gen i7 NUC 1200 BOX PC

    • Product Name: Asrock NUC BOX-1260P
    • System Type: NUC 1200 BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Barebone
    Compare
  • IEP 5000G 1

    ASRock Industrial iEP-5000G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5000G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
    Compare
  • IEP 5000G 1

    ASRock Industrial iEP-5002G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5002G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
    Compare
  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
    Compare
  • HBFDF04 Front45D

    Jetway HBFDF04 Series Elkhart Lake Embedded Box PC

    • Product Name: Jetway HBFDF04 Series
    • System Type: Embedded Box PC
    • CPU: Intel® Elkhart Lake SoC Processor (Default: J6412)
    • RAM: Support 2 * SO-DIMM DDR4-3200MHz up to 32GB
    • Expansion: 1* M.2 B-key (3042) Support USB3.1/USB2.0 interface, 1* M.2 E-key (2230) Support USB2.0/PCIe Gen.3 x1 interface
    • Other features: All-aluminium body, produced by casting process, 12~24V DC-in
    Compare
  • N11 Front45D

    Jetway N11 Series 11th Gen Tiger Lake NUC PC

    • Product Name: Jetway N11 Series
    • System Type: 11th Gen Tiger Lake NUC PC
    • CPU: Intel 11th Gen Tiger Lake-UP3 SoC Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM up to 64GB
    • Expansion: 1 x M.2 M-key 2242/2280 PCIe4.0 x4/SATAIII interface for NVMe functionality, 1 x  2.5” SATA drive bay, 3 x internal M.2 expansion slots for various applications
    • Other features: 1 x Intel i219-LM GbE, 1 x Intel i225-V 2.5GbE, 2 x HDMI 2.0b, 2 x DP1.4, Rich and complete connection interface, supports 4 sets of 4K HDR output, Supports Windows 11 and Linux
    Compare
  • NUC BOX EHLL3 2

    ASRock Industrial NUC BOX-J6412 Intel Elkhart Lake NUC PC

    • Product Name: Asrock NUC BOX-J6412
    • System Type: Intel Elkhart Lake Celeron NUC 6000 BOX Series
    • CPU: Intel ElkHart Lake SoC Processors
    • RAM: 2 x 260-pin SO-DIMM up to 32GB DDR4 3200 MHz
    • Expansion: 4 x USB 3.2 Gen2, 1 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x SATA3
    • Other features: 2 x Realtek 1 Gigabit LAN, Supports Dual display, 1 x HDMI 2.0b, 1 x DP 1.4, TPM onboard, 19V/65W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Barebone
    Compare
  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
    Compare
  • ITMH100 1

    Winmate ITMH100 Intel Tiger Lake i5-1135G7 Modular Box PC

    • Product Name: Winmate ITMH100
    • System Type: Intel Tiger Lake Modular Box PC
    • CPU: Intel® Tiger Lake UP3 Core™ i5-1135G7
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Optional with Modular front Display as a Panel PC
    • Other features: Multi Video Output (HDMI/DisplayPort), Quick & Easy Replaceable Hard Disk Design (No Tools required), Support wide range 9-29V DC input
    Compare
  • Product ITMH200 1

    Winmate ITMH200 Intel Tiger Lake i5-1135G7 Box PC

    • Product Name: Winmate ITMH200
    • System Type: Box PC
    • CPU: Intel® Tiger Lake UP3 Core™ i5-1135G7
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB (Optional), 8GB (Optional), 16GB (Optional), 32GB (Optional)
    • Expansion: Not specified
    • Other features: Multi Video Output, HDMI / DisplayPort, Support wide range 9-29V DC input, Support Table mounting
    Compare
  • ITMH100 EX 1

    Winmate ITMH100-EX C1D2 Certified Intel Tiger Lake i5 Box PC

    • Product Name: Winmate ITMH100-EX
    • System Type: C1D2 Certified Intel Tiger Lake i5 Box PC
    • CPU: Intel® Tiger Lake UP3 Core™ i5-1135G7
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Expansion slot for PCIex4
    • Other features: Multi Video Output (HDMI/DisplayPort), Quick & Easy Replaceable Hard Disk Design (No Tools required), Support wide range 9-29V DC input, Optional with Modular front Display as a Panel PC, Class 1, Division 2, ATEX Grade zone 2 and IECEx certified for hazardous area applications
    Compare
  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    Compare
  • MD711 SU

    DFI MD711 i7 Medical Embedded System

    • Product Name: DFI MD711-SU2061-100G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
    Compare
  • MD711 SU

