AAEON GENESYSM-MTH6 14th Gen Core Ultra (Meteor Lake) Compact PC

  • Product Name: AAEON GENESYSM-MTH6
  • System Type: Compact PC
  • CPU: Intel 14th Gen Core Ultra (Meteor Lake) Series 1
  • RAM: DDR5 5600 MHz, Dual Channel SODIMM x2, up to 96GB
  • Expansion: M.2 2280 M-Key x3, M.2 3052 B-Key x1, M.2 2230 E-Key x1; DP x1, HDMI x1
  • Other Features: LAN x3, RS-232/422/485 x2, USB 3.2 Gen 2 x2, USB 2.0 x4, TPM 2.0, DC 9~36V input

Description

The AAEON GENESYSM-MTH6 is a high-performance compact PC (SBC Here) designed for demanding industrial and embedded applications. Powered by Intel’s 14th Gen Core Ultra (Meteor Lake) Series 1 processors, it delivers exceptional processing power and efficiency in a space-saving form factor. Equipped with DDR5 5600 MHz memory supporting up to 96GB across dual-channel SODIMM slots, the GENESYSM-MTH6 ensures smooth multitasking and fast data handling. Expansion options are versatile, featuring multiple M.2 slots (2280 M-Key x3, 3052 B-Key x1, 2230 E-Key x1) and display outputs (DP x1, HDMI x1), allowing for flexible storage and connectivity configurations.

Connectivity is comprehensive, with triple LAN ports, dual RS-232/422/485 serial interfaces, USB 3.2 Gen 2 and USB 2.0 ports, and TPM 2.0 security. The system supports a wide DC input range of 9~36V, making it ideal for industrial, IoT, and embedded computing environments where reliability is critical. Compact yet powerful, the GENESYSM-MTH6 combines rugged versatility, advanced performance, and flexible expansion to meet the needs of modern industrial and embedded computing applications.

Key Features

  • Intel Core Ultra processors (Series 1)
  • DDR5 5600 MHz, Dual Channel SODIMM x 2, up to 96GB
  • DP x 1, HDMI x 1
  • LAN x 3, RS-232/422/485 x 2
  • USB 3.2 Gen 2 x 2, USB 2.0 x 4
  • M.2 2280 M-Key x 3, M.2 3052 B-Key x 1, M.2 2230 E-Key x 1
  • TPM 2.0
  • DC 9 ~ 36V input

Specification

Category Specification
System  
Form Factor 3.5″ SubCompact Board System
CPU Intel® Core™ Ultra Processors:
• Core™ Ultra 7 Processor 155H (16C/22T, up to 4.8 GHz, 28W)
• Core™ Ultra 5 Processor 125H (14C/18T, up to 4.5 GHz, 28W)
• Core™ Ultra 7 Processor 155U (12C/14T, up to 4.8 GHz, 15W)
• Core™ Ultra 5 Processor 125U (12C/14T, up to 4.3 GHz, 15W)
Chipset Integrated Intel® SoC
Memory Type DDR5 5600, Dual Channel SODIMM x 2, Max. 96GB, Non-ECC
BIOS UEFI
Wake on LAN Yes
Watchdog Timer 255 Levels
Security TPM 2.0
RTC Battery Lithium Battery 3V/240mAh
Dimension 7.48″ x 5.28″ x 1.69″ (190mm x 134.1mm x 43mm)
OS Support Windows 10 IoT LTSC (21H2), Windows 11 IoT LTSC (24H2), Linux Ubuntu 22.04.3 (kernel 6.2.0-26-generic)
Power  
Power Requirement +9-36V (Optional: +12V), support ERP
Power Supply Type ATX
Connector DC Jack Connector
Power Consumption Typical: Core™ Ultra 7 155H, DDR5 32GB x 2, 5.78A @+12V
Max: Core™ Ultra 7 155H, DDR5 32GB x 1, 8.42A @+12V
Display  
Controller Intel® Arc™ Graphics / Intel® Graphics LVDS/eDP
Display Interface HDMI 2.1 x1 (up to 8K x 4K@60Hz or 4K x 2K@120Hz), DP 2.0 x1 (up to 7680×4320@60Hz, support DP++)
Multiple Display Up to 2 simultaneous displays
Audio  
CODEC Realtek ALC897
Audio Interface Line-in / Line-out / MIC
Speaker
External I/O  
Ethernet Intel® Ethernet Controller I226 2.5GbE RJ-45 x2, Intel® Ethernet Connection I219 1GbE RJ-45 x1
vPro support for PXE with specific CPUs
USB USB 3.2 Gen 2 x2, USB 2.0 x4
Serial Port COM 1, COM 2 (RS-232/422/485, supports 5V/12V/RI)
Video HDMI 2.1 x1, DP 2.0++ x1
Internal I/O  
USB
Serial Port
Video
SATA
Audio Audio Header x1
DIO/GPIO GPIO 8-bit
SMBus/I2C SMBus/I2C x1 (Default: SMBus)
Touch
Fan 4-pin Smart Fan x1
SIM Nano SIM x1
Front Panel HDD LED, PWR LED, Power Button, Buzzer, Reset
Others
Expansion  
Mini PCI-E/mSATA
M.2 2280 M-Key x1 (PCIe [x4], SATA)
3052 B-Key x1 (PCIe [x2]/[x1], USB 3.0)
2230 E-Key x1 (PCIe, USB 2.0, Wi-Fi 6E CNVi)
2280 M-Key x2 (PCIe [x4] via PER-SB2B FPC2)
Others
Environment & Certification  
Operating Temperature 14°F ~ 122°F (-10°C ~ 50°C), 0.7 m/s airflow
Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C)
Operating Humidity 0% ~ 90% RH, non-condensing
MTBF (hours) 753,493
EMC CE / FCC Class A

Ordering Information

PART NUMBER GENESYSM-MTH6-A10-A001 GENESYSM-MTH6-A10-A002
CPU Intel® Core™ Ultra 7
Processor 155H
Intel® Core™ Ultra 5
Processor 125H
Fan/Fanless Cooler Cooler
Display HDMI x 1
DP x 1
HDMI x 1
DP x 1
Storage
LAN GbE x 1
2.5GbE x 2
GbE x 1
2.5GbE x 2
USB USB 3.2 Gen 2 x 2
USB 2.0 x 4
USB 3.2 Gen 2 x 2
USB 2.0 x 4
RS-232/422/485 2 2
Expansion slot M.2 2280 M-Key x 3
M.2 3052 B-Key x 1
M.2 2230 E-Key x 1
M.2 2280 M-Key x 3
M.2 3052 B-Key x 1
M.2 2230 E-Key x 1
TPM 2.0 2.0
Power +9V~36V ATX +9V~36V ATX
Operating Temp -10°C ~ 50°C -10°C ~ 50°C
Others

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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