Jetway N11 Series 11th Gen Tiger Lake NUC PC
- Product Name: Jetway N11 Series
- System Type: 11th Gen Tiger Lake NUC PC
- CPU: Intel 11th Gen Tiger Lake-UP3 SoC Processor
- RAM: 2 x DDR4 3200MHz SO-DIMM up to 64GB
- Expansion: 1 x M.2 M-key 2242/2280 PCIe4.0 x4/SATAIII interface for NVMe functionality, 1 x 2.5” SATA drive bay, 3 x internal M.2 expansion slots for various applications
- Other features: 1 x Intel i219-LM GbE, 1 x Intel i225-V 2.5GbE, 2 x HDMI 2.0b, 2 x DP1.4, Rich and complete connection interface, supports 4 sets of 4K HDR output, Supports Windows 11 and Linux
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Description
Jetway, a world-leading industrial PC manufacturer and provider of solutions, are pleased to announce the release of their N11 Ultra-Compact Mini PC Series. With 11th Generation Intel Tiger Lake UP3 CoreTM Processor at its core, the N11 Series delivers industry-leading performance for applications demanding high resolution graphical output via 4K HDR, aided via AI capability. Jetway’s N11 Series is equipped with the latest Intel Iris Xe graphics featuring an innovative GPU architecture and improved 10nm processor to ensure a richer experience around faster processing speeds. The N11 Series supports up to 4 x 4K HDR @60Hz independent displays – simultaneously.
The N11 Series provides a memory capacity of up to 64GB DDR4 3,200MHz SO-DIMMs. And thanks to its compact size and VESA mounting, the PC will physically fit where space is of a premium (fanless PC here). Equipped with two LAN ports, the N11 Series supports ‘Link Aggregation’ functionality. When connected with a 2.5G network switch that can support link aggregation, the network bandwidth can actually reach transmissions of up to 3.5G. Link Aggregation provides the two primary benefits of Load Balancing and Fault Tolerance (Failover) which ensures continuous data transmission without interruption.
In addition, the IEEE 802.11 a/b/g/n/ac Wireless LAN 2T2R and Bluetooth 5.0 (compliant with MU-MIMO) provide greater bandwidth capabilities which in turn provides for faster speeds when uploading and downloading data and imagery.
Features
- Intel 11th Gen Tiger Lake-UP3 SoC Processor
- 2 x DDR4 3200MHz SO-DIMM up to 64GB
- 1 x Intel i219-LM GbE, 1* Intel i225-V 2.5GbE#
- 2 x HDMI 2.0b, 2* DP1.4
- 1 x M.2 M-key 2242/2280 PCIe4.0 x4/SATAIII interface for NVMe functionality
- 1 x 2.5” SATA drive bay
- Rich and complete connection interface, supports 4 sets of 4K HDR output
- 3 x internal M.2 expansion slots for various applications
- Supports Windows 11 and Linux
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Specification
| Model | – N11-1115 (CPU : 1115G4) – N11-1135 (CPU : 1135G7) |
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| CPU/Chipset | – Intel Tiger Lake-UP3 Processor | |
| BIOS | – AMI Flash ROM | |
| Memory | – 2* DDR4 3200MHz up to 64GB | |
| Network | – 1* Intel i219-LM GbE – 1* Intel i225-V 2.5GbE |
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| Graphics | – Intel UHD / Iris Xe Graphics, shared memory – 2* HDMI 2.0b (Max Resolution: 4096×2160@60Hz) – 2* DP1.4 (Max Resolution: 4096×2304@60Hz) from Type-C – Support Four independent 4K HDR Displays |
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| Storage | – 1* M.2 M-key 2242/2280 (PCIe4.0 x4/SATAIII interface) support NVMe – 1* 2.5” SATA Device (support 2.5” HDD with a height ≤ 10mm) |
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| Expansion slot | – 1* M.2 E Key 2230 for WiFi module – 1* M.2 B Key 3042/3052 for 4G/5G module |
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| Rear Panel I/O | – 2* USB3.2 (Gen.2) Type-C support DP1.4 display output – 1* SIM Card slot – 2* HDMI 2.0 – 2* RJ45 – 1* DC Jack |
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| Front Panel I/O | – 1* Audio (Line out +MIC combo) – 2* USB3.2 / A type (Gen.2) – 1* USB3.2 / C type (Gen.2) – 1* Power Button – 1* Power LED |
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| Internal Connector | – MU10 MB : DC12~24V input – Adapter : DC19_90W |
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| Compliance | – CE, FCC, RoHS, ErP Ready | |
| Power Source | – Adapter : DC12V_5A_60W – M/B: DC 12~24V input |
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| Compliance | – CE, FCC, LVD, RoHS | |
| Temperature | – Operating Temperature: -10 ~ 50° C – Storage Temperature: -20 ~ 60° C |
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| Dimensions | – System: 121 (W) x 113.4 (D) x 59 (H) mm – Box: 244 (W) x 183 (D) x 118 (H) mm |
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| OS Support | – Windows 11, Linux | |
| Warranty | – 2 Year limited warranty | |
Ordering Information
| Part Number | Description |
| N11-1115 | N11-1115 Barebone, Intel Tiger Lake-UP3 1115G4 CPU |
| N11-1135 | N11-1135 Barebone, Intel Tiger Lake-UP3 1135G7 CPU |
| L01AS064-F | Adapter DC19V_90W |
| Change according to shipping area | Power cord |
| LCSCHBJC3XX-F | Screw pack |
| HCS310MWM01B-2F | Wall + VESA mount kits (option) |
BVM Customisation Service
Design | Develop | Test | Manufacture
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a new product or working with an existing prototype.
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Build to Order: Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software: Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
![]() Testing |
![]() Materials Management |
![]() Logistics and Tracking |
![]() External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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