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DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC

  • Product Name: DFI M8M051
  • Motherboard Form Factor: 2.5″ Pico-ITX
  • CPU: NXP i.MX 8M Processors
  • RAM: Single Channel LPDDR4 up to 3200 MHz
  • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
  • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
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Description

  • NXP i.MX 8M Processors
  • Single Channel LPDDR4 up to 3200 MHz
  • Single Display: HDMI/LVDS
  • HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz
  • Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
  • Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)

Specification

System
Processor
i.MX 8M applications processors
NXP i.MX 8M Quad Cortex-A53, 1.5GHz (Commercial)
NXP i.MX 8M Dual Cortex-A53, 1.5GHz (Commercial)
NXP i.MX 8M Quad Cortex-A53, 1.3GHz (Industrial)
NXP i.MX 8M Dual Cortex-A53, 1.3GHz (Industrial)
Memory
2GB/4GB Memory Down
Single Channel LPDDR4 up to 3200 MHz

Graphics
Controller
GC7000 Lite
Feature
OpenVG 1.1, OGL ES 3.1, Vulkan, OCL 1.2 FP
VPU Decode: 4Kp60 HEVC H.265, VP9, 4Kp60 H.264
Display
1 x HDMI (default)
1 x LVDS
HDMI: resolution up to 4096×2160 @60Hz
LVDS: resolution up to 1920×1080 @60Hz
Single Display
HDMI or LVDS

Expansion
Interface
1 x M.2 B key 3042/2242 (USB 3.1 Gen1), Nano SIM slot support
1 x M.2 E key 2230 (PCIe x1/USB 2.0)

Audio
Audio Codec
SGTL5000

Ethernet
Controller
1 x AR8035 Ethernet (10/100/1000Mbps)

Rear I/O
Ethernet
1 x GbE (RJ-45)
Serial
1 x RS485
USB
2 x USB 3.1 Gen1
1 x Micro USB 2.0 (Download mode)
Display
1 x HDMI

Internal I/O
Serial
1 x RS232
1 x RS-232/422/485 (2 x 6 pin header, 1.27mm pitch)
USB
2 x USB 2.0 (1.27mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x Backlight Power
Audio
1 x Audio (Line-out/Mic-in, 2.00mm pitch)
DIO
1 x 8-bit DIO (2 x 6 header, 1.27mm pitch)
SD
1 x Micro SD Slot
CANBus
1 x CANBus 2.0
I2C
1 x I2C (1.27mm pitch)
eMMC
Support eMMC 5.1 16GB on board (default)
Support up to 64GB (opt.)

Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
Single 12V +/-10% DC
Connector
2-poles Terminal Block (default)
DC Jack (available upon request)
Consumption
TBD
RTC Battery
CR2032 Coin Cell

OS Support
OS Support
Yocto 2.5 on eMMC (default)
Android 9.0

Environment
Temperature
Operating: -5 to 65°C; -30 to 80 °C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism
Dimensions
2.5″ SBC Form Factor
100mm (3.94″) x 72mm (2.83″)
Height
PCB: 1.6mm
Top Side: 15mm
Bottom Side: 4mm

Standards and Certifications
Certifications
CE, FCC, RoHS

Packing List
Packing List
1 M8M051 board
1 Terminal block for RS485 (COM3) 342-361021-000G
1 Heat sink A71-008150-000G

Country of Origin
Country of Origin
Taiwan

 

Ordering Information

  • M8M051-BCC-41QDC – Quad core Processor, 4GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -5 to 65°C
  • M8M051-BCC-21DLC – Dual core Processor, 2GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -5 to 65°C
  • M8M051-ECC-41QDI – Quad core Processor, 4GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -30 to 80°C
  • M8M051-ECC-21DLI – Dual core Processor, 2GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -30 to 80°C

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing
Lifecycle

Materials Management
Logistics

Logistics and Tracking
Manufacturing

External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test		 • Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System		 • Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels		 • Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

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