AAEON BOXER-6839-RPL 12th/13th/14th Gen Fanless Computer

  • Product Name: AAEON BOXER-6839-RPL
  • System Type: Fanless industrial embedded computer
  • CPU: Supports 12th, 13th and 14th Gen Intel Core LGA1700 socket processors
  • RAM: Dual DDR5-4800 SO-DIMM slots supporting up to 64GB
  • Expansion: PCIe x4 + PCIe x1 or PCIe x4 + PCI expansion, dual 2.5″ SATA with RAID 0/1
  • Other Features: Quad display output (2 x HDMI, 2 x DisplayPort), 8 x USB 3.2 Gen 2 ports, and a wide operating temperature range of -20°C to 50°C

Description

The AAEON BOXER-6839-RPL is a rugged fanless industrial computer built for high-performance Edge computing, AI inference, machine vision, and industrial automation applications. Supporting 12th, 13th, and 14th Gen Intel Core LGA1700 processors, it delivers exceptional computing power while maintaining reliable fanless operation in harsh environments. With support for up to 64GB of DDR5 memory, flexible PCIe expansion, dual SATA drive bays with RAID support, quad-display capability, and a wide range of high-speed USB connectivity, the BOXER-6839-RPL provides a versatile and dependable platform for demanding industrial, manufacturing, transportation, and smart city deployments.

Key Features

  • 14th Gen Intel Core LGA 1700 Socket-Type Processors
  • PCIe [x4] + PCIe [x1] / PCIe [x4] + PCI
  • Four Simultaneous Displays: HDMI x 2 + DP x 2
  • -20°C ~ 50°C Operating Temperature
  • USB 3.2 Gen 2 (Type-A) x 8
  • 2.5” SATA Drive Bay x 2, Support RAID 0,1

Specification

Specification Details
CPU Supports 12th, 13th & 14th Gen Intel® Core™ processors, including Core™ i3, i5, i7 & i9, plus Intel® Celeron® processors (LGA1700)
Chipset Intel® Q670E
System Memory 2 x DDR5-4800 SO-DIMM, up to 64GB
Graphics Integrated Intel® UHD Graphics (processor dependent)
Display Outputs 2 x HDMI, 2 x DisplayPort (up to four simultaneous displays)
Storage 2 x 2.5″ SATA drive bays, 1 x M.2 2280 M-Key (PCIe Gen4 x4 NVMe)
Ethernet 1 x 2.5GbE LAN, 3 x Gigabit Ethernet
USB 8 x USB 3.2 Gen 2 Type-A
Serial Ports 6 x RS-232/422/485 (DB-9)
Audio 1 x Mic-in / Line-out
Digital I/O 8-bit DIO via 10-pin terminal block
Expansion 1 x M.2 2230 E-Key (Wi-Fi), 1 x M.2 3052 B-Key with Nano SIM (LTE/5G), 1 x M.2 2280 M-Key (NVMe), Model A1: PCIe x4 + PCIe x1, Model A2: PCIe x4 + PCI
Expansion Card Size Upper slot: 160 × 105mm, Lower slot: 170 × 105mm
Indicators System LED, HDD LED
Operating System Support Windows 10 IoT LTSC 2021, Windows 11 IoT LTSC 2024, Ubuntu 24.04 or later
Power Input 12–24V DC via 3-pin terminal block with protection circuit
Mounting Wall mount
Dimensions (W × H × D) 264 × 186 × 122mm (10.3″ × 7.3″ × 4.8″) without brackets
Weight Net: 5.6kg (12.4lb), Gross: 7.3kg (16.1lb)
Operating Temperature -20°C to 50°C (with 0.7m/s airflow and wide-temperature memory/storage)
Storage Temperature -40°C to 80°C
Humidity 5–95% RH @ 40°C, non-condensing
Vibration Resistance 3Grms, 5–500Hz (with SSD)
Shock Resistance 50G, 11ms half-sine (wall mounted, with SSD)
Certifications CE, FCC Class A

Ordering Information

PART NUMBER BOXER-6839-RPL-A1-1010 BOXER-6839-RPL-A2-1010
CPU
PCH Q670E Q670E
LAN 2.5GbE x 1
GbE x 3
2.5GbE x 1
GbE x 3
USB USB3.2(10Gbps) x 8 USB3.2(10Gbps) x 8
RS- 232/422/485 6 6
Digital I/O 8 bit 8 bit
Audio Mic-in
Line-out
Mic-in
Line-out
Storage 2.5” SATA Drive Bay x 2 2.5” SATA Drive Bay x 2
Display HDMI x 2
DP x 2
HDMI x 2
DP x 2
Expansion M.2 2230 E-Key x 1
M.2 3052 B-Key x 1 w/ SIM Slot
PCIe[x4]: Lower Slot
PCIe[x1]: Upper Slot
M.2 2230 E-Key x 1
M.2 3052 B-Key x 1 w/ SIM Slot
PCI: Lower Slot
PCIe[x4]: Upper Slot
Mounting Wallmount Wallmount
Power 12~24V 12~24V
Operation Temp. 4°F ~122°F (-20°C ~ 50°C), IEC68-2 with
0.7 m/s AirFlow, with wide temperature
Memory / Storage & TDP 65W CPU
4°F ~122°F (-20°C ~ 50°C), IEC68-2 with
0.7 m/s AirFlow, with wide temperature
Memory / Storage & TDP 65W CPU

BVM Design and Manufacturing

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Embedded Product Design

Turnkey solutions for brand-new concepts or maturing existing prototypes.

System Integration

Adapting and scaling proven hardware platforms to your exact use case.

Embedded Software

Porting, customized OS development, and mass-deployment services.

  • Windows, Linux & Android Image Capture
  • Custom Golden Master Image Creation
  • Mass OS Deployment Services
  • Custom BIOS & Firmware Configuration
  • OS Lifecycle & Update Management
  • Driver Integration & Compatibility Validation

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

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