DFI AL553 Intel Atom E3900 3.5" SBC

DFI AL553 Intel Atom E3900 3.5″ SBC

Product Name: DFI AL553
Motherboard Form Factor: 3.5″ SBC
CPU: Intel Atom E3900
RAM: 1 DDR3L SODIMM up to 8GB
Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)

CPU Model

Clear

ADD TO QUOTE

SKU: AL553 Category: 3.5" Single Board Computers Tags: 9~36V, GPIO / DIO, Intel Atom, IoT, Low Power, Multi Display - Triple, OS: Linux, OS: Windows, Powered by Intel, Rugged, TPM 2.0, Wide Temp Brand: DFI

Description

Intel® Atom® E3900 3.5″ SBC
1 DDR3L SODIMM up to 8GB
Three independent displays: VGA + LVDS + HDMI
Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0
15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)

Specification

System

Processor

Intel® Atom® Processor E3900 Family, BGA 1296
Intel® Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel® Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel® Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Intel® Celeron® Processor J3455, Quad Core, 2M Cache, 1.5GHz (2.3GHz), 10W

Memory

One 204-pin SODIMM up to 8GB
Single Channel DDR3L 1866MHzInsyde SPI 128Mbit (supports UEFI boot only)

Graphics

Controller

Intel® HD Graphics

Feature

OpenGL 4.2, Direct X 11.1, OpenCL 1.2, OGL ES 3.0
HW Decode: H.264, MPEG2, VC1, VP8, H.265, MPEG4
HW Encode: H.264, MPEG2, MPEG4

Display

1 x VGA
1 x LVDS
1 x HDMI VGA: resolution up to 1920×1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60Hz
HDMI: resolution up to 3840×2160 @ 30Hz

Triple Displays

VGA + LVDS + HDMI

Expansion

Interface

1 x Full-size mini-PCIe (USB/PCIe) with SIM slot (option)
1 x M.2 B key 2242 (PCIe/USB 2.0/SATA 3.0)
1 x M.2 E key 2230 (USB/PCIe)

Audio

Audio Codec

Realtek ALC262

Ethernet

Controller

2 x Intel® I211AT PCIe (10/100/1000Mbps)
2 x Intel® I210IT PCIe (10/100/1000Mbps) (available upon request)

Rear I/O

Ethernet

2 x GbE (RJ-45)

USB

2 x USB 3.1 Gen1
2 x USB 2.0

Display

1 x VGA
1 x HDMI
1 x LVDS

Internal I/O

Serial

1 x RS-232/422/485 (2.0mm pitch)

USB

2 x USB 2.0 (2.0mm pitch)

Display

1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power

Audio

1 x Audio (Line-out/Mic-in)

SATA

1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power

DIO

1 x 8-bit DIO

SMBus

1 x SMBus

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM

fTPM2.0

Power

Type

Wide Range 9~36V DC

Connector

Right Angle Connector (4-pin)
DC-in Jack (available upon request)
Vertical Type Connector (4-pin) (available upon request)

Consumption

Typical: 7W, Max : 24W.

RTC Battery

CR2032 Coin Cell

OS Support

OS Support (UEFI Only)

Windows 10 IoT AL553nterprise (64-bit)
Linux

Environment

Temperature

Operating: 0 to 60°C, -20 to 70°C, -40 to 85 °C
Storage: -40 to 85°C

Humidity

Operating: 5 to 90% RH
Storage: 5 to 90% RH

MTBF

618,325 hrs @ 25°C; 396,245 hrs @ 45°C ; 267,106 hrs @ 60°C

Mechanism

Dimensions

3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)

Height

PCB: 1.6mm
Top Side: 15.5mm
Bottom Side: 8.0mm

Standards and Certifications

Certifications

CE, FCC Class B, RoHS

Packing List

1 AL553 board
1 COM port cable(Length: 250mm, 1x COM port) 332-753040-000G
1 SATA data cable (Length : 500mm) 332-553001-205G
1 SATA power cable (Length: 250mm) A81-004041-016G
1 Heat sink for N series CPU (Height: 25mm) A71-008119-000G/ for E series CPU 0 to 60℃ (Height: 35mm) A71-010038-010G

Country of Origin

Taiwan

Ordering Information

Model Name	Part Number	Description
AL553-BN-E3950	770-AL5531-200G	Intel Atom® x7-E3950, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI,1 COM, 2 LAN, 6 USB, 9-36VDC, Fanless, 0 to 60°C
AL553-BN-E3940	770-AL5531-100G	Intel Atom® x5-E3940, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI, 2 LAN, 1 COM, 6 USB, 9-36VDC, Fanless, 0 to 60°C
AL553-BN-E3930	770-AL5531-000G	Intel Atom® x5-E3930, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI, 2 LAN, 1 COM, 6 USB, 9-36VDC, Fanless, 0 to 60°C
AL553-BN-N4200	770-AL5531-400G	Intel Pentium® N4200, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI, 2 LAN, 1 COM, 6 USB, 9-36VDC, Fanless, 0 to 60°C
AL553-BN-N3350	770-AL5531-300G	Intel® Celeron® N3350, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI, 2 LAN, 1 COM, 6 USB, 9-36VDC, Fanless, 0 to 60°C
AL553-EN-E3950	770-AL5531-500G	Intel Atom® x7-E3950, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI, 2 LAN, 1 COM, 6 USB, 9-36VDC, Fanless, -20 to 70°C
AL553-TN-E3950	770-AL5531-600G	Intel Atom® x7-E3950, 1 DDR3L SODIMM, 1VGA, 1 LVDS, 1 HDMI, 2 LAN, 1 COM, 6 USB, 9-36VDC, Fanless, -40 to 85°C

Datasheet

Download(1 MB)

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test