    DFI MD711 i5 Medical Embedded System

    • Product Name: DFI MD711-SU2061-000G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
    Compare
  • HM 5000 45D

    Jetway HM-5000 Series 8th Gen Fanless DIN-Rail PC

    • Product Name: Jetway HM-5000
    • System Type: 8th Gen Fanless DIN-Rail PC
    • CPU: Intel Gen. 8th/10th Core i U-Series CPU
    • RAM: 2* SO-DIMM DDR4 2400/2133 Dram (Max 64GB)
    • Expansion: 2* RS232/422/485, 2* GbE, 4* PoE GbE, 16-bit GPIO 5KV optical isolation
    • Other features: Support 4G/5G (M.2 B Key + Nano SIM Holder) Module, Wi-Fi6 Module (M.2 E Key), 12~36V DC-in with OCP/OVP, Support RTC Battery function, Remote Power
    Compare
  • IBDRW100

    Winmate IBDRW100 Intel Celeron N2930 DIN Rail Box PC

    • Product Name: Winmate IBDRW100
    • System Type: Intel Celeron N2930 DIN Rail Box PC
    • CPU: Onboard Intel® Celeron® Quad-Core N2930 1.83GHz, up to 2.16GHz
    • RAM: 1 x DDR3L SODIMM slot, 4GB
    • Expansion: 1 x RS232 / 422 / 485 communication (switch by jump), 4 x Giga LAN, 1 x USB 3.0, 3 x USB 2.0, 1 x VGA, 1 x Line out, 1 x Power Jack
    • Other features: DIN Rail design for Industrial Automation application, Fanless, High efficiency thermal design, AWS IoT Greengrass Certified
    Compare
  • IBDRW100 C1D2

    Winmate IBDRW100-EX-P Intel Atom E3950 DIN Rail Box PC (C1D2 Certified)

    • Product Name: Winmate Intel Atom E3950
    • System Type: DIN Rail Box PC
    • CPU: Onboard Intel® Atom® Processor E3950 1.6 GHz, up to 2.0 GHz
    • RAM: 1 x SO-DIMM, DDR3L 1866 MHz, 4GB 8GB (Optional)
    • Expansion: 1 x RS232 / 422 / 485 communication (select thru BIOS), 4 x Giga LAN, 3 x USB 3.0, 1 x USB 2.0, 1 x VGA, 1 x Line out, 1 x line in, 1 x Mic in, 1 x Power Jack
    • Other features: Class 1, Division 2 device certified for hazardous area application, DIN Rail design for Industrial Automation applications, Fanless, streamlined enclosure for highly efficient heat Dissipation, -40˚C~70˚C wide operation temperature range, AWS IoT Greengrass Certified
    Compare
  • IBDRW100 C1D2

    Winmate IBDRW100-EX Intel Celeron DIN Rail Box PC (C1D2 & ATEX Certified)

    • Product Name: Winmate IBDRW100-EX
    • System Type: Intel Celeron DIN Rail Box PC
    • CPU: Intel® Celeron® N2930 Bay Trail-M Processor
    • RAM: 1 x SO-DIMM, DDR3L 1600 MHz, 4GB 8GB (Optional)
    • Expansion: 1 x RS232 / 422 / 485 communication (switch by jump), 4 x Giga LAN, 1 x USB 3.0, 3 x USB 2.0, 1 x VGA, 1 x Line out, 1 x Power Jack
    • Other features: Class 1, Division 2 & ATEX Zone 2 device certified for hazardous area application, Designed for industrial automation, DIN Rail application, Fanless, streamlined enclosure for highly efficient heat dissipation, Rated for wide temperature use -20˚C to 60˚C, AWS IoT Greengrass Certified
    Compare
  • IBDRW100

    Winmate IBDRW100-P Intel Pentium N4200 DIN Rail Box PC

    • Product Name: Winmate IBDRW100-P
    • System Type: Intel Pentium DIN Rail Box PC
    • CPU: Onboard Intel® Pentium® N4200 Processor 1.1 GHz, up to 2.5 GHz
    • RAM: 1 x SO-DIMM DDR3L-1866 Max. 8GB
    • Expansion: 1 x RS232/ 422/ 485 communication (select thru BIOS), 4 x Giga LAN, 3 x USB 3.0, 1 x USB 2.0, 1 x VGA, 1 x Line out, 1 x line in, 1 x Mic in, 1 x Power Jack
    • Other features: DIN Rail design for Industrial Automation application, Fanless, streamlined enclosure for highly efficient heat Dissipation, AWS IoT Greengrass Certified
    Compare
  • F65EAC IW32

