ASRock Industrial iEPF-10000S 13th/14th Gen Edge AIoT Platform

  • Product Name: ASRock iEPF-10000S
  • System Type: Expandable Edge AIoT Platform
  • CPU: Intel 14th/13th Core Processor, up to 125W
  • RAM: 4 x 288-pin Long-DIMM DDR5, up to 192GB (48GB per DIMM)
  • Expansion: PNY GEFORCE RTX 4090 or ASRock Intel Arc A770 Challenger
  • Other Features: ATX Power Supply 850W or 1000W, compliant with ATX12V V3.0 & EPS12V V2.92
Clear
Product Compare

Description

The ASRock iEPF-10000S is a robust Edge AIoT platform designed to meet the demanding requirements of industrial and IoT applications. Powered by Intel’s 14th or 13th Generation Core processors, capable of handling up to 125W, this platform offers exceptional computing power for edge computing tasks. It supports up to 192GB of DDR5 RAM across four 288-pin Long-DIMM slots, ensuring ample memory for data-intensive operations and AI processing.

Equipped with expandability in mind, the iEPF-10000S features options for graphics expansion, including the powerful PNY GEFORCE RTX® 4090 24GB or the ASRock Intel Arc A770 Challenger 16GB OC, leveraging NVIDIA’s advanced Ada Lovelace architecture and Intel’s Xe HPG microarchitecture for enhanced graphical performance.

The platform is complemented by a robust ATX power supply option (850W or 1000W), adhering to ATX12V V3.0 and EPS12V V2.92 standards, ensuring reliable and efficient power delivery. Ideal for applications requiring high-performance edge computing capabilities, the ASRock iEPF-10000S is a versatile solution designed to excel in diverse industrial and AIoT environments.

Key Features

  • ASRock Industrial ATX Industrial Motherboard IMB-1714 or IMB-X1714 inside
  • Intel 14th/13th Core Processor, up to 125W
  • 4 x 288-pin Long-DIMM DDR5, up to 192GB (48GB per DIMM)
  • PNY GEFORCE RTX 4090 24GB option. NVIDIA Ada Lovelace Streaming Multiprocessors, 4th Generation Tensor Cores, and 3rd Generation RT Cores
  • ASRock Intel Arc A770 Challenger 16GB OC option. Intel Xe HPG Microarchitecture and Intel Xe Super Sampling (XeSS) support
  • ATX Power Supply 850W or 1000W option, Complies with ATX12V V3.0 & EPS12V V2.92

