AAEON MXM-ACMA-PUC Intel 13th Gen MXM GPU Computer

  • Product Name: AAEON MXM-ACMA-PUC
  • System Type: Intel 12th/13th Gen MXM GPU Computer
  • CPU: 12th/13th Gen Intel Core Processor, up to 35W
  • RAM: Up to 64GB DDR5 SODIMM (2 x 4800MHz slots)
  • Expansion: 1 x M.2 2280 M-Key, 1 x M.2 3052 B-Key, 1 x M.2 2230 E-Key, MXM 3.1 Type A Module (up to 55W)
  • Other features: 4 x DP++ 1.4, 1 x HDMI 2.0, 3 x 2.5GbE, 1 x 1GbE, 2 x USB 3.2 Gen 2, 2 x USB 2.0, 2 x COM, GPIO, 19–24V DC input

Description

The AAEON MXM-ACMA-PUC is a powerful embedded GPU computer designed for demanding edge AI and machine vision applications. Supporting 12th/13th Gen Intel Core processors and up to 64GB of DDR5 memory, it offers exceptional processing performance. With support for MXM 3.1 Type A GPU modules up to 55W, multiple high-speed I/O ports, and versatile expansion options, this system is ideal for industrial environments requiring advanced graphics and compute capabilities.

 

MXM ACMA PUC 3

Key Features

  • 12th/13th Gen Intel® Core™ Processor, up to 35W
  • DDR5 SODIMM 4800 x 2, up to 64GB
  • HDMI 2.0 x 1 (Supported by Main Board), DP++ 1.4 x 4 (Supported by MXM)
  • 2.5GbE x 3, 1GbE x 1
  • USB 3.2 Gen 2 x 2, USB 2.0 x 2
  • M.2 2280 M-Key x 1, M.2 3052 B-Key x 1, M.2 2230 E-Key x 1
  • Supports MXM 3.1 Type A Module, up to 55W (MXM-ACMA series)
  • COM Port x 2, GPIO 8-bit, DC 19V-24V

AAEON MXM-ACMA MXM 3.1 Type A Module with Intel Arc A370/A350 GPUMXM ACMA

The MXM-ACMA brings the MXM 3.1 Type A GPU module form factor to AAEON’s product range, delivering powerful and efficient graphics acceleration with Intel® Arc™ A-Series graphics. Featuring 4GB of GDDR6 memory, ray tracing, and Intel® Deep Link Technologies, the MXM-ACMA enhances data processing and rendering performance across a range of embedded applications, including digital signage, gaming, edge AI, and medical imaging.

  • Intel® Arc™ A370M/A350M Embedded GPU, up to 8 Xe-cores
  • 4GB GDDR6 Memory
  • PCIe 4.0 [x8] Interface
  • DP++ 1.4/HDMI 2.1 x 4
  • Standard MXM 3.1 Type A form factor
  • OpenCL™/OpenGL®/oneAPI/Direct X12/Ray Tracing Support

 

