Neousys Nuvo-9531 13th/12th Gen Fanless Computer

  • Product Name: Neousys Nuvo-9531
  • System Type: Fanless Industrial PC
  • CPU: Intel 13th/12th-Gen Core 35W/ 65W LGA1700 CPU
  • RAM: Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
  • Expansion: 1xM.2 2280 Gen4x4 NVMe and 1x hot-swappable HDD tray for storage
  • Other features: 212 x 165 x 63 mm low-profile design, Rugged, -25°C to 60°C fanless operation, 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock, 4-CH isolated DI and 4-CH isolated DO, VGA + DP dual display outputs, Optional ignition power control

Description

Based on Intel’s 13th/12th-Gen processor platforms, the Neousys Nuvo-9531 is one of the most compact fanless embedded PC’s in today’s industrial PC market. Measuring just 212 x 165 x 63 mm, the PC can fit into space compromised areas, for example, within in robotic arms or AMR’s (autonomous mobile robots) applications.

Despite its compact size, the Nuvo-9531 does not disappoint on performance. Built via the advanced Intel 7 process practices, Intel 13th Gen processors have up to 24 cores/ 32 threads to deliver up to 2 x the performance when compared to previous Intel 10th or 11th Gen platforms.

The Nuvo-9531 has a rich abundance of i/o functionality,  featuring 4 x 2.5GbE with optional PoE+ PSE and four USB3.2 Gen1 ports for applications where multiple camera connectivity is needed – for example, in machine vision or surveillance applications.

In addition, the Nuvo-9351 features a Gen4 x4 M.2 NVMe slot for the latest NVMe SSDs to support read/ write speeds of up to 7000 MB/s.

Additionally, there’s a hot-swappable HDD tray to exchange the storage drive without turning off the system or dismantling the chassis – and 2 x mPCIe and 1 x  M.2 E key slots to install WiFi or 5G/ 4G wireless communication modules.

The Nuvo-9531  is also equipped with 8x DIO, 2x COM ports – and provides dual display outputs to specifically suit industrial embedded application needs.

Key Features

  • 212 x 165 x 63 mm low-profile design
  • Intel® 13th/12th-Gen Core™ 35W/ 65W LGA1700 CPU
  • Rugged, -25°C to 60°C fanless operation
  • 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock
  • 1xM.2 2280 Gen4x4 NVMe and 1x hot-swappable HDD tray for storage
  • 4-CH isolated DI and 4-CH isolated DO
  • VGA + DP dual display outputs
  • Optional ignition power control

Specification

System Core
Processor Supporting Intel® 13th-Gen Core™ CPU (LGA1700 socket, 65W/ 35W TDP)
– Intel® Core™ i9-13900E/ i9-13900TE
– Intel® Core™ i7-13700E/ i7-13700TE
– Intel® Core™ i5-13500E/ i5-13400E/ i5-13500TE
– Intel® Core™ i3-13100E/ i3-13100TE
Supporting Intel® 12th-Gen Alder Lake Core™ CPU (LGA1700 socket, 35W/ 65W TDP)
– Intel® Core™ i9-12900E/ i9-12900TE
– Intel® Core™ i7-12700E/ i7-12700TE
– Intel® Core™ i5-12500E/ i5-12500TE
– Intel® Core™ i3-12100E/ i3-12100TE
– Intel® Pentium® G7400E/ G7400TE
– Intel® Celeron® G6900E/ G6900TE
Chipset Intel® H610E platform controller hub
Graphics Integrated Intel® UHD Graphics 770 (32EU) / 730 (24EU)
Memory Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
TPM Supports dTPM 2.0
I/O Interface
Ethernet Port 4x 2.5GBASE-T Ethernet ports by Intel® I226-IT GbE controllers
PoE+ Optional IEEE 802.3at PoE+ PSE for 4×2.5GbE ports 100 W total power budget
USB 4x USB 3.2 Gen1 (5 Gbps) ports
2x USB 2.0 ports
Video Port
(Integrated Graphics)
1x VGA output, supporting 1920 x 1200 resolution
1x DisplayPort, supporting 4096 x 2304 resolution
Serial Port 1x software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Audio 1x 3.5 mm jack for mic-in and speaker-out
Isolated DIO 4-CH isolated DI and 4-CH isolated DO
Internal Expansion Bus
Mini PCI Express 2x full-size mini PCI Express sockets with internal SIM sockets
M.2 E key 1x M.2 2230 E key socket for WiFi5, WiFi6 or Google edge TPU module
Storage Interface
SATA HDD 1x hot-swappable 2.5″ HDD/ SSD tray for 7mm HDD/ SSD
M.2 1x M.2 2280 M key socket (PCIe Gen4 x4) for NVMe SSD
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8 to 48V DC input with optional ignition power control
Mechanical
Dimension 212 mm (W) x 165 mm (D) x 63 mm (H)
Weight 2.5kg
Mounting Wall-mount (standard) or DIN-rail mount (optional)
Environmental
Operating Temperature with 35W CPU
-25°C ~ 60°C *
with 65W CPU (installation of the optional fan kit is recommended)
-25°C ~ 60°C */**
Storage Temperature -40°C ~ 85°C
Humidity 10%~90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC CE/FCC Class A, according to EN 55032 & EN 55035

* For sub-zero operating temperature, a wide temperature HDD or Solid State Disk (SSD) is required.
** For 65W CPUs, the optional fan kit is recommended for operating at ambient temperatures higher than 50°C.

Power Backup Modules:

Power Backup Modules

PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module

Power Backup Modules

PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module

Ordering Information

Nuvo-9531

Intel® 13th/12th-Gen Core™ i9/ i7/ i5/ i3 compact fanless computer with 4x 2.5GbE , 4x USB3.2 Gen 1 and a hot-swappable HDD tray

Optional 802.3at PoE+ PSE for 4x 2.5GbE ports

Optional ignition power control

Optional Accessories

PA-160W-OW

160W AC-DC power adapter 20V/8A; 18AWG/120cm; cord end terminals for terminal block, operating temperature: -30°C to 70°C.

PA-280W-ET2

280W AC/DC power adapter 24V/ 11.67A ; 16AWG/ 100cm; cord end terminals for terminal block, operating temperature : -30°C to 60°C.(recommended for 65W CPU)

DINRAIL-31

DIN-rail mounting assembly for Nuvo-9531 series

Fan kit

Fan kit with 92mm x 92mm fan for Nuvo-9531 series

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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