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Commell LE-37O 3.5″ Tiger Lake i7 SBC

  • Product Name: Commell LE-37O
  • Motherboard Form Factor: 3.5″ SBC
  • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
  • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
  • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
  • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
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SKU: LE-37O7 Category: Tags: , , , , , , , , , Brand:

Description

  • CPU: Intel® Tiger Lake UP3 Processor in the FCBGA1449 sockets.
  • Memory: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory.
  • Integrated Graphics: Intel® Iris® Xe Graphics.
  • LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply
  • Display port interface: Onboard Display port connector.
  • HDMI interface: Onboard HDMI connector.
  • VGA interface: Onboard VGA connector.
  • LAN Interface: 1 x Intel® i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel® i225-LM Gigabit LAN (up to 2.5GbE).
  • Serial ATA: Support 2 x SATA3.
  • Audio: Realtek ALC262 High Definition Audio.
  • Internal I/O: 2 x SATA3, 2 x RS232,  2 x RS232/422/485, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter connector, 1 x GPIO, 1 x Audio, 1 x PS/2, 1 x SMBus.
  • Rear I/O: 1 x DisplayPort, 1 x HDMI, 1 x VGA, 4 x USB3.2 Gen2, 2 x LAN.
  • Extended interface: One PCIE Mini card (Support mSATA), one M.2 (Key E), one M.2 (Key M) for NVMe.
  • GPIO interface: Onboard programmable 8-bit Digital I/O interface.
  • Power requirement: DC input 9~35V.

Specification

Form Factor 3.5″ Single Board Computer
Processor

Intel® Tiger Lake UP3 Processor

Package Type: FCBGA1449
Memory 1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory)
Integrated Graphics Intel® Iris® Xe Graphics
Real Time Clock   Chipset integrated RTC with onboard lithium battery
Watchdog Timer Generates a system reset with internal timer for 1min/s ~ 255min/s
Serial ATA Interface

Intel® built-in 2 x Serial ATA3 interface up to 600MB/s

Support RAID 0, 1 and Intel Rapid Storage Technology.
VGA Interface Onboard VGA connector
LVDS Interface Onboard 24-bit dual channel LVDS connector with +3.3V/+5V/+12V supply
 Display port Interface  Onboard Display port connector
 HDMI Interface  Onboard HDMI connector
Audio Interface Realtek ALC262 HD Audio
LAN Interface 1 x Intel® i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel® i225-LM Gigabit LAN
GPIO Interface Onboard programmable 8-bit digital I/O interface
Extended Interface  1 x PCIE Mini card (Support mSATA), 1 x M.2 (Key E), 1 x M.2 (Key M) for NVMe
Internal I/O Port 2 x SATA3, 2 x RS232/422/485, 2 x RS232, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter connector, 1 x GPIO, 1 x Audio (MIC-in & Line-out), 1 x PS/2(Keyboard & Mouse), 1 x SMBus
Rear I/O Port 1 x DisplayPort, 1 x HDMI, 1 x VGA, 4 x USB3.2 Gen2, 2 x LAN
Power Requirement  DC input 9~35V
Board Dimension 146 mm x 101 mm (L x W)
Temperature

Operating within 0 ~ 60°C

Storage within -20 ~ 80°C
Relative Humidity 10%~90%, non-condensing

 

Ordering Information

LE-37O7 With i7-1185G7E + Cooler fan, support HDMI, LVDS, DP, VGA, 2.5G LAN
 LE–37OC With 6305E + Cooler fan, support HDMI, LVDS, DP, VGA, 2.5G LAN
ADP-3355 DisplayPort to VGA module

ADP-3460

DisplayPort to LVDS module

Note1: There are two module (ADP-3355, ADP-3460), and you can choose one to support 2nd VGA or 2nd  LVDS, please contact with our sales for OEM version.

Note2: If you want to use other TGL UP3 CPU (i7–1185GRE,i5–1145GRE,i5–1145G7E,i3-1115GRE,i3-1115G4E), please contact with our sales.

Commell 11th Gen Tiger Lake SBCs

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing
Lifecycle

Materials Management
Logistics

Logistics and Tracking
Manufacturing

External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test		 • Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System		 • Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels		 • Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

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