LEX 2I110D 11th Gen Tiger Lake-UP3 i7/i5/i3 2.5″ Embedded SBC

  • Product Name: Lex 2I110D
  • Motherboard Form Factor: 2.5″ SBC
  • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
  • RAM: 1 x DDR4 SODIMM (Max. 32GB)
  • Expansion: 1 x M.2 B Key, 1 x M.2 M Key
  • Other features: Multiple Independent display: HDMI, eDP, 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0, 2 x COM, 4DI / 4DO, 1 x Nano SIM, TPM 2.0

Description

  • 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
  • 1 x DDR4 SODIMM (Max. 32GB)
  • Multiple Independent display: HDMI, eDP
  • 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0
  • 2 x COM, 4DI / 4DO, 1 x Nano SIM
  • 1 x M.2 B Key, 1 x M.2 M Key
  • TPM 2.0

2I110D Specification

MODEL 2I110D
CPU Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
MB Chipset Intel® Tiger Lake-UP3 SoC
Graphics Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5
System Memory 1 x DDR4 3200 MHz SODIMM, Max 32GB
Storage 1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 B key Type 3042 (PCIe x2 / USB 3.0 / 2.0)
1 x M.2 M key Type 2242 (PCIe x4 / SATA), Support NVMe
BIOS AMI UEFI BIOS
Display 1 x HDMI, eDP
TPM TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM
LAN 1 x Intel GbE I219LM (external)
3 x Intel GbE I210IT (external)
Expansion Interface 1 x M.2 B key Type 3042 (PCIe x2 / USB 3.0 / 2.0),  1 x Nano SIM
1 x M.2 M key Type 2242 (PCIe x4 / SATA), Support NVMe
USB 3 x USB 3.0 (Type A) 6 x USB 2.0 (internal)
Serial IO 2 x RS232 / 422 / 485 (internal) ; eSPI
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~255 sec programmable
Power Input DC IN +12V
Dimension 2.5″ (108 x 102 mm)
Operation Temperature
(100 % CPU Usage)
-40°C~+70°C (Core i GRE series CPU)
-20°C~+70°C (Core i G7E / G7 series CPU)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Box PC: SKY 2
OS Support Windows® 10 IOT (64bit),
Ubuntu 18.04.2 above, Fedora 29 above
SKY2 2I110D enews 01 SKY2 2I110D enews 02

BVM Customisation Service

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

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Embedded Software: Configuration, Integration and Deployment

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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

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• Burn in Test
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