    Winmate F65EAC-IW32 Intel i5-8265U Full IP65 EAC Box PC

    • Product Name: Winmate F65EAC-IW32
    • System Type: Full IP65 EAC Box PC
    • CPU: 8th Generation (Whiskey Lake) Intel® Core™ i5-8265U Processor
    • RAM: 1 x SO-DIMM, DDR4 2400 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Support M.2 SSD, One M.2 socket expansion
    • Other features: Aluminium Profile with Fin, Ultra compact size with Fanless Design, 9~36V DC with isolation
    Compare
  • HTB 200 C236

    IEI HTB-210-Q470 10th Gen iCore / Xeon AI Ready Medical Box PC

    • Product Name: IEI HTB-210-Q470
    • System Type: AI Box PC
    • CPU: 10th Gen Intel Core processor
    • RAM: Two 260-pin 2666/2133MHz Dual-Channel DDR4 SODIMM unbuffered Memory supported up to 128GB
    • Expansion: PCIe x4 slot supports capture cards or other applications, PCIe x16 slot supports NVIDIA GPU Acceleration Card
    • Other features: 10th Gen Intel Core processor platform with Intel Q470 chipset, Compact edge device with great computing & graphics performance
    Compare
  • WPC 767 S

    Wincomm WPC-767 Edge AI Fanless Medical PC

    • Product Name: Wincomm WPC-767
    • System Type: Edge AI Fanless Medical PC
    • CPU: Powerful 8th/9th Gen. Intel Core i7/i5, 35W Max.
    • RAM: Supports Dual Channel DDR4 SODIMM up to 32GB
    • Expansion: 1 X PCIex16 (25W), 1 X PCIex4, 1 X Mini-PCIe
    • Other features: Medical Grade 4th UL/EN 60601-1 Certified, Fanless w/Hospital White Housing, Support RAID 0,1 w/Doorway 2nd Storage, HDD Anti-vibration mechanism, Rich I.O., Up to 6 USB, 1 X VGA/DVI-D/DP, 2 LAN & 2 COM.
    Compare
  • WPC 767F S

    Wincomm WPC-767F Edge AI Fanned Medical PC

    • Product Name: Wincomm WPC-767F
    • System Type: Edge AI Fanned Medical PC
    • CPU: Powerful 8th/9th Gen. Intel Core i7/i5, 35W Max.
    • RAM: Supports Dual Channel DDR4 SODIMM up to 32GB
    • Expansion: 1 X PCIex16 (25W), 1 X PCIex4, 1 X Mini-PCIe
    • Other features: Medical Grade 4th UL/EN 60601-1 Certified, Smart Fan w/Hospital White Housing, Support RAID 0,1 w/Doorway 2nd Storage, HDD Anti-vibration mechanism, Rich I.O., Up to 6 X USB, 1 X VGA/DVI-D/DP, 2 LAN & 2 COM.
    Compare
  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    Compare
  • FA30SB3 210 1

    Winmate FA30SB3-210 NXP i.MX6 Dual Core ARM Box PC

    • Product Name: Winmate FA30SB3-210
    • System Type: Dual Core ARM Box PC
    • CPU: NXP i.MX6 Dual Core, 1GHz (Optional Quad Core)
    • RAM: Up to 2 GB LPDDR3
    • Expansion: 16GB eMMC
    • Other features: 1 x RS-232/422/485, 1 x CANBus, 1 x USB A-Type, 1 x RJ45 (Optional PoE), Micro HDMI, Optional DIDO
    Compare
  • DRPC 330 A7K 1

    IEI DRPC-330 Marvell ARMADA Fanless DIN-Rail Embedded System

    • Product Name: IEI DRPC-330
    • System Type: Marvell ARMADA Fanless DIN-Rail Embedded System
    • CPU: Marvell® ARMADA® 88F7040
    • RAM: 1 x On-board DDR4 2400 (4GB pre-installed)
    • Expansion: Multiple expansion slots
    • Other features: Supporting 10GbE SFP+, Multiple COM Ports with isolation, Wide power input 9~36V
    Compare
  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • Product Name: DFI EC102-XNX
    • System Type: NVIDIA Jetson Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: 91.4mm (W) x 70mm (H) x 76.6mm (D), Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
    Compare
  • ITG 100AI 1

