DFI ADN171/ADN173 Alder Lake-N Processors Mini-ITX SBC

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  • Product Name: DFI ADN171/ADN173
  • Motherboard Form Factor: Mini-ITX SBC
  • CPU: Intel® Atom® Alder Lake-N Processors
  • RAM: 1 DDR5 4800MHz SO-DIMM, up to 16GB
  • Expansion: 1 M.2 A Key, 1 M.2 B Key, 1 M.2 E Key
  • Other features: 4K High Resolution Support, Triple Display Capability, Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0, Longevity Support: Typically supports a 10-Year CPU Life Cycle Until Q1’ 33.
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Description

Introducing the DFI ADN171/ADN173 Mini-ITX SBC motherboard, powered by Intel® Atom® Alder Lake-N Processors. Designed for compact systems, it boasts 1 DDR5 4800MHz SO-DIMM slot, accommodating up to 16GB of RAM for efficient multitasking. With multiple expansion slots including 1 M.2 A Key, 1 M.2 B Key, and 1 M.2 E Key, you can customize your setup to suit your needs. Enjoy stunning 4K resolution with triple display capability, and stay connected with rich I/O connectivity featuring 2 2.5GbE LAN ports, up to 4 USB 3.2 ports, 1 USB Type C port, 2 SATA3 ports, and 2 USB2.0 ports. Plus, with a 10-Year CPU Life Cycle until Q1’33, you can count on long-lasting performance.

Key Features

  • Intel® Atom® Alder Lake-N Processors
  • 1 DDR5 4800MHz SO-DIMM update 16GB
  • 4K High Resolution: Supports 4K/ 2K resolution
  • Triple Display: DP++/VGA + HDMI/DP++ + USB-Type C + *M2A-Display (optional)
  • Rich I/O Connectivity: 2 2.5GbE LAN, up to 4 USB 3.2, 1 USB Type C, 2 SATA3, 2 USB2.0
  • Multiple Expansion: 1 M.2 A Key, 1 M.2 B Key, 1 M.2 E Key
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 33 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.

