LEX 2I110D 11th Gen Tiger Lake-UP3 i7/i5/i3 2.5″ Embedded SBC

  • Product Name: Lex 2I110D
  • Motherboard Form Factor: 2.5″ SBC
  • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
  • RAM: 1 x DDR4 SODIMM (Max. 32GB)
  • Expansion: 1 x M.2 B Key, 1 x M.2 M Key
  • Other features: Multiple Independent display: HDMI, eDP, 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0, 2 x COM, 4DI / 4DO, 1 x Nano SIM, TPM 2.0

Description

The Lex 2I110D is a compact 2.5″ embedded single board computer designed for high-performance industrial and edge computing applications. Powered by 11th Gen Intel® Tiger Lake-UP3 processors, including Core™ i7, i5, i3, and Celeron options, it delivers strong processing and graphics capability in a space-efficient design.

Supporting up to 32GB of DDR4 memory via a single SODIMM slot, the platform offers flexible expansion with M.2 B Key and M.2 M Key interfaces, along with a Nano SIM slot for wireless connectivity. It features rich I/O including multiple independent display outputs via HDMI and eDP, four Intel Gigabit LAN ports, USB 3.0 and USB 2.0 connectivity, COM ports, and 4DI/4DO for industrial control integration. With TPM 2.0 security support, the Lex 2I110D is ideal for secure deployment in automation, IoT, and mission-critical embedded systems.

Key Features

  • 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
  • 1 x DDR4 SODIMM (Max. 32GB)
  • Multiple Independent display: HDMI, eDP
  • 4 x Intel GbE LAN, 3 x USB 3.0 (type A), 6 x USB 2.0
  • 2 x COM, 4DI / 4DO, 1 x Nano SIM
  • 1 x M.2 B Key, 1 x M.2 M Key
  • TPM 2.0

2I110D Specification

MODEL 2I110D
CPU Intel® Tiger Lake-UP3, i7 / i5 / i3 / Celeron CPU
MB Chipset Intel® Tiger Lake-UP3 SoC
Graphics Intel® UHD Graphics, Support DirectX 12 & OpenGL 4.5
System Memory 1 x DDR4 3200 MHz SODIMM, Max 32GB
Storage 1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 B key Type 3042 (PCIe x2 / USB 3.0 / 2.0)
1 x M.2 M key Type 2242 (PCIe x4 / SATA), Support NVMe
BIOS AMI UEFI BIOS
Display 1 x HDMI, eDP
TPM TPM 2.0 (Firmware) ; OEM Optional to Hardware TPM
LAN 1 x Intel GbE I219LM (external)
3 x Intel GbE I210IT (external)
Expansion Interface 1 x M.2 B key Type 3042 (PCIe x2 / USB 3.0 / 2.0),  1 x Nano SIM
1 x M.2 M key Type 2242 (PCIe x4 / SATA), Support NVMe
USB 3 x USB 3.0 (Type A) 6 x USB 2.0 (internal)
Serial IO 2 x RS232 / 422 / 485 (internal) ; eSPI
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~255 sec programmable
Power Input DC IN +12V
Dimension 2.5″ (108 x 102 mm)
Operation Temperature
(100 % CPU Usage)
-40°C~+70°C (Core i GRE series CPU)
-20°C~+70°C (Core i G7E / G7 series CPU)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Box PC: SKY 2
OS Support Windows® 10 IOT (64bit),
Ubuntu 18.04.2 above, Fedora 29 above

Lex 11th Gen Tiger Lake SBC’s

Model Form Factor CPU RAM LAN Display Key Features
3I110HW 3.5″ Tiger Lake-UP3 Up to 64GB 3× GbE VGA / HDMI / DP / Type-C DP / eDP-LVDS TPM 2.0 (opt), rich multi-display, Mini PCIe, M.2, SIM
3I110BW 3.5″ Tiger Lake-UP3 Up to 64GB 3× GbE VGA / HDMI / DP / Type-C DP / eDP-LVDS Battery charger function, TPM 2.0 (opt), expansion heavy
2I110D 2.5″ Tiger Lake-UP3 Up to 32GB 4× GbE HDMI / eDP Compact design, TPM 2.0, rich I/O
2I110AW 2.5″ Tiger Lake-UP3 Up to 32GB 3× 2.5GbE 4× HDMI High multi-display output, TPM 2.0

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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