    IEI ITG-100AI Fanless Ultra Compact Size AI Embedded System

    • Product Name: IEI ITG-100AI
    • System Type: Fanless Ultra Compact Size AI Embedded System
    • CPU: Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
    • RAM: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory
    • Expansion: M.2 A-key slot for WiFi Module
    • Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
    Compare
  • DRPC 130 AL 1

    IEI DRPC-130-AL Atom Fanless DIN-Rail Embedded System

    • Product Name: IEI DRPC-130-AL
    • System Type: Atom Fanless DIN-Rail Embedded System
    • CPU: Intel® Atom™ x5-E3930 1.3GHz (up to 1.8 GHz)
    • RAM: DDR3L 1.35V SO-DIMM supported
    • Expansion: 1 x Half-size PCIe Mini slot, 1 x Full-size PCIe Mini slot (supports mSATA)
    • Other features: Serial, CAN bus and digital I/O interface
    Compare
  • DRPC 230 ULT5 1

    IEI DRPC-230-ULT5 iCore Fanless DIN-Rail Embedded System

    • Product Name: IEI DRPC-230-ULT5
    • System Type: iCore Fanless DIN-Rail Embedded System
    • CPU: Whiskey Lake Core™ i5-8365UE / Whiskey Lake Celeron™ 4205U
    • RAM: 2 x DDR4 2400Hz SO-DIMM (up to 32GB)
    • Expansion: Modularized Flexible Expansion
    • Other features: Triple GbE LAN Ports, Multiple USB 3.2 Gen 2 (10Gb/s), Multiple COM Ports, Wide Operating temperature, Humidity Resistance, Durable and Silent
    Compare
  • IDS 310AI 1

    IEI IDS-310AI Fanless Ultra Compact Size AI System

    • Product Name: IEI IDS-310AI
    • System Type: Fanless Ultra Compact Size AI System
    • CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
    • RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
    • Expansion: M.2 A-key slot for expansion
    • Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
    Compare
  • HBJC923R3328DG2NL 45D

    Jetway HBJC923R3328DG2NL Rockchip ARM Cortex A53 RK3328 Android 7.1

    • Product Name: Jetway HBJC923R3328DG2NL
    • System Type: Ultra Compact PC
    • CPU: Rockchip® A53 RK3328 Quad-core 1.5GHz
    • RAM: Onboard 1333/2GB DDR3L DRAM
    • Expansion: Support 1* Micro SD Socket (Max 64G)
    • Other features: Onboard 8G Flash ROM (Max. 32GB), Support 1* GbE and 1* 10/100M LAN, 2* USB2.0, 1* OTG/DC-in, 1* HDMI, 1* Line-out, 5V DC-in
    Compare
  • PALM 3A100DW R 1

    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display
    Compare
  • PALM 3A100DW V 1

    LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-V
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded V1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
    • Other features: With Independent Four 4K Display
    Compare
  • SKY 3 3I810DW 1

    LEX SKY 3 3I810DW Compact Fanless 8th Gen Embedded Computer

    • Product Name: Lex SKY 3I810DW
    • System Type: Fanless Embedded Computer
    • CPU: 8th Gen Intel Whiskey Lake-U i7/i5/i3 CPU
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: Multiple Independent display: 2 x HDMI, 1 x Mini PCIe, 1 x Nano SIM, 2 x M.2
    • Other features: 5 x Intel GbE LAN, 4 x USB 3.1, 2 x COM, DI/DO (option), TPM (option)
    Compare
  • TASK 3I810DW 1

    LEX TASK 3I810DW Compact Fanless 8th Gen Embedded Computer

    • Product Name: Lex TASK 3I810DW
    • System Type: Compact Fanless 8th Gen Embedded Computer
    • CPU: 8th Gen Intel Whiskey Lake-U i7 / i5 / i3
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x Mini PCIe, 1 x Nano SIM, 2 x M.2
    • Other features: Multiple Independent display: 2 x HDMI, 5 x Intel GbE LAN, 4 x USB 3.1, 2 x COM
    Compare
  • APOLLO 3I370DW 1

    LEX APOLLO 3I370DW 8th/9th Gen Edge AI Computing Platform

    • Product Name: Lex APOLLO 3I370DW
    • System Type: Edge AI Computing Platform
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 1 x Mini PCIe, 1 x PCIe x16 Slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1 (2~4 x COM), DIO (optional), Supports NVIDIA® RTX3070 GPU Card
    Compare
  • APOLLO RS 3I370DW 1

    LEX APOLLO-RS 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-RS 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe, 2 x PCIe slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
    Compare