The AAEONBOXER-8641AI-PLUS is a high-performance embedded AI system powered by the NVIDIA Jetson AGX Orin module. Designed for demanding edge AI applications, it supports up to 64GB LPDDR5 memory, dual LAN including 10G, and extensive I/O with USB 3.2, serial ports, and DIO. With versatile M.2 expansion, rugged design, and Linux support via NVIDIA JetPack, it’s ideal for industrial automation, smart surveillance, and robotics.
Certified for Clinical Confidence: With FCC Class B certification, the BOXER-8641 Plus meets strict EMI standards, easing regulatory approval and enabling broader deployment in clinical environments.
Remote Management Ready: Features out-of-band (OOB) monitoring and over-the-air (OTA) updates for secure, hands-off system checks and software maintenance.
Compact, Flexible, and Secure: Small form factor (180mm x 136mm x 79.1mm) with fanless design, expansion options for Wi-Fi/5G, and built-in TPM 2.0 for enhanced data security.
Key Features
NVIDIA Jetson AGX Orin
Giga LAN x1,10G LAN x1
USB 3.2 Gen 2 (Type-A) x4
DB-9 x1 for DIO x8
DB-9 x2 for RS-232/422/485(Rx/Tx/RTS/CTS)
Multi-expansion option: M.2 Key E / M.2 Key B / M.2 Key M
Specification
Category
Specification
System
AI Accelerator: NVIDIA® Jetson AGX Orin™
CPU:
AGX Orin 32GB – 8-core Arm® Cortex®-A78AE
AGX Orin 64GB – 12-core Arm® Cortex®-A78AE
System Memory: 32GB or 64GB LPDDR5 (model dependent)
Storage Device: 64GB eMMC 5.1 x1, MicroSD slot x1, 2.5″ SATA drive bay x1
Display Interface: HDMI 2.0 Type-A x1
Ethernet: 1x Giga LAN (RJ-45), 1x 10G LAN (RJ-45)
I/O: USB 3.2 Gen 2 Type-A x4, RS-232/422/485 DB-9 x2, DIO DB-9 x1 (8-bit), Micro USB x1 (OS Flash), Mic-in & Line-out x1, MicroSD slot x1, Antenna openings x6, Reset, Recovery, and Power buttons
Expansion: M.2 E-Key 2230 (Wi-Fi/BT), M.2 B-Key 3052 (LTE/5G), M.2 M-Key 2280 (NVMe), SIM slot x1, 2.5″ SATA bay
Indicator: Power LED x1
OS Support: Linux (NVIDIA JetPack 6.0 and above)
Power Supply
Input: 12~19VDC via 2-pin Terminal Block
Mechanical
Mounting: Wall mount kit
Dimensions: 180.0 mm x 136.0 mm x 79.0 mm (7.09″ x 5.35″ x 3.11″)
Net Weight: 5.5 lb (2.5 kg)
Gross Weight: 7.8 lb (3.55 kg)
Environmental
Operating Temp: -25°C ~ 55°C (-13°F ~ 131°F) with 0.7 m/s airflow
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
Testing
Materials Management
Logistics and Tracking
External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test
This product has multiple variants. The options may be chosen on the product page
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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