DFI ADN171/ADN173 Alder Lake-N Processors Mini-ITX SBC

  • Product Name: DFI ADN171/ADN173
  • Motherboard Form Factor: Mini-ITX SBC
  • CPU: Intel Atom Alder Lake-N Processors
  • RAM: 1 DDR5 4800MHz SO-DIMM, up to 16GB
  • Expansion: 1 M.2 A Key, 1 M.2 B Key, 1 M.2 E Key
  • Other features: 4K High Resolution Support, Triple Display Capability, Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0, Longevity Support: Typically supports a 10-Year CPU Life Cycle Until Q1’ 33.

Description

Introducing the DFI ADN171/ADN173 Mini-ITX SBC motherboard, powered by Intel® Atom® Alder Lake-N Processors. Designed for compact systems, it boasts 1 DDR5 4800MHz SO-DIMM slot, accommodating up to 16GB of RAM for efficient multitasking. With multiple expansion slots including 1 M.2 A Key, 1 M.2 B Key, and 1 M.2 E Key, you can customize your setup to suit your needs. Enjoy stunning 4K resolution with triple display capability, and stay connected with rich I/O connectivity featuring 2 2.5GbE LAN ports, up to 4 USB 3.2 ports, 1 USB Type C port, 2 SATA3 ports, and 2 USB2.0 ports. Plus, with a 10-Year CPU Life Cycle until Q1’33, you can count on long-lasting performance.

Key Features

  • Intel® Atom® Alder Lake-N Processors
  • 1 DDR5 4800MHz SO-DIMM update 16GB
  • 4K High Resolution: Supports 4K/ 2K resolution
  • Triple Display: DP++/VGA + HDMI/DP++ + USB-Type C + *M2A-Display (optional)
  • Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0
  • Multiple Expansion: 1 M.2 A Key, 1 M.2 B Key, 1 M.2 E Key
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 33 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.

Specification

System
Processor
Intel® Atom® Alder Lake-N Processors, TDP up to 15W
Intel® Core i3-N305 Processor, 8 Core, 6M Cache, 3.8GHz, 15W
Intel® Processor N200, Quad Core, 6M Cache, 3.7GHz, 6W
Intel® Atom® x7213E Processor, Dual Core, 6M Cache, 3.2GHz, 10W
Intel® Processor N50, Dual Core, 6M Cache, 3.4GHz, 6W
Memory
One 262-pin SODIMM up to 16GB
Single Channel DDR5 4800MHz
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® UHD Graphics
Feature
OpenGL 4.6, Direct X 12.1, OpenCL 3.0
HW Decode: HEVC, VP9, AV1, AVC
HW Encode: HEVC, VP9, AVC
Display
1 x DP++/ VGA (Co-layout)
1 x DP++/ HDMI2.0 (Co-layout)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
HDMI: resolution up to 3840×2160 @ 24Hz
DP++: resolution up to 3840×2160 @ 60Hz
VGA: resolution up to 2048×1536 @ 60Hz
USB-C: resolution up to 3840×2160 @24Hz
Triple Displays
DP++/VGA + HDMI/DP++ + USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W) + M2A-Display (optional)
Expansion
Interface
1 x PCIe x4 (PCIe signal x2)
1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1 or SATA3 and USB2.0 wi USB3(opt.))
1 x M.2 2230 E Key (PCIE Gen3x1 and USB2.0, support Intel® CNVi)
1 x M.2 3060 A Key support DFI M2A-display module (opt. MOQ required)
1 x Nano SIM socket (connected to M.2 B key)
Audio
Audio Codec
Realtek ALC888S
Ethernet
Controller
2 x Intel® I226V (10/100/1000/2500Mbps)
Rear I/O
Ethernet
2 x 2.5GHz RJ45
USB
4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB 2.0 or 3 x USB 3.2 Gen2 + 1 x USB Type C
Display
1 x HDMI /DP++ (opt., MOQ may required)
1 x DP++ /VGA (opt., MOQ may required)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
Audio
1 x Line-out
Internal I/O
Serial
2 x RS-232/422/485 (RS-232 w/ power) (2.0mm pitch)
4 x RS-232 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch) or 1 x USB 2.0 (2.00mm pitch) + 1 x Vertical USB 2.0 (type A) (opt., MOQ required)
Audio
1 x S/PDIF
1 x Line-in/Mic-in
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
dTPM (default)
fTPM (option)
Power
Type
Single 12VDC (+/-5%) (ADN171) (DC-In jack by default)
Wide Range 9~36V (ADN173) (4P vertical type by default)
Connector
DC-in Jack
Right Angle Connector (4-pin)
Vertical Type Connector (4-pin)
Consumption
Idle: x7213E 10W: 12V @ 0.62A (7.44W)
Max: x7213E 10W: 12V @ 2.31A (27.72W)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows IoT Enterprise 10 LTSB
Linux
Linux
Environment
Temperature
Operating: -5 to 65°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
MTBF 478,716 hrs @ 25°C; 297,120 hrs @ 45°C; 197,152 hrs @ 60°C; 148,106 hrs @ 70°C;
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7″) x 170mm (6.7″)
Height
PCB: 1.6mm
Top Side: 20mm
Bottom Side: 3mm
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 ADN171/ADN173 motherboard
1 COM port cable (Length: 250mm, 1 x COM ports)
1 Serial ATA data & power cable w/lock (Length: 300mm)
1 Heat sink
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
ADN171-CB-x7213E 770-ADN1711-000G Intel® Atom® x7213E, 1 DDR5, Rear I/O(1 DP++, 1 VGA, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
ADN171-CB-N200 770-ADN1711-100G Intel® Processor N200, 1 DDR5, Rear I/O(1 DP++, 1 HDMI, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
ADN171-CB-N50 770-ADN1711-200G Intel® Processor N50, 1 DDR5, Rear I/O(2 DP++, 2 LAN, 3 USB 3.2 Gen2, 1 USB 2.0), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
ADN173-CB-x7213E 770-ADN1731-000G Intel® Atom® x7213E, 1 DDR5, Rear I/O(1 DP++, 1 HDMI, 2 LAN, 3 USB 3.2 Gen2, 1 USB 2.0), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 9~36V DC, Fanless, -5 to 65°C
ADN173-CB-N50 770-ADN1731-100G Intel® Processor N50, 1 DDR5, Rear I/O(2 DP++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 9~36V DC, Fanless, -5 to 65°C

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