Specification

Processor System
CPU Intel® 14th/13th Core™ Processor, up to 125W.
(Default Intel® Core™ i9-13900 Processor)
Chipset Intel® Q670 (IMB-1714) or Intel® W680 (IMB-X1714).
Default is IMB-1714.
Socket LGA1700
BIOS AMI SPI 256 Mbit
Discrete Graphic Card Option
PNY GEFORCE RTX® 4090 24GB NVIDIA® CUDA Cores 16384
Clock Speed 2235 MHz
Boost Speed 2520 MHz
Memory Speed 21 Gbps
Memory Size 24GB GDDR6X
Memory Interface 384-bit
Memory Bandwidth 1008 Gbps
Outputs DisplayPort 1.4 (x3), HDMI 2.1
Multi-Screen 4
Resolution 7680 x 4320 @120Hz (Digital)
Bus Type PCI-Express 4.0 x16
ASRock Intel Arc A770 Challenger 16GB OC (A770 CL 16GO) Intel® XMX Engines 512
Engine Clock 2150 MHz
Memory 16GB GDDR6
Memory Clock 17.5 Gbps
Memory Interface 256-bit
Outputs 3x DisplayPort 2.0 up to UHBR 10*, HDMI 2.1
*Designed for DP 2.0, certification pending VESA CTS Release.
Multi-Screen 4
Resolution 7680 x 4320(Digital)
Bus Type PCI-Express 4.0 x16
CPU Graphics
Controller Intel® UHD Graphics
HDMI HDMI 2.0b
Max resolution up to 4096×2160@60Hz
DisplayPort DisplayPort 1.4a, DP++
Max resolution up to 4096×2160@60Hz
VGA Max resolution up to 1920 x 1200@60Hz
MultiDisplay Triple Display
MB Expansion Slot
PCIe 2 x PCIe Gen5 Slots (PCIE1/PCIE4:single at x16(PCIE1);
dual at x8 (PCIE1) / x8 (PCIE4)) (PCIE1: Support Riser card x8/x8),
2 x PCIe x4 (Gen4), 3 x PCIe x1 (Gen3)
M.2 1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless
1 x M.2 (Key B, 3042/3052) with PCIe x1, USB3.2 Gen1, USB 2.0
and SIM for 4G/5G
SIM Socket 1 x SIM socket connected to M.2 Key B
MB Rear I/O
HDMI 1 x HDMI 2.0b
DisplayPort 1 x DP 1.4a++
VGA 1
Ethernet 3 x 2.5 Gigabit LAN
USB 5 x USB 3.2 Gen2
1 x USB 3.2 Gen2x2 (Type-C, 5V/3A)
Audio 3 (Mic-in, Line-in, Line-out)
COM COM1, COM2 (RS-232/422/485)
MB Internal Connector
USB 2 x USB 3.2 Gen1 (Chassis front side), 2 x USB 2.0 Type-A internal vertical connector), 2 x USB 2.0 (1 x 2.54 pitch header
COM COM3, COM4, COM5, COM6 (RS-232)
Parallel 1
GPIO 8 x GPI, 8 x GPO (shared with LPT header)
PS2 1 x PS2 header
Thunderbolt header 1
Memory
Technology DDR5 4400 MHz (2DPC – 1DIMM), DDR5 4000 MHz
(2DPC – 2DIMM 1R), DDR5 3600 MHz (2DPC – 2DIMM 2R),
ECC feature only supported by IMB-X1714.
Capacity 192GB (48GB per DIMM)
Socket 4 x 288-pin Long-DIMM
Audio
Interface Realtek ALC897, High Definition Audio. Line-in, Line-out, Mic-in
(Rear Side)
Ethernet
Controller/ Speed LAN1: Intel® I226V with 10/100/1000/2500 Mbps, supports PoE (IEEE 802.3at).
LAN2: Intel® I226LM with 10/100/1000/2500 Mbps, supports vPro
LAN3: Intel® I226V with 10/100/1000/2500 Mbps
Connector 3 x RJ-45
Security
TPM TPM 2.0 onboard IC
Storage
M.2 1 x M.2 2280 (Key M) PCIe Gen4 x4 SSD (Default 2TB)
1 x M.2 2280 (Key M) PCIe Gen3 x4 SSD (IMB-X1714 only)
SATA 2.5″/3.5″ HDD bays x 5
RAID Intel® VMD RAID 0/1/5/10
**supported by identical interface (PCIe or SATA)
PCIe interface: M.2 Key B + M.2 Key M x1 or x2(IMB-X1714 only)
SATA interface: SATA port
Power Requirements
Power Supply Unit Rated Output Power 850W(Default), Input Voltage 100-240V,
Input Current 11-5.5A, Input Frequency 50-60Hz
Rated Output Power 1000W, Input Voltage 100-240V,
Input Current 12-6A, Input Frequency 50-60Hz
Power On AT/ATX Supporte
– AT : Directly PWR on as power input ready
– ATX : Press button to PWR on after power input ready
Mechanical
Dimensions 597mm (D) x 206mm (W) x 455.1mm (H)

Ordering Information

Model Name Part Number Description
iEPF-10000S-FS2/AI 90PXGA10-10011000 Intel i9-13900
IMB-1714
NON-Wide Temperature DDR5 UDIMM 32GB 288P x4
NON-Wide Temperature M.2 2280 M Key PCIE4.0x4 SSD 2TB x1
850W PSU, WO/Power Cord
PNY GEFORCE RTX® 4090 24GB
iEPF-10000S-FS4/AI 90PXGA10-10220120 Intel i5-14500
IMB-1714
NON-Wide Temperature DDR5 UDIMM 32GB 288P x2
NON-Wide Temperature M.2 2280 M Key PCIE4.0x4 SSD 1TB x1
850W PSU, W/UK Power Cord
ASRock Intel Arc A770 Challenger 16GB OC (A770 CL 16GO)

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

Manufacturer : Asrock

CPU

  • Powered By : Intel
  • CPU Family : iCore
  • CPU Generation : Raptor Lake
  • CPU Model : i3 Support, i5 Support, i7 Support, i9 Support

Memory

  • Memory Installed :
  • Memory Slots : 4
  • Memory Type : 4400Mhz DDR5

I/O and Expansion

  • Expansion Slots : M.2, PCIe, SATA
  • LAN Ports : 3
  • Serial Ports : 4
  • USB 2 Ports :
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 : 6
  • Video Output : DisplayPort, HDMI
  • Multi Display : Triple Display

Operating System

  • OS : Windows

Certifications

  • Certifications :

Features

  • 5G-4G-GPS :
  • Artificial Intelligence Use : Edge Computing, Machine Learning, Machine Vision
  • IP Rating :
  • Rugged :
  • System Type : Box PC
  • Wide Temp :

Categories : , ,