Name: DFI DT200-CS High Performance MXM Embedded System
SKU: DT200-CS
Availability: InStock

DFI DT200-CS High Performance MXM Embedded System

Product Name: DFI DT200-CS
System Type: High Performance MXM Embedded System
CPU: 8th/9th Generation Intel Core Processors
RAM: DDR4 2400/2666MHz up to 64GB
Expansion: Support M.2 B key 3052 5G cellular module
Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

SKU: DT200-CS Category: ALL INDUSTRIAL AND EMBEDDED COMPUTERS Tags: 5G, Intel Coffee Lake, Multi Display - Quad, MXM, OS: Linux, OS: Windows, Powered by Intel, Rugged, TPM 2.0, Wide Temp Brand: DFI

Description

Introducing the DT200-CS, a robust PC specifically built for industrial use, equipped with advanced features like 5G connectivity and an MXM-module. It harnesses the processing power of 8th/9th generation Intel Processors. The DT200-CS is meticulously crafted to excel in AI Vision applications, including automated optical inspection (AOI) and vision-guided robotics within factory environments. Moreover, it offers exceptional performance in high-resolution diagnostic imaging for medical purposes and traffic flow analysis in transportation, among other diverse applications.

Features

8th/9th Generation Intel Core Processors
Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection)
AI accelerated: up to 110W GPU MXM module supported
Support M.2 B key 3052 5G cellar module
Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM
15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

Specification

System

Processor

Intel® Core i7-9700E Processor (Core 8; Max speed 4.4 GHz; TDP 65W)

Intel® Core i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP 35W)

Intel® Core i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP 65W)

Intel® Core i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP 35W)

Intel® Core i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP 65W)

Intel® Core i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP 35W)

8th Generation Intel® Core™ Processors, LGA 1151 Socket, TDP up to 65W

Intel® Core™ i7-8700 Processor (Core 6; Max speed 4.6 GHz; TDP 65W)

Intel® Core™ i7-8700T Processor (Core 6; Max speed 4.0 GHz; TDP 35W)

Intel® Core™ i5-8500 Processor (Core 6; Max speed 4.1 GHz; TDP 65W)

Intel® Core™ i5-8500T Processor (Core 6; Max speed 3.5 GHz; TDP 35W)

Intel® Core™ i3-8100 Processor (Core 4; Max speed 3.6 GHz; TDP 65W)

Intel® Core™ i3-8100T Processor (Core 4; Max speed 3.1 GHz; TDP 35W)

Intel® Pentium® G5400 Processor (Core 2; Max speed 3.7 GHz; TDP 58W)

Intel® Celeron® G4900 Processor (Core 2; Max speed 3.1 GHz; TDP 54W)

Chipset

Intel® H310/Q370 Chipset

Memory

DDR4 2400/2666MHz up to 64GB

BIOS

AMI SPI 128Mbit (supports UEFI/Legacy mode)

Graphics

Controller

Intel® UHD Graphics 630 (Pentium® G5400 and Celeron® G4900 support Intel® UHD Graphics 610)

Feature

OpenGL 4.5, DirectX 12, OpenCL 2.1

HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9

HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9

Display

4 x DP (from MXM)

1 x DP++/HDMI (auto-detection)

DP: resolution up to 4096×2304@60Hz

HDMI: resolution up to 4096×2160@30Hz

AI Accelerator

Interface

1 x MXM 3.1 slot, Type-A/B up to 110W

Storage

External

1 x SATA III connector with 1 x 2.5” SSD tray

(if selecting I.O expansion with 6 USB 2.0, there is only 1 x SSD tray)

Internal

1 x M.2 M key supports 2242/2280 slot (PCIe Gen3 x4/SATA)

Expansion

Interface

1 x M.2 M key supports 2242/2280 slot (PCIe Gen3 x4/SATA)

1 x M.2 B key supports 3052 slot (PCIe x1/USB3.1 Gen1)

1 x M.2 E key supports 2230 slot (PCIe x1/USB2.0)

Audio

Audio Codec

5.1 CH Audio Codec:Realtek ALC888S-VD2-GR

Ethernet

Controller

1 x Intel® I219LM/ I219V

3 x Intel® I211AT

LED

Indicators

1 x PWD LED

1 x HDD LED

Front I/O

Serial

2 x RS232

USB

6 x USB2.0

Audio

1 x Line-out

1 x Mic-in

Buttons

1 x Power button

Rear I/O

Ethernet

4 x GbE

USB

4 x USB 3.1 Gen2

Display

1 x DP++/HDMI (auto-detection)

4 x DP (from MXM)

Antenna

4 x SMA for 5G module

2 x SMA for WiFi module

Cooling

Fan

Active fan: 65W CPU cooler + 110W GPU

Watchdog Timer

Output & Interval

Watchdog timeout programmable via software from 1 to 255 seconds

Security

TPM

dTPM2.0 (default)

Power

Type

19V DC-in (mini-DIN)

OS Support

Microsoft

Windows 10 IoT Enterprise 64-bit

Linux

Linux

Environment

Operating Temperature

-20 to 55°C

Storage Temperature

0 to 86°C

Relative Humidity

5 to 95% RH (non-condensing)uminum extrusion + Metal

Mechanism

Construction

Aluminum + SGCC

Mounting

Wall mount (mounting brackets and screws)

Dimensions (W x H x D)

320 x 220 x 87mm (not include wall mount bracket)

Weight

TBD

Standards and Certifications

Certifications

CE, FCC Class A, RoHS

Country of Origin

Taiwan

DFI 8th/9th Gen Coffee Lake

Datasheet

Download(826 KB)

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test

Click here to find out more.

DFI DT200-CS High Performance MXM Embedded System