DFI KS070-M8M NXP i.MX 8M 7″ IP65 Panel PC

  • Product Name: DFI KS070-M8M
  • Screen Size: 7″ IP65 Panel PC
  • CPU: NXP i.MX8M Platform
  • RAM: 2GB/4GB SDRAM Memory
  • Expansion: Multiple Expansion: M.2 2230/3042 support
  • Other features: 7″ 1024×600 TFT LCD Panel with capacitive touch screen, IP65 front panel protection

Description

  • NXP i.MX8M Platform
  • 2GB/4GB SDRAM Memory
  • 7″ 1024×600 TFT LCD Panel with capacitive touch screen
  • Multiple Expansion: M.2 2230/3042 support
  • IP65 front panel protection

Specification

System

Processor
NXP i.MX 8M Dual Cortex-A53, 1.5GHz
Memory
2GB/4GB SDRAM Memory Down Single Channel LPDDR4 1600MHz

Display and Touch Screen

Display
7” 1024×600 TFT LCD Panel with Capacitive Touch Screen
Brightness
425 cd/m²
Contrast
800:1
Backlight Lifetime
50,000 hours

Storage

Internal
16GB eMMC
1 x Internal Micro SD Socket

Expansion

Interface
1 x M.2 B key 3042/2242 (USB 2.0)
1 x M.2 E key 2230 (PCIe x1/USB 2.0)
1 x Nano SIM slot (Optional)

LED

Indicators
1 x Power LED

Top I/O

Wi-Fi Antenna
2 x Wi-Fi Module Antenna Hole

Bottom I/O

Ethernet
1 x GbE (RJ-45)
Serial
1 x RS-232/422/485
1 x RS-485
USB
2 x USB 3.1 (type A)
Audio
1 x Line out
DIO
1 x 8-bit DIO
Buttons
1 x Power Switch

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Power

Type
12V
Connector
2-Pole Terminal Block

OS Support

OS Support
Android 9.0 & Yocto 2.5

Environment

Operating Temperature
0 to 60°C
Storage Temperature
-30 to 85°C
Relative Humidity
85%@65°C (non-condensing)

Mechanism

Dimensions
235 x 150 x 43.8(W x H x D)
Construction
Aluminium front bezel
Mounting
Panel Mount /VESA Mount /Din-rail(Optional)
Weight
TBD

Standards and Certifications

Shock
TBD
Vibration
TBD

Certifications

CE, FCC Class B

Packing List

Packing List
1 Touch Panel PC
1 Quick Installation Guide

Country of Origin

Country of Origin
Taiwan

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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