DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
- Product Name: DFI ECX700-AL
- System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
- CPU: Intel Atom Processor E3900 Series
- RAM: 4GB DDR3 onboard, 64G eMMC
- Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
- Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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Description
The DFI ECX700-AL challenges any outdoor operation – combatting and beating every environmental factor that can potentially impact performance around a PC solutions durability.
Climate change brings with it harsh conditions and the ability to withstand water and dust is often seen as a direct indicator of a rugged computer’s ability to operate outdoors. Operation within wide temperature range also plays a decisive factor in ensuring stable operation – with additional consideration to the following :-
- Even with a waterproof enclosure, the system may still experience condensation internally because of diverse exterior temperatures (hot & cold) being prevalent
- During operation under the sun, once the external temperature reaches 40° C, the system internally can quite easily experience temperatures over 60° C with the effect of both sun & internal components
Designed to counter these issues, the DFI ECX700-AL provides a smart vent to drain off water automatically. With a white resistive painted enclosure design and a system design to allow wide-temperature operation from -40 to 70° C, the DFI ECX700-AL reliably functions under the sun and resisting levels of heat.
Cellular connectivity is provided via an external SIM slot to facilitate easy load/unload of SIMs – and the high-gain antenna ensures quality of signal.
Amongst the versatile I/O that the DFI ECX700-AL possesses settings are 2 x CAN Bus and 2 x RS232 ports and selective display ports (HDMI/VGA) help integrators in meeting demand for flexibility around display output.
Key Features
- Intel® Atom® Processor E3900 Series
- Ruggedized IPC67 Grade Box PC
- Outdoor IoT Gateway Application
- 4GB DDR3 onboard, 64G eMMC
- Operating temperature: -40° to 70° C
- 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
Specification
| Ordering Information | ||
| Model Name | Part Number | Description |
| ECX700-AL | TBD | ECX700-AL-B00: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN |
| ECX700-AL | TBD | ECX700-AL-BW0: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, WiFi |
| ECX700-AL | TBD | ECX700-AL-PC0: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM |
| ECX700-AL | TBD | ECX700-AL-PC1: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM + 2 CAN |
| ECX700-AL | TBD | ECX700-AL-PC2: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM + 2 CAN, WiFi |
| ECX700-AL | TBD | ECX700-AL-PC3: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, 1 HDMI or VGA, 2 COM + 2 CAN, WiFi, LTE |
| ECX700-AL | TBD | ECX700-AL-PC4: E3950, 4G memory down, 64G eMMC, LED, PWR, 1 USB 3.0, 1 USB 2.0, 2 LAN, 1 HDMI or VGA, 2 COM + 2 Can, WiFi, LTE |
| ECX700-AL | TBD | ECX700-AL-I00: E3950, 4G memory down, 64G emmc, LED, PWR, 1 USB 3.0, 1 USB 2.0, WiFi, LTE |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
BVM Customisation Service
Design | Develop | Test | Manufacture
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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