Neousys POC-960GC AMD Ryzen PRO 8640U Compact GPU Computer

  • Product Name: Neousys POC-960GC
  • System Type: Compact fanless GPU computer supporting NVIDIA low-profile graphics cards up to 70W for edge AI, vision, and industrial computing applications.
  • CPU: AMD Ryzen PRO 8640U CPU with 6 cores and 12 threads, 15W–30W TDP.
  • RAM: Supports up to 32GB ECC or non-ECC DDR5 5600 SDRAM memory.
  • Expansion: 1x M.2 2280 NVMe slot for high-speed storage and 2x Mini-PCIe slots for wireless communication and expansion modules.
  • Other Features: 4x Gigabit Ethernet ports with optional PoE+, 1x 2.5GbE LAN, 4x USB 3.2 Gen 2 ports, -25°C to 60°C operating temperature range, and 12–35V DC input with remote power control.

Description

The Neousys POC-960GC is a compact and rugged GPU computing platform designed for demanding edge AI, machine vision, and industrial automation applications. Powered by the AMD Ryzen™ PRO 8640U processor, the system delivers an excellent balance of performance and energy efficiency with six processing cores and twelve threads, making it ideal for data-intensive workloads at the edge. Engineered to support NVIDIA® low-profile graphics cards up to 70W, the POC-960GC provides powerful GPU acceleration for AI inference, image processing, video analytics, and autonomous systems while maintaining a compact footprint. The system supports up to 32GB of DDR5 5600 memory with ECC and non-ECC options, ensuring fast and reliable operation in mission-critical environments.

For connectivity, the POC-960GC features four Gigabit Ethernet ports, with optional PoE+ support, alongside a dedicated 2.5GbE port for high-speed network communication. Four USB 3.2 Gen 2 ports provide fast peripheral connectivity, while an M.2 2280 NVMe slot enables high-performance storage expansion. Additional flexibility is provided through dual Mini-PCIe slots for wireless communication modules and other expansion options. Designed for deployment in harsh industrial environments, the POC-960GC operates reliably in temperatures ranging from -25°C to 60°C and accepts a wide 12V to 35V DC power input. Remote power control functionality further enhances system integration for unmanned and remote installations.

Combining advanced AMD processing technology, GPU expansion capabilities, and industrial-grade reliability, the Neousys POC-960GC is an ideal solution for edge AI computing, smart transportation, autonomous machines, machine vision inspection, and intelligent surveillance applications.

Key Features

  • AMD Ryzen PRO 8640U processor 15W-30W TDP with 6C/ 12T
  • Supports NVIDIA® low-profile GPU card up to 70W
  • Up to 32 GB ECC/ non-ECC DDR5 5600 SDRAM
  • 4x GbE with optional POE+, 1x 2.5GbE and 4x USB3.2 Gen 2
  • 1x M.2 2280 NvME for storage and 2x Mini-PCIe for wireless connection
  • -25°C to 60°C temperature operation
  • 12-35V DC input with remote control

Specification

System Core
Processor AMD® Ryzen™ PRO 8640U CPU (6C/ 12T, 3.5/ 4.9 GHz, 15W-30W TDP)
   
Chipset AMD® Radeon RDNA3 Graphics
(16 TOPs NPU with Ryzen™ AI, 31 TOPs for total SoC)
Memory Up to 32 GB DDR5-5600 SDRAM (one SODIMM socket)
TPM Supports dTPM 2.0
I/O Interface
Ethernet 1x 2.5Gb Ethernet port by Intel® I226-V with WOL (port #1)
4x Gb Ethernet ports by Intel® I350-AM4 (port #2~5)
PoE+ Optional IEEE 802.3at PoE+ for port #2~ 5, 100W total power budget
Native Video Port 1x HDMI™ 2.0b, Supporting 3840 x 2160 60Hz
Serial Port 1x Software-programmable RS-232/422/485 ports (COM1)
USB 4x USB 3.2 ports Gen 2
Isolated DIO 4-CH isolated DI and 4-CH isolated DO
Storage Interface
M.2 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD
Expansion Bus
PCI Express 1x Low-profile PCIe x16 slot @ Gen4, 8-lanes PCIe signals for installing an NVIDIA® graphics card up to 70W TDP
Mini-PCI Express 2x full-size mini PCI Express socket with 1x internal micro SIM socket
   
Power Supply
DC Input 1x 3-pin pluggable terminal block for 12 to 35V DC input with remote control or optional ignition power control
Mechanical
Dimension 175 mm (W) x 159 mm (D) x 77 mm (H)
Weight 1.8 kg
Mounting Wall-mount (Standard)
Environmental
Operating Temperature 25°C ~ 60°C (15W TDP, without FAN)
-25°C ~ 45°C (30W TDP, without FAN)
-25°C ~ 60°C (30W TDP, with FAN)
Storage Temperature -40°C ~ 85°C
Humidity 10%~90% , non-condensing
Vibration MIL-STD-810H, Method 514.8, Category 4
Shock MIL-STD-810H, Method 516.8, Procedure I
EMC CE/FCC Class A, according to EN 55032 & EN 55035

Ordering Information

POC-960GC

Compact GPU Computer supporting 70W GPU and AMD® Ryzen™ 8640U processor

POC-960GC-PoE

Compact GPU Computer supporting 70W GPU and AMD® Ryzen™ 8640U processor , with IEEE 802.3at PoE+

Optional Accessories

PA-160W-OW

160W AC/DC power adapter 20V/ 8A; 18AWGx4C/ 120cm, cord end terminals for terminal block, operating temperature : -30°C to 70 °C

PA-280W-ET2

280W AC/DC power adapter 24V/ 11.67A ; 16AWG/ 100cm; cord end terminals for terminal block, operating temperature : -30°C to 70°C.

AccsyBx-Cardholder-960GC-RTX Pro 2000

POC-960GC GPU Bracket kit for RTX PRO 2000 Blackwell

AccsyBx-334LP-bkt-POC-960GC

POC-960GC PCIe bracket kit for PCIe-334LP

AAccsyBx-FAN-POC-960GC

Fan assembly for POC-960GC series, 92x92x25 mm

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.