Specification

System
Processor
Intel® Atom® Alder Lake-N Processors, TDP up to 15W
Intel® Core i3-N305 Processor, 8 Core, 6M Cache, 3.8GHz, 15W
Intel® Processor N200, Quad Core, 6M Cache, 3.7GHz, 6W
Intel® Atom® x7213E Processor, Dual Core, 6M Cache, 3.2GHz, 10W
Intel® Processor N50, Dual Core, 6M Cache, 3.4GHz, 6W
Memory
One 262-pin SODIMM up to 16GB
Single Channel DDR5 4800MHz
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® UHD Graphics
Feature
OpenGL 4.6, Direct X 12.1, OpenCL 3.0
HW Decode: HEVC, VP9, AV1, AVC
HW Encode: HEVC, VP9, AVC
Display
1 x DP++/ VGA (Co-layout)
1 x DP++/ HDMI2.0 (Co-layout)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
HDMI: resolution up to 3840×2160 @ 24Hz
DP++: resolution up to 3840×2160 @ 60Hz
VGA: resolution up to 2048×1536 @ 60Hz
USB-C: resolution up to 3840×2160 @24Hz
Triple Displays
DP++/VGA + HDMI/DP++ + USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W) + M2A-Display (optional)
Expansion
Interface
1 x PCIe x4 (PCIe signal x2)
1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1 or SATA3 and USB2.0 wi USB3(opt.))
1 x M.2 2230 E Key (PCIE Gen3x1 and USB2.0, support Intel® CNVi)
1 x M.2 3060 A Key support DFI M2A-display module (opt. MOQ required)
1 x Nano SIM socket (connected to M.2 B key)
Audio
Audio Codec
Realtek ALC888S
Ethernet
Controller
2 x Intel® I226V (10/100/1000/2500Mbps)
Rear I/O
Ethernet
2 x 2.5GHz RJ45
USB
4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB 2.0 or 3 x USB 3.2 Gen2 + 1 x USB Type C
Display
1 x HDMI /DP++ (opt., MOQ may required)
1 x DP++ /VGA (opt., MOQ may required)
1 x USB Type C (DP alt-mode/USB3.2 Gen2/PD 15W)
Audio
1 x Line-out
Internal I/O
Serial
2 x RS-232/422/485 (RS-232 w/ power) (2.0mm pitch)
4 x RS-232 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch) or 1 x USB 2.0 (2.00mm pitch) + 1 x Vertical USB 2.0 (type A) (opt., MOQ required)
Audio
1 x S/PDIF
1 x Line-in/Mic-in
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
dTPM (default)
fTPM (option)
Power
Type
Single 12VDC (+/-5%) (ADN171) (DC-In jack by default)
Wide Range 9~36V (ADN173) (4P vertical type by default)
Connector
DC-in Jack
Right Angle Connector (4-pin)
Vertical Type Connector (4-pin)
Consumption
Idle: x7213E 10W: 12V @ 0.62A (7.44W)
Max: x7213E 10W: 12V @ 2.31A (27.72W)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows IoT Enterprise 10 LTSB
Linux
Linux
Environment
Temperature
Operating: -5 to 65°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
MTBF 478,716 hrs @ 25°C; 297,120 hrs @ 45°C; 197,152 hrs @ 60°C; 148,106 hrs @ 70°C;
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7″) x 170mm (6.7″)
Height
PCB: 1.6mm
Top Side: 20mm
Bottom Side: 3mm
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 ADN171/ADN173 motherboard
1 COM port cable (Length: 250mm, 1 x COM ports)
1 Serial ATA data & power cable w/lock (Length: 300mm)
1 Heat sink
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
ADN171-CB-x7213E 770-ADN1711-000G Intel® Atom® x7213E, 1 DDR5, Rear I/O(1 DP++, 1 VGA, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
ADN171-CB-N200 770-ADN1711-100G Intel® Processor N200, 1 DDR5, Rear I/O(1 DP++, 1 HDMI, 2 LAN, 4 USB 3.2 Gen2), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
ADN171-CB-N50 770-ADN1711-200G Intel® Processor N50, 1 DDR5, Rear I/O(2 DP++, 2 LAN, 3 USB 3.2 Gen2, 1 USB 2.0), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 12V DC, Fanless, -5 to 65°C
ADN173-CB-x7213E 770-ADN1731-000G Intel® Atom® x7213E, 1 DDR5, Rear I/O(1 DP++, 1 HDMI, 2 LAN, 3 USB 3.2 Gen2, 1 USB 2.0), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 9~36V DC, Fanless, -5 to 65°C
ADN173-CB-N50 770-ADN1731-100G Intel® Processor N50, 1 DDR5, Rear I/O(2 DP++, 2 LAN, 3 USB 3.2 Gen2, 1 USB Type C), Internal I/O (4 RS-232, 2 RS-232/422/485, 2 USB 2.0), 9~36V DC, Fanless, -5 to 65°C

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

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Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

Motherboard

  • Form Factor : Mini-ITX

CPU

  • Powered By : Intel
  • CPU Family : Atom
  • CPU Generation : Alder Lake
  • CPU Model : i3-N305, N200, N50, x7213E

Memory

  • Memory Installed :
  • Memory Slots : 1
  • Memory Type : 4800Mhz DDR5

I/O and Expansion

  • Expansion Slots : M.2, PCIe, SATA
  • LAN Ports : 2
  • Serial Ports : 6
  • USB 2 Ports : 2
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 Ports :
  • Video Output : DisplayPort, HDMI, USB-C
  • Multi Display : Triple Display

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Features

  • 5G-4G-GPS :
  • Artificial Intelligence Use :
  • IP Rating :
  • Rugged : Yes
  • System Type : SBC
  • Wide Temp : Yes

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