Specification

Form Factor MXM System
CPU 12th/13th Generation Intel® Core™ Processor, up to 35W
Chipset Intel® Q670E Chipset
Memory Dual Channel DDR5 4800 SODIMM x 2, up to 64GB
BIOS UEFI
Wake on LAN Yes
Watchdog Timer 255 Levels
Security TPM 2.0
RTC Battery Lithium Battery 3V/240mAh
Dimensions 310mm x 160mm x 75mm
OS Support Windows 10 (64-bit), Ubuntu 24.04 / Kernel 6.8
Power Requirement +19V to +24V
Power Supply Type AT/ATX
Power Connector 3-Pin Phoenix Connector
Power Consumption (Typical) 80.83W (Intel® Core™ i7-13700TE, DDR5 32GB x2, Intel® Arc™ A370E @ 3.54A @ 22.9V)
Power Consumption (Max) 167.71W (Intel® Core™ i7-13700TE, DDR5 32GB x2, Intel® Arc™ A370E @ 7.48A @ 23.1V)
Graphic Controller (CPU) Intel® UHD Graphics 770 (i5 and above), UHD Graphics 730 (i3)
Graphic Controller (MXM) Intel® Arc™ A370E / Arc™ A350E
LVDS/eDP
Display Outputs HDMI 2.0 x 1 (Main Board), DP++ 1.4 x 4 (MXM Module)
Display Resolution HDMI: up to 3840 x 2160 @60Hz; DP++: up to 1920 x 1080
Multiple Displays 1 (Main Board), up to 4 (MXM Module)
Audio CODEC
Audio Interface
Speaker
Ethernet 3 x 2.5GbE (Intel® I226-LM), 1 x GbE (Intel® I219-LM)
USB Ports 2 x USB 3.2 Gen 2, 2 x USB 2.0
Serial Ports 2 x COM (RS-232/422/485, RI default, 5V/12V via BOM change)
Video Ports HDMI 2.0 x 1, DP++ 1.4 x 4
Internal USB
Internal Serial Ports
Internal Video
SATA 2 x SATA 6Gb/s, 2 x +5V SATA Power Connectors
Audio I/O
DIO
SMBus/I2C
Touch Interface
Fan Connectors 1 x 4-Pin Smart Fan (CPU), 1 x 3-Pin Fan (MXM), 1 x System Fan
SIM Slot Nano SIM x 1
Front Panel Power Button, Power LED
Mini PCIe/mSATA
M.2 Expansion 1 x M.2 2280 M-Key (PCIe 4.0 x4)
1 x M.2 3052 B-Key (PCIe 3.0 x2 + USB 3.2 + USB 2.0)
1 x M.2 2230 E-Key (PCIe 3.0 x1 + USB 2.0)
Other Expansion MXM 3.1 Type A Module
Operating Temperature -10°C to 50°C (14°F to 122°F) with 0.7m/sec airflow
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Operating Humidity 0% to 90% RH, non-condensing
MTBF 823,430 Hours
EMC Certification CE / FCC Class A

Ordering Information

PART NUMBER MXM-ACMA-PUC-A10-0001 MXM-ACMA-PUC-A10-0003
CPU Intel ® Core ™ i7-13700TE (with Q670E) Intel ® Core ™ i3-13100TE (with Q670E)
MEMORY DDR5 SODIMM DDR5 SODIMM
8GB x 2 8GB x 2
DISPLAY HDMI x 1 , HDMI x 1 ,
DP++ x 4 DP++ x 4
STORAGE SATA 6.0 Gbps x 2 SATA 6.0 Gbps x 2
LAN 2.5GbE x 3 , GbE x 1 2.5GbE x 1 , GbE x 1
USB USB3.2 Gen2 x 2 USB3.2 Gen2 x 2
USB2.0 x 2 USB2.0 x 2
COM PORT RS232/422/485 x 2 RS232/422/485 x 2
EXPANSION M.2 2280 M-Key x 1, M.2 3052 B-Key x 1,
M.2 3052 B-Key x 1, M.2 2230 E-Key x 1,
M.2 2230 E-Key x 1, PCIe[x8] x 1
PCIe[x8] x 1  
TPM TPM 2.0 TPM 2.0
POWER +19V to +24V +19V to +24V
AC power AC power
connector connector
OPERATING TEMPERATURE -10°C ~ 50°C -10°C ~ 50°C
OTHERS Nano SIM x 1, Nano SIM x 1,
MXM-ACMA (A370E) MXM-ACMA (A350E)

 

PART NUMBER MXM-ACMA-A10-0001 MXM-ACMA-A10-0002
OPERATING TEMPERATURE 0°C ~ 60°C 0°C ~ 60°C
TGP 35W 25W
DISPLAY DP++1.4 x 4 DP++1.4 x 4
FORM FACTOR MXM 3.1 Type A MXM 3.1 Type A
GPU Intel® Arc™ A370M Intel® Arc™ A350M
INTERFACE PCIe 4.0 [x8] PCIe 4.0 [x8]
MEMORY 4GB GDDR6 4GB GDDR6

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Embedded Software: Configuration, Integration and Deployment

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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

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• Burn in Test
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