Description
Introducing the DFI EC70A-HPT is a fanless embedded system powered by the AMD Ryzen 8000 series processor, designed for high-performance industrial and edge computing applications. Its compact, rugged design ensures reliable operation in demanding environments while supporting advanced connectivity and expandability. The system supports up to 128GB of DDR5-5600 ECC memory across two SO-DIMM slots, delivering exceptional multitasking and computational performance. Expansion options include M.2 B Key 3042/3052 slots for 5G-NR modules, micro SD, and Nano SIM, making it ideal for IoT, AI, and industrial automation solutions.
Featuring dual-display support via HDMI (4K@30Hz) and DP++ (4K@60Hz) and a rich I/O portfolio—including 2 LAN ports, 2 USB 3.2 Gen2 ports, 1 USB 2.0 port, 1 USB Type-C, and 4 COM ports—the EC70A-HPT integrates seamlessly into complex industrial networks. Remote management capabilities such as OOB power on/off and BIOS updates further enhance operational flexibility. Compact, fanless, and highly reliable, the DFI EC70A-HPT is an ideal choice for industrial, embedded, and edge computing applications that demand performance, durability, and connectivity.
Key Features
- AMD Ryzen 8000 series
- Dual Displays HDMI (4K@30Hz) + DP++ (4K@60Hz)
- Up to 2 SO-DIMM sockets for DDR5-5600 memory modules up to 128GB, ECC support
- Support M.2 B key 3042/3052 5G-NR module
- Support OOB : remote Power on/off & reset, BIOS update…etc.
- Rich I/O: 2 LAN, 2 USB 3.2 Gen2, 1 USB 2.0, 1 USB Type-C, 4 COM, 1 micro SD, 1 DC input, 1 Nano SIM
Specification
| Category | Specification |
| System | DFI EC70A-HPT Fanless Embedded System |
| Processor | AMD Ryzen™ 7 8840U (max 5.1 GHz) |
| AMD Ryzen™ 5 8640U (max 5.1 GHz) | |
| Memory | Up to 2 SO-DIMM DDR5-5600 modules, up to 128GB, ECC support |
| BIOS | AMI SPI 256Mbit |
| Graphics Controller | AMD Radeon™ 780M (R7) / AMD Radeon™ 760M (R5) |
| Graphics Features | DirectX 12, OpenGL 4.6, Vulkan 1.2 |
| HW Decode: AV1, AVC/H.264, MJPEG, HEVC/H.265, VP9, SCC | |
| HW Encode: MJPEG, AVC/H.264, HEVC/H.265, VP9, SCC | |
| Display | 1 x HDMI, 1 x DP++ |
| HDMI: up to 4096×2160@30Hz | |
| DP: up to 4096×2304@60Hz | |
| Multiple Displays: HDMI + DP++ + 1 Type-C DP Alt. Mode | |
| AI Accelerator | AMD Ryzen™ AI, 16 TOPS |
| Expansion Interface | 1 x M.2 M Key 2280 (PCIe x4) |
| 1 x M.2 B Key 3042/3052 (USB 3.0/USB 2.0/PCIe x1/SATA), 1 x Nano SIM slot | |
| 1 x M.2 E Key 2230 (PCIe/USB 2.0/CNVi) | |
| Ethernet Controller | 2 x Intel® I225IT (10/100/1000/2500 Mbps) |
| 1 x Intel® I210IT (10/100/1000 Mbps, supports OOB, iAMT on Core i7/i5) | |
| LED Indicators | 1 x Status LED (Green), 1 x HDD LED (Blue) |
| Front I/O Ethernet | 2 x LAN |
| Front I/O USB | 2 x USB 3.2 Gen2, 1 x USB 2.0, 1 x USB Type-C |
| Front I/O Display | 1 x DP++, 1 x HDMI, 1 x Type-C DP Alt. Mode |
| Buttons | 1 x Power button, 1 x Reset button |
| Power Input | 1 x DC input, 60W (12V/5A) |
| SIM | 1 x Nano SIM slot |
| Rear I/O Ethernet | 1 x LAN |
| Rear I/O Serial | 4 x COM |
| Storage | 1 x micro SD socket |
| Watchdog Timer | System Reset, programmable 1–255 seconds via software |
| Security (TPM) | TPM 2.0 |
| OS Support | Windows 11 IoT Enterprise LTSC 2024 |
| Linux (UEFI only) | |
| Operating Temperature | Fanless (15W CPU, 0.7 m/s airflow): -20~60°C |
| With Fan (28W CPU): -20~70°C | |
| Storage Temperature | -40 to 85°C |
| Relative Humidity | 5–95% RH (non-condensing) |
| Construction | Aluminum + Metal Aluminum |
| Mounting | Wall / VESA / DIN rail mount |
| Dimensions (W x H x D) | 181.6 mm x 57 mm x 118.4 mm |
| Weight | 1.2 Kg |
| Shock | Half sine wave 3G, 11ms, 3 shock per axis |
| Vibration | IEC 60068-2-64 |
| Random: 1Grms @ 5–500 Hz (with M.2 SSD) | |
| Certifications | CE, FCC Class A, RoHS, UKCA |
| Packing List | 1 x EC70A-HPT system unit |
| 3 x M.2 slot screws | |
| 4 x Foot screws & Rubber Feet | |
| 1 x Grounding screw | |
| 1 x Remote switch cable | |
| Country of Origin | Taiwan |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
