AAEON BOXER-6801-RAP 13th Gen Fanless Embedded Computer

AAEON BOXER-6801-RAP 13th Gen Fanless Embedded Computer

Product Name: AAEON BOXER-6801-RAP
System Type: Fanless Embedded Computer
CPU: 13th Gen Intel Core i7/i5/i3 Mobile Processor
RAM: 2x DDR5 SODIMM, up to 96GB
Expansion: 1x PCIe [x1], 1x PCI slot
Other Features: 5x 2.5GbE LAN (4 with PoE, 60W total), 9–36V DC input with protection, -20~60°C operating range, TPM 2.0 onboard

Description

The AAEON BOXER-6801-RAP is a high-performance fanless embedded computer powered by 13th Gen Intel® Core™ mobile processors (Raptor Lake-P). Designed for industrial and edge applications, it supports up to 96GB DDR5 memory and offers versatile expansion with PCIe and PCI slots. Featuring five 2.5GbE LAN ports (four with PoE), wide-range 9–36V DC input with protection, and reliable operation across -20~60°C, this system is ideal for demanding environments requiring performance, connectivity, and durability.

Key Features

13th Gen Intel® Core™ i7/i5/i3 Mobile Processors (Formerly Raptor Lake-P series)
DDR5 SODIMM x2 up to 96GB
2.5 GbE LAN x5 (4 with PoE Functionality, Sharing 60W In Total)
PCIe[x1] Slot x1 & PCI Slot x1
Wide Range 9~36V DC Input with Protection Circuit
Wide Operating Temperature -20~60°C
TPM 2.0 onboard

Specification

Category	Specification
System
CPU	13th Gen Intel® Core™ i7/i5/i3 Mobile Processors (Raptor Lake-P, up to 28W) • i7-1370PE • i5-1340PE • i3-1320PE
Chipset	Intel® SoC
System Memory	2x DDR5 SO-DIMM, up to 96GB
Display Interface	2x HDMI
Storage	1x 2.5” SATA Drive Bay 1x M.2 2280 M-key (PCIe Gen4x4)
Ethernet	5x 2.5GbE (Intel® I226-LM)
I/O	• 4x 2.5GbE with PoE (IEEE802.3 at/af, 60W total shared; limited to <20W if input ≤12V) • 2x USB 3.2 Gen 2 (Type-A) • 2x USB 2.0 (Type-A) • 2x DB-9 for RS-232/422/485 • 1x DB-15 for DIO (8-bit) • 1x Front-access SIM slot • 1x 3.5 mm jack (Line-out/Mic-in) • 6x Antenna openings • 1x Reset button • 1x Power button
Expansion	• 1x M.2 2280 M-key • 1x M.2 2230 E-key (PCIe) • 1x M.2 3052 B-key (USB) with SIM slot • 1x PCIe [x1] slot (Max: 150x110x20 mm) • 1x PCI slot (Max: 150x110x20 mm)
OS Support	Windows® 10 IoT 2021 LTSC Windows® 11 IoT LTSC Ubuntu 24.04+
Power Supply	DC-in 9~36V via 3-pin terminal block, with protection circuit
Mechanical
Mounting	Wall mount (optional DIN-rail mount)
Dimensions (W x H x D)	264 x 179 x 124 mm (without brackets)
Weight	Gross: 6.3 kg (13.89 lb) Net: 4.9 kg (10.80 lb)
Environmental
Operating Temperature	-20°C ~ 60°C (-4°F ~ 140°F) with 0.7 m/s airflow (with wide-temp memory/storage)
Storage Temperature	-40°C ~ 80°C (-40°F ~ 176°F)
Humidity	5 ~ 95% @ 40˚C, non-condensing
Anti-Vibration	With SSD: Random, 3Grms, 5~500Hz
Anti-Shock	With SSD: 50G @ wallmount, Half-sine, 11ms
Certification	CE/FCC Class A

Ordering Information

PART NUMBER	BOXER-6801-RAP-A1-1010	BOXER-6801-RAP-A2-1010	BOXER-6801-RAP-A3-1010
Chipset	Intel® Core™ i3-1320PE Processor	Intel® Core™ i5-1340PE Processor	Intel® Core™ i7-1370PE Processor
Cooler	Fanless	Fanless	Fanless
Storage	2.5” SATA Drive Bay x 1 M.2 2280 M-key x 1	2.5” SATA Drive Bay x 1 M.2 2280 M-key x 1	2.5” SATA Drive Bay x 1 M.2 2280 M-key x 1
Display	HDMI x 2	HDMI x 2	HDMI x 2
LAN	2.5GbE x 5	2.5GbE x 5	2.5GbE x 5
USB	USB 3.2 Gen 2 (Type-A) x 2 USB 2.0 (Type-A) x 2	USB 3.2 Gen 2 (Type-A) x 2 USB 2.0 (Type-A) x 2	USB 3.2 Gen 2 (Type-A) x 2 USB 2.0 (Type-A) x 2
RS-232/422/485	2	2	2
Expansion Slot	M.2 2280 M-key x 1 M.2 2230 E-key x 1 (PCIe) M.2 3052 B-Key x 1 (USB) with SIM slot PCIe[x1] slot x1 PCI slot x1	M.2 2280 M-key x 1 M.2 2230 E-key x 1 (PCIe) M.2 3052 B-Key x 1 (USB) with SIM slot PCIe[x1] slot x1 PCI slot x1	M.2 2280 M-key x 1 M.2 2230 E-key x 1 (PCIe) M.2 3052 B-Key x 1 (USB) with SIM slot PCIe[x1] slot x1 PCI slot x1
Power	DC-in 9~36V	DC-in 9~36V	DC-in 9~36V

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test