LEX 3I140DW 14th Gen Meteor Lake 3.5″ SBC with 5x 2.5 GbE LAN

  • Product Name: LEX 3I140DW
  • Motherboard Form Factor: 3.5″ SBC
  • CPU: Intel Core Ultra 7/5 (14th Gen, Meteor Lake)
  • RAM: 2 x DDR5 SODIMM (up to 64GB)
  • Expansion: 1 x M.2 M Key, 2 x M.2 B Key, 1 x Nano SIM, 1 x PCIe
  • Other features: 5 x 2.5 GbE LAN, Multiple displays (HDMI, DP, LVDS, Type C DP ALT), 3 x USB 3.2, 3 x USB 2.0, 4 x COM, 2 x CANBus 4DI/4DO, Audio, TPM 2.0, SMBus, I2C, I2S

Description

Introducing the LEX SYSTEM 3I140DW is a high-performance 3.5″ single-board computer powered by Intel® 14th Gen Core™ Ultra 7/5 processors (Meteor Lake), designed for demanding industrial and embedded applications. It supports up to 64GB DDR5 RAM via dual SODIMM slots, ensuring smooth multitasking and fast data processing. Equipped with multiple independent display outputs—HDMI, DisplayPort, LVDS, and Type-C DP ALT—the system delivers versatile visual connectivity for digital signage, control panels, or AI-driven applications. Networking is robust with 5 x 2.5 GbE LAN ports, complemented by multiple USB interfaces for peripheral expansion.

The board offers extensive expansion options, including M.2 M Key, 2 x M.2 B Key, PCIe, and Nano SIM support. Industrial-grade I/O is included with 4 x COM ports, 2 x CANBus (4DI/4DO), and audio support, along with enhanced security and system management features such as TPM 2.0, SMBus, I2C, and I2S. Ideal for industrial automation, AIoT, and embedded systems, the LEX 3I140DW delivers a compact, reliable, and versatile computing solution for modern industrial workloads.

Key Features

  • Intel® Core™ Ultra 7/5 processors
  • 2 x DDR5 SODIMM (Max. 64GB)
  • Multiple Independent display:
    1 x HDMI®, 1 x DP, 1 x LVDS, 1 x Type C DP ALT
  • 5 x Intel 2.5 GbE LAN, 3 x USB 3.2 Gen 1×1, 3 x USB 2.0
  • 1 x M.2 M Key, 2 x M.2 B Key, 1 x Nano SIM, 1 x PCIe
  • 4 x COM, 2 x CANBus 4DI/4DO, Audio
  • TPM 2.0, SMBus, I2C, I2S

Specification

MODEL 3I140DW
CPU Intel® Core™ Ultra 7/5 Series processors (Meteor Lake-U/H) (Arrow Lake-U/H)
Chipset Intel® Arc™ graphics ; Intel® UHD Graphics
System Memory 2 x DDR5 SODIMM, Max 64GB
Storage 1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 M key Type 2280 (PCIe x4), Support NVMe
BIOS AMI UEFI BIOS
Display 1 x HDMI® ; 1 x DP ; 1 x Type C DP ALT,
1 x LVDS / eDP (eDP for BIOS)
TPM Hardware TPM 2.0 ; OEM Optional to Firmware TPM 2.0
LAN 5 x Intel 2.5GbE I226-IT (external)
Audio High Definition Audio Specification, Support Line-out / Mic-in / Line-in
Two channel Class D Audio Amplifier
Expansion Interface 1 x M.2 M key Type 2280 (PCIe x 4), Support NVMe, (OEM to Type 3042)
1 x M.2 B key Type 3042 (USB 3.2 Gen 1×1 / USB 2.0) (OEM to Type 3052)
1 x M.2 B key Type 3042 (PCIe / USB 2.0)
1 x Nano SIM
1 x PCIe x 1 golden finger with U Serits CPU or
1 x PCIe x 8 golden finger with H Serits CPU
Expansion Module Converter Card:

CN064: M.2 B Keyto M.2 E Key 2230, WiFi 6 + BT

USB 3 x USB 3.2 Gen 1×1 (external), 1 x Type C USB 3.2
1 x USB 2.0 (external) ;
2 x USB 2.0 (internal)
Serial IO 4 x RS232 / 422 / 485 (internal) ; eSPI
*COM1~COM4 pin9 5V / 12V (Option)
CANBus 2 x CANBus
SMBus / I2C / I2S 1 x SMBus ; 1 x 12C ; 1 x I2S
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~255 sec programmable
Power Input Wide Range DC IN +9~36V
Dimension 3.5″ Plus (155 x 150 mm) ; Weight: 205g
Operation Temperature
(100 % CPU Usage)
-40°C~70°C
(under specific environmental & CPU power consumption conditions)
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) HAWK
OS Support Windows 10 / 11 (64bit)
Linux Ubuntu 22.04 / Kernel 